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Semiconductor power transistor with novel feedback structure and integrated circuit and packaging structure

A power transistor and transistor technology, applied in amplifiers, transistors, semiconductor devices with semiconductor devices/discharge tubes, etc., can solve the problems of large chip area, signal attenuation, affecting packaging, etc., and achieve high-frequency microwave performance. Broadband characteristics, the effect of convenient chip packaging

Active Publication Date: 2019-11-05
成都挚信电子技术有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] (2) The area is large and it is difficult to miniaturize
Spiral inductors consume a lot of chip area and are usually the most area-consuming unit in an MMIC circuit
Therefore, whether this kind of circuit is realized on the MMIC chip or on the circuit board after packaging, it is difficult to realize miniaturization and the economy is not good.
[0011] (3) Microwave performance is poor, especially the higher the frequency, the more obvious the deterioration
However, when the frequency is relatively high, such as the millimeter wave frequency band above 10GHz, for example, the fundamental wave is 10GHz, the second harmonic is 20GHz, and the third harmonic is 30GHz. Due to the loss of GaAs and other substrates, or the loss of PCB circuit boards, the second After the sub-harmonic and the third harmonic reach the impedance matching network IMN composed of spiral inductors, on-chip capacitors and on-chip resistors, the signal reflected to the power transistor has been seriously attenuated, and the purpose of harmonic impedance matching and load pulling cannot be achieved, resulting in high Frequency performance is not well optimized
[0012] (4) It is difficult to tune the circuit
The current technology is difficult to tune the impedance matching network IMN and the chip and even the composed system
[0013] (5) The encapsulation of the circuit is not good, and the performance after encapsulation is not good
Such a large mismatch makes the impedance matching network IMN very difficult to design. For example, although feedback structures such as spiral inductors, on-chip capacitors, and on-chip resistors can also be used to achieve low-wave and large-standing-wave feedback functions, they all require a large chip area. And the effect is not good. It directly affects the back-end packaging and needs to be decoupled and compensated. The performance after packaging is not good.
It is especially difficult for internally matched transistor packages that need to match row-shaped power transistor cores through ceramic circuits in the shell, and after the internally matched transistors are packaged, secondary impedance matching needs to be performed externally, making the system complex and poor performance

Method used

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  • Semiconductor power transistor with novel feedback structure and integrated circuit and packaging structure
  • Semiconductor power transistor with novel feedback structure and integrated circuit and packaging structure
  • Semiconductor power transistor with novel feedback structure and integrated circuit and packaging structure

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Experimental program
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Effect test

Embodiment 1

[0075] Such as Figures 1 to 24 As shown, this embodiment provides a semiconductor power transistor with a novel feedback structure, including a horizontal structure transistor and a vertical structure transistor, and the horizontal structure transistor includes a gate 1, a drain 2, a source 3, and a gate input terminal 4. Drain output terminal 5, gate insert finger 6, the vertical structure transistor includes a base 7, a collector 8, an emitter 9, a base input 10, and a collector output 11;

[0076] The horizontal structure transistor and the vertical structure transistor also include a suppression intrinsic feedback structure and a periodic feedback structure; the suppression intrinsic feedback structure is arranged on the electrode of the semiconductor power transistor for suppressing the Fabry feedback structure of the semiconductor power transistor. Perot FP feedback; the periodic feedback structure is set on the substrate of the semiconductor power transistor, or / and on...

Embodiment 2

[0080] Such as figure 1 and figure 2 As shown, on the basis of Embodiment 1, further, in the horizontal structure transistor, the structure for suppressing intrinsic feedback includes a source inclined terminal 13 located on the source electrode, a drain inclined terminal located on the drain electrode 14. The inclined source terminal 13 is inclined at an angle relative to the electrode of the gate finger 6, or / and the inclined drain end 14 is inclined at an angle relative to the electrode of the gate finger 6; in a vertical structure transistor, the The intrinsic feedback suppression structure is a physical structure formed by inclining the electrode interfaces of the base electrode 7, the collector electrode 8, and the emitter electrode 9 at an angle that can destroy the parallel relationship of the electrodes.

[0081] In this embodiment, the Fabry-Perot FP feedback can be suppressed by destroying the electrode parallel relationship of the horizontal structure transistor...

Embodiment 3

[0083] Such as Figures 3 to 7 As shown, on the basis of Embodiment 1, further, the periodic feedback structure disposed on the internal substrate of the semiconductor power transistor includes a gain coupling structure based on an active layer or / and a distributed feedback structure based on a passive layer structure.

[0084] Further, in the horizontal structure transistor, the gain coupling structure based on the active layer is the surface of the channel layer on the internal substrate of the horizontal structure transistor, which has a convex-convex structure with periodic depth changes, or / and has a periodic electrical A structure with variable performance; the distributed feedback structure based on the passive layer is the surface of the isolation layer or / and barrier layer on the inner substrate of the horizontal structure transistor, and has a convex-convex structure with periodic depth changes, or / and has periodicity The structure of the change of electrical proper...

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PUM

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Abstract

The invention discloses a semiconductor power transistor with a novel feedback structure. The semiconductor power transistor comprises a horizontal structure transistor and a vertical structure transistor. The horizontal and vertical structure transistors comprise a suppressing intrinsic feedback structure and a periodic feedback structure. The suppressing intrinsic feedback structure is arrangedon the electrode of the semiconductor power transistor. The periodic feedback structure is arranged inside or / and outside the semiconductor power transistor. The invention also provides a single-chipmicrowave integrated circuit and a circuit packaging structure with internal equipment of the transistor. The passive and active coupling structure is applied to realize periodic feedback and tuning function on the basis of suppressing the transistor intrinsic feedback so as to improve the microwave performance and the broadband characteristics, solve the problem of miniaturization and tuning of the circuit structure, promote the implementation of the periodic feedback structure on the integrated circuit and high efficiency and high performance internal matching packaging. The implementation can be used in various communication systems, especially in the field of radio frequency front-end module of 4G, 5G mobile communication systems and the like.

Description

technical field [0001] The invention belongs to the field of feedback semiconductor chips, in particular to a semiconductor power transistor with a new feedback structure, an integrated circuit and a packaging structure. Background technique [0002] In modern microwave communication systems, with the further improvement of the performance requirements of base station power amplifiers and mobile phone power amplifiers in mobile communication systems in recent years, a new type of radio frequency power device, namely power transistors, has been gradually developed. Such a power transistor has the characteristics of high performance, small parasitic capacitance, and easy integration, and is especially suitable for use as a power device of an integrated circuit. [0003] At present, there are two structures of semiconductor power transistors: horizontal structure power transistors and vertical structure power transistors. Among them, horizontal structure power transistors mainl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/06H03F1/42H03F1/56H03F3/213
CPCH01L27/0623H03F1/42H03F1/56H03F3/213
Inventor 殷玉喆陈利黄永锋
Owner 成都挚信电子技术有限责任公司