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A method to improve the performance of mg/ti junction interface

A technology for connecting interfaces and properties, applied in chemical instruments and methods, layered products, metal rolling, etc., can solve problems affecting the bonding strength and mechanical properties of plates, and achieve the goal of improving casting defects, improving strength and toughness, and improving performance Effect

Active Publication Date: 2021-04-27
TAIYUAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The technical problem to be solved by the present invention is to use silicon carbide particles to strengthen the aluminum matrix composite (SiCp / AMCs ) as the interfacial bonding layer, using silicon carbide particles (SiCp) to control the Ti / Al and Al / Mg interfacial intermetallic compounds to prepare Ti / Al / Mg layered composites with fine and uniform intermetallic compound layers Material

Method used

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  • A method to improve the performance of mg/ti junction interface
  • A method to improve the performance of mg/ti junction interface

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Experimental program
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Effect test

specific Embodiment approach 2

[0039] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the volume fraction of spherical SiCp described in step 1 is 5%, and the others are the same as Embodiment 1.

specific Embodiment approach 3

[0040] Embodiment 3: The difference between this embodiment and Embodiment 1 is that the volume fraction of spherical SiCp described in step 1 is 15%, and the others are the same as Embodiment 1.

specific Embodiment approach 4

[0041] Embodiment 4: The difference between this embodiment and Embodiment 1 is that the rolling temperature in step 2 is 400° C., and the others are the same as Embodiment 1.

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Abstract

The invention discloses a method for improving the interface of the Mg / Ti layer by introducing a SiCp reinforcing phase by designing the middle layer of the composite material, and relates to a "titanium / aluminum matrix composite material / magnesium / aluminum matrix composite material" which improves the performance of the Mg / Ti interface. Materials / Titanium" layered material preparation method. In this method, the SiCp reinforced aluminum matrix composite material with uniform particle distribution is prepared by semi-solid stirring casting method, and then hot rolled to obtain the aluminum matrix composite material component plate, and then the "titanium / aluminum matrix composite material / magnesium / Aluminum Matrix Composites / Titanium” stacked laminates in sequence were hot-pressed and annealed. The invention adopts the hot pressing method with simple process, low cost and stable and controllable plate quality. On the one hand, it produces dispersion strengthening and fine grain strengthening effects on the metal of the component layer, so that the deformation between titanium and aluminum is more coordinated; The strength and toughness of the interface area can significantly improve the comprehensive performance of the composite board.

Description

technical field [0001] The invention belongs to the technical field of light alloy processing and forming, and in particular relates to a preparation method of a "titanium / aluminum matrix composite material / magnesium / aluminum matrix composite material / titanium" layered material which improves the Mg / Ti interface performance. Background technique [0002] In engineering applications, magnesium and magnesium alloys have disadvantages such as low strength, low stiffness, poor corrosion resistance, and poor room temperature plasticity, especially poor corrosion resistance and low stiffness, which limit their wide application. Considering that titanium and titanium alloys have Excellent high temperature resistance, corrosion resistance, high strength and rigidity, can form complementary advantages with magnesium and magnesium alloys. However, the huge performance difference between magnesium and titanium makes it difficult to combine them, and the method of covering both sides of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21C37/02B21B1/38B32B37/06B32B37/10C22C1/10C22C21/00C22C32/00B22D17/00
CPCB21C37/02B21B1/38B32B37/06B32B37/10C22C1/1036C22C21/00C22C32/0063B22D17/007B21B2001/386C22C1/1047
Inventor 邓坤坤曹苗王翠菊史权新聂凯波梁伟
Owner TAIYUAN UNIV OF TECH