Semiconductor bonding packaging method
A packaging method and semiconductor technology, which are applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, and electrical solid-state devices, etc., can solve the problems of filling difficulty, hot-press bonding head sticking, and chip soldering, etc., to improve packaging efficiency, The thickness is easy to control and the effect of improving the yield rate
Active Publication Date: 2021-08-17
SUZHOU TF AMD SEMICON CO LTD
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Problems solved by technology
[0003] First pre-coat the glue 101 on the substrate 100, the glue is easy to adhere between the functional bumps 103 of the chip 102 and the pads 104 of the substrate 100 during the filling process, thereby affecting the welding effect between the chip and the substrate; Glue coating is to solve problems such as difficulty in filling and virtual soldering in the CUF process. However, since the glue needs to flow and fill at the bottom of the chip, it is inevitable that there will be a virtual soldering at the bottom of the chip. In addition, because the thickness of the glue is not easy to control, in During the hot pressing process, the glue is easy to overflow to the back of the chip, which will cause the hot pressing bonding head to be stained; moreover, since the soldering between the functional bumps of the chip and the pads of the substrate is controlled by temperature and pressure, if Uneven bond height and pressure control can cause the solder to be squeezed or squeezed out, resulting in solder bridging and affecting the performance of semiconductor products
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[0027] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. It should also be noted that, for ease of description, only parts related to the invention are shown in the drawings.
[0028] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and embodiments.
[0029] As mentioned in the background technology, the glue is pre-coated on the substrate first, and the glue is easy to adhere between the functional bumps of the chip and the pads of the substrate during the filling process, thereby affecting the welding effect between the chip and the substrate;...
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The present application discloses a semiconductor bonding packaging method, including: providing a substrate, the substrate has a first surface and a second surface opposite to each other, the first surface is provided with a plurality of metal bumps, and the second surface A plurality of solder bumps are arranged on it; a patterned first photoresist layer is formed on the first surface, and the first photoresist layer has a first opening exposing the top of the metal bump; A chip is provided, and the chip is flipped on the first photoresist layer, and the functional bumps of the chip are bonded and connected to the metal bumps of the substrate through a thermocompression bonding method. The first photoresist layer with the first opening can effectively avoid the problem of solder bridging between the functional bumps of the chip and the problem of filling voids at the bottom of the chip. The problem of sticking dirt; effectively improve the yield rate and packaging efficiency.
Description
technical field [0001] The present application generally relates to the technical field of semiconductor manufacturing, and specifically relates to a semiconductor bonding packaging method. Background technique [0002] With the development of electronic products such as mobile phones and notebook computers towards miniaturization, portable, ultra-thin, multimedia and low-cost to meet the needs of the public, high-density, high-performance, high-reliability and low-cost packaging forms and their Assembly technology has been rapidly developed. With the increase in the number of input / output (I / O) pins in the semiconductor package, the bump pitch of the chip is getting smaller and smaller when the chip size is reduced or the chip size is not changed. , the common capillary underfill (CUF) process cannot fill the inside of the chip to protect the electrode pads, so the thermocompression bonding process (TCB) is used to pre-coat the non-conductive adhesive on the substrate, and...
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IPC IPC(8): H01L21/603
CPCH01L24/81H01L2224/81009H01L2224/81051H01L2224/81203
Inventor 陈波陈文渊
Owner SUZHOU TF AMD SEMICON CO LTD