A kind of composite material and its preparation method and application

A technology of composite materials and mixed materials, which is applied in applications, other household appliances, ceramic products, etc., can solve the problems of increasing interface thermal resistance, which cannot be further improved, and the thermal conductivity of CuSiC is low, so as to achieve the effect of improving thermal conductivity
CN110396616BActive Publication Date: 2020-11-20BYD CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BYD CO LTD
Publication Date
2020-11-20

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Abstract

The invention relates to a composite material and a preparation method and application thereof. The method comprises the following steps: preparing a carbon-coated silicon carbide framework; and filling pores of the carbon-coated silicon carbide framework with copper or a copper alloy. The composite material provided by the invention has low copper silicide content and good thermal conductivity.
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Description

technical field

[0001] The present disclosure relates to a composite material and its preparation method and application. Background technique

[0002] At present, aluminum silicon carbide (AlSiC) metal matrix composite materials are generally used as the heat dissipation base plate. Aluminum silicon carbide is composed of Al alloy and SiC ceramics. The thermal conductivity of Al alloy is theoretically up to 230W / (m K), and SiC theory The thermal conductivity can reach 320W / (m·K) or above, so the thermal conductivity of aluminum silicon carbide metal matrix composites is limited by the Al alloy and cannot be further improved.

[0003] It has also been reported to use Cu with higher thermal conductivity (thermal conductivity 380-400W / (m K)) instead of Al to prepare aluminum silicon carbide materials, but during the preparation of CuSiC, Cu and SiC will react at high temperatures to form CuSi Compounds, CuSi compounds will greatly increase the interface thermal resistance, ma...

Claims

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