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Rubber composite based on waste printed circuit board non-metal powder and preparation method of rubber composite

A technology of rubber compound and non-metal powder is applied in the field of rubber compound to achieve the effect of good application prospect, low cost and increased equipment cost

Active Publication Date: 2019-10-08
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of rubber composite material has not been reported in the literature at home and abroad so far.

Method used

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  • Rubber composite based on waste printed circuit board non-metal powder and preparation method of rubber composite
  • Rubber composite based on waste printed circuit board non-metal powder and preparation method of rubber composite
  • Rubber composite based on waste printed circuit board non-metal powder and preparation method of rubber composite

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Waste printed circuit board non-metallic powder (WPCBP) was mechanically crushed for 1 hour and ball milled for 3.5 hours, then passed through a 200-mesh sieve. figure 1 is the SEM image of the prepared WPCBP, figure 2 is the particle size distribution graph of WPCBP. It can be seen from the figure that after crushing, ball milling, and sieving, the non-metallic powder of waste printed circuit boards has a relatively uniform particle size, the resin on the surface of the glass fiber is basically stripped off, no large agglomerates exist, and the glass fiber remains A certain aspect ratio. Technicians can adjust the particle size of the non-metallic powder by further prolonging or shortening the time of crushing and ball milling.

Embodiment 2

[0037] Mix 5phr waste printed circuit board non-metallic powder and 30phr white carbon black nanoparticles in Example 1 to obtain mixed filler, then mix 5phr zinc oxide, 2phr stearic acid, 1.5phr anti-aging agent N-isopropyl-N' -Phenyl-p-phenylenediamine (4010NA), mixed filler, 1.6phr sulfur, 2.0phr accelerator N-cyclohexyl-2-benzothiazole sulfenamide (CZ) were added to 100phr styrene-butadiene rubber in sequence, Mix evenly on a double-roller mill, and then vulcanize at 160°C according to the positive vulcanization time measured by the vulcanizer to obtain a styrene-butadiene rubber composite material. The difference (T c90 -T c10 ) is 8.9min, the difference between the highest torque and the lowest torque (M H -M L ) is 14.37dN, the tensile strength is 19.7Mpa, the elongation at break is 763%, and the tear strength is 34.7kN.m -1 .

Embodiment 3

[0039] After the waste printed circuit board non-metallic powder is crushed, pass through a 300-mesh sieve, mix the prepared waste printed circuit board non-metallic powder (10phr) with white carbon black nanoparticles (50phr) to obtain a mixed filler, and then add 5phr zinc oxide , 2phr stearic acid, 1.5phr antioxidant N-isopropyl-N'-phenyl-p-phenylenediamine (4010NA), mixed filler, 1.6phr sulfur, 2.0phr accelerator N-cyclohexyl-2-benzothiazole Sulfenamide (CZ) was added to 100phr styrene-butadiene rubber in sequence, mixed evenly on a double-roll mill, and vulcanized at 160°C to obtain a styrene-butadiene rubber composite material. The tensile strength of the obtained rubber compound was 23.7 MPa, and the elongation at break was 698%.

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Abstract

The invention discloses a rubber composite based on a waste printed circuit board non-metal powder and a preparation method of the rubber composite, and belongs to the field of rubber composites. Themethod utilizes the waste printed circuit board non-metal powder and a common inorganic filler to carry out composite modification on rubber to prepare the rubber composite based on the waste printedcircuit board non-metal powder. The vulcanization rate and mechanical strength of the rubber composite are significantly improved, the current industrial processing technology is not needed to change,and the method is simple and practicable. The environmental pollution problem caused by the waste printed circuit board non-metallic powder can be effectively improved, and the rubber composite is expected to be well applied in low-cost rubber composite materials.

Description

technical field [0001] The invention belongs to the field of rubber compounds, in particular to a rubber compound based on waste printed circuit board non-metal powder and a preparation method thereof. Background technique [0002] With the continuous update of electronic products, the recycling and resource utilization of electronic waste has attracted great attention from scientific and industrial researchers. Among them, waste printed circuit board non-metallic powder is one of the most difficult parts of electronic waste to recycle, mainly composed of thermosetting resin powder, glass fiber, additives, etc. Due to its complex components and low added value, waste printed circuit board non-metallic powder is still mainly incinerated or physically landfilled, which not only causes a serious waste of resources, but also causes certain pollution to the atmosphere, soil, and groundwater. In recent years, with the increasing calls for environmental protection, it is urgent to...

Claims

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Application Information

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IPC IPC(8): C08L9/06C08K13/04C08K3/36C08K3/22C08K5/09C08K5/18C08K3/06C08K5/47C08K7/26
CPCC08K3/06C08K3/22C08K3/36C08K5/09C08K5/18C08K5/47C08K7/26C08K13/04C08K2003/2296C08K2201/011C08L9/06
Inventor 罗远芳胡德超陈勇军林静贾德民
Owner SOUTH CHINA UNIV OF TECH
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