Recycling method of circuit board etching waste liquid

A technology for etching waste liquid and circuit boards, which is applied in the direction of process efficiency improvement, photographic process, instruments, etc., can solve the problems of secondary pollution, high equipment cost, and poor income, so as to reduce pollution, reduce the amount of phosphor copper, and save energy effect

Active Publication Date: 2019-10-22
龙建国
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the outsourced disposal of etching waste liquid has the risk of secondary pollution in transportation and disposal, and the income is poor; the electrolytic copper recovery project consumes high processing power and high equipment costs, and the metal copper obtained can only be disposed of as scrap copper based on the content. , the income is not ideal, and the process of processing waste copper into phosphor copper and then returning to the electroplating line for copper plating needs to consume a lot of social resources

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Recycling method of circuit board etching waste liquid
  • Recycling method of circuit board etching waste liquid
  • Recycling method of circuit board etching waste liquid

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] This embodiment provides a method for recycling circuit board etching waste liquid, comprising the following steps:

[0067] Step 1, use 260# solvent oil (dearomatization type, purchased from Zhengmao Petrochemical) to dilute Mextral54-100 metal extractant to obtain the extractant, add the above-mentioned extractant to the alkaline etching waste liquid, and leave it to stand for stratification to obtain Water phase and copper loaded oil phase. Add an appropriate amount of etching salt, ammonia and anti-side corrosion agent to the water phase to restore the etching ability, form an alkaline regeneration etching sub-liquid, and return to the etching process to participate in etching. The alkaline regeneration etching sub-liquid PH is 9.6, where, Cu 2+ The content is 70g / L, Cl - The content is 170g / L.

[0068] Step 2, adding electroplating waste liquid to the copper-loaded oil phase for stripping, and after standing for stratification, a copper-containing solution and a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a recycling method of circuit board etching waste liquid. The method comprises the following steps that S1, an extraction agent is added into the etching waste liquid, and after layering, a water phase and a loaded-copper oil phase are obtained; secondly, electroplating waste liquid is added into the loaded-copper oil phase for reverse extraction, and after layering, a solution containing copper and an oil phase are obtained; thirdly, the copper-contained solution is pretreated, and copper plating liquid is obtained; and fourthly, the copper plating liquid is used forelectroplating a circuit board to be plated. Through the method, the etching waste liquid is not treated in a low-value manner, the copper in the etching waste liquid is sufficiently used, through a series of treatment, the plating copper liquid is obtained, when the copper plating liquid carries out electroplating on the circuit board to be plated, an infusibility anode is adopted for completelyor partly replacing a phosphor copper anode, the use amount of phosphor copper can be greatly reduced, the electroplating-level copper sulfate does not need to be added, energy is saved, pollutions are reduced, and benefits are brought to an enterprise.

Description

technical field [0001] The invention relates to the field of circuit board preparation, in particular to a method for recycling waste etching liquid of the circuit board. Background technique [0002] PCB printed circuit board is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. Its production process includes: material cutting, drilling, pattern transfer, electroplating, stripping, etching and other processes. Among them, etching is a process that consumes a large amount of chemicals and water in PCB production, and it is also the process that produces the largest amount of waste liquid and wastewater. The State Environmental Protection Administration defines the etching waste liquid in the PCB printed circuit board manufacturing process as hazardous waste (hazardous waste number: HW22), which must not be discharged at will and must be treated. [0003] The existing treatment methods ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/46C25C1/12
CPCC23F1/46C25C1/12Y02P10/20
Inventor 龙建国
Owner 龙建国
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products