Method for manufacturing high-reliability heterogeneous heat-dissipating cold plate

Abstract

The invention discloses a method for manufacturing a heat-dissipating cold plate with high thermal conductivity and high reliability and aims to provide a preparation method which requires no complicated pre-welding treatment, and is simple and low in batch production cost. The method comprises the following steps of: determining the position of the heat-dissipating cold plate corresponding to a high heat component according to the design requirement of a heat dissipation channel, and producing, on a copper alloy insert, a conduction heat dissipation path of a horizontal strip piece which increases the contact area with a box body, wherein the horizontal strip piece extends to the position of the mounting rib of the box body; embedding the copper alloy insert in a right wax mold of a casting mold upper cavity and a casting mold lower cavity, and by using a gypsum-type investment casting process, performing integrated investment casting on the copper alloy insert and the box body in a vacuum pouring tank; finally, machining a casted heat-dissipating cold plate blank according to molding elements to prepare the high-reliability heterogeneous heat-dissipating cold plate.

Description

technical field [0001] The invention relates to a heat transfer structural part, and relates to a preparation method of a cold plate with high heat conduction and heat dissipation. Background technique [0002] In recent years, with the improvement of miniaturization, modularization, and integrated design requirements of electronic equipment, the heat flux density is getting higher and higher. Most of the modules are installed in a centralized manner. There are a large number of high heat consumption devices inside the module, so the heat dissipation problem of electronic equipment is very prominent. At present, most electronic equipment at home and abroad use VC cold plates and heat pipes with high heat transfer efficiency to solve the heat dissipation problem of high heat consumption integrated devices. Due to the traditional copper water VC plate, aluminum acetone VC plate, ordinary heat pipe cold plate and aluminum micro heat pipe array cold plate and other cold plates w...

AI Technical Summary

Problems solved by technology

Through analysis, it is found that the above-mentioned patent publications all have problems of insufficient long-term working reliability, limited layout design or very complicated processing, and there is a clear gap with the heat dissipation cold plate of electronic products that meets simple mass production and has significant long-term reliable working ability. difference

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