Aluminum silicon carbide packaging substrate and preparation method thereof

A silicon carbide sealing, silicon carbide ceramic-based technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc. The effect of not easy to slip teeth, not easy to crack and fall off

Inactive Publication Date: 2019-09-24
西安明科微电子材料有限公司
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims at the problem that existing AlSiC packaging substrates have mounting holes that are difficult to process or that the mounting holes have insufficient reliability, such as easy sliding or falling off, and provides an AlSiC packaging that is easy to process and produce and has high reliability of the mounting holes. The substrate, as well as the preparation method of the aluminum silicon carbide packaging substrate, can easily realize any pattern such as through holes, blind holes, countersink holes, stepped holes, and silk holes at any position on the aluminum silicon carbide packaging substrate according to the design requirements. Processing of mounting holes

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Aluminum silicon carbide packaging substrate and preparation method thereof
  • Aluminum silicon carbide packaging substrate and preparation method thereof
  • Aluminum silicon carbide packaging substrate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] This embodiment provides an aluminum silicon carbide packaging substrate and a method for preparing the aluminum silicon carbide packaging substrate.

[0055] Such as figure 1 As shown, the aluminum silicon carbide packaging substrate of this embodiment includes an aluminum silicon carbide substrate with a hole position and an aluminum silicon material filled column embedded in the hole position, and each aluminum silicon material filled column is provided with a mounting hole, figure 1 The mounting holes shown in include four types of mounting holes: round, square, regular hexagon and regular octagon. In other embodiments, the outline shape of the aluminum silicon carbide package substrate and the shape, size and quantity of the mounting holes on it can be set according to the actual needs of the product. For example, the mounting holes can also be other regular polygons or irregular polygons. Step hole, countersunk hole or wire hole, etc., figure 1 It is only in a schemat...

Embodiment 2

[0073] This embodiment provides an aluminum silicon carbide packaging substrate with the same structure and mounting hole design as the aluminum silicon carbide packaging substrate described in Example 1. The preparation method of the aluminum silicon carbide packaging substrate of this embodiment is basically the same as the preparation method of the embodiment. The same, the difference is that in step 1, step 1 of this embodiment is: the four silicon carbide powder materials with particle diameters of 0.5-1μm, 20-25μm, 50-60μm, and 80-90μm are in turn according to the following mass percentages 10%, 10%, 20%, 60% are mixed uniformly to obtain powder M1.

Embodiment 3

[0075] This embodiment provides an aluminum silicon carbide packaging substrate with the same structure and mounting hole design as the aluminum silicon carbide packaging substrate described in Example 1. The preparation method of the aluminum silicon carbide packaging substrate of this embodiment is basically the same as the preparation method of the embodiment. The same, the difference is that in step 3, step 3 of this embodiment is: the four kinds of silicon powders with particle diameters of 4-6μm, 20-25μm, 50-60μm, 80-90μm are successively adjusted to the following mass percentages of 20% , 45%, 15%, and 20% are mixed uniformly to obtain powder M3.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
flexural strengthaaaaaaaaaa
Login to view more

Abstract

The invention relates to the technical field of packaging substrates, and specifically relates to an aluminum silicon carbide packaging substrate and a preparation method thereof. The preparation method comprises the steps of firstly preparing and forming a silicon carbide ceramic substrate with hole positions and a silicon wafer matched with the hole positions, then inlaying the silicon wafer in the hole positions to form an integral ceramic substrate, and aluminizing the integral ceramic substrate to form an aluminum silicon carbide substrate with aluminum silicon carbide and an aluminum silicon bi-phase material. Installation holes with various shapes and sizes can be easily manufactured by machining on the aluminum silicon material at the hole positions, not only screw holes can be manufactured, and the screw holes are not easy get loosened, thereby solving a problem that the installation holes on the aluminum silicon carbide packaging substrate are difficult to be processed and manufactured. According to the manufacturing method, the aluminum silicon material at the hole positions is firmly combined with the aluminum silicon carbide material and not easy to crack and fall off, thereby enabling the installation holes manufactured on the aluminum silicon material to be high in reliability.

Description

Technical field [0001] The invention relates to the technical field of packaging substrates, in particular to an aluminum silicon carbide packaging substrate and a preparation method of the aluminum silicon carbide packaging substrate. Background technique [0002] Silicon carbide reinforced aluminum-based composite material has the characteristics of high thermal conductivity, adjustable thermal expansion coefficient, high specific strength ratio stiffness, good dimensional stability, etc., and is widely used in IGBT (Insulated Gate Bipolar Transistor, insulated gate bipolar transistor) packaging field , Especially the packaging module using aluminum silicon carbide packaging substrate, not only improves the reliability and stability of the components, but also has light weight and long service life. Therefore, aluminum silicon carbide is the material of choice in harsh environments such as aerospace. However, the biggest disadvantage of aluminum silicon carbide itself is that i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L23/498
CPCH01L21/4846H01L21/486H01L23/49827H01L23/49838H01L23/49872H01L23/49894
Inventor 刘昌涛陈燕
Owner 西安明科微电子材料有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap