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A kind of copolyamide binder that can be used for metal powder injection molding and preparation method

A copolyamide and metal powder technology, applied in metal processing equipment, transportation and packaging, etc., can solve the problems of high cost, large injection molding shrinkage, low melting point of wax-based adhesive, etc., and achieve high powder loading capacity and good processing performance, ease of injection molding

Active Publication Date: 2022-02-25
安徽泰合新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the wax-based adhesive has a low melting point, low thermal deformation temperature during thermal degreasing, poor shape retention, easy to deform, and large injection molding shrinkage
In addition, wax-based materials have poor compatibility with metal materials, are not easy to mix uniformly, and are prone to phase separation after mixing
[0010] 2. Polyaldehyde-based binder, mainly using polyoxymethylene, polyvinyl butyral, etc. as raw materials, has the advantages of high compaction strength, good shape retention, and no two-phase separation, but the feeding viscosity is high, requiring special Degreasing equipment, large investment, high cost, pollutes the environment
[0011] For the problems in related technologies, no effective solutions have been proposed yet

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Add 225.97g of C18 dimerized linoleic acid, 20.22g of sebacic acid, and 100ml of constant pressure dropper into a 500ml reaction flask equipped with a thermometer, a mechanical stirrer, a condenser tube and a nitrogen inlet tube. 50.57, g, pass nitrogen to prevent oxidation, stir and heat up at the same time, when the temperature in the reaction bottle reaches 130°C, start to add diethylenetriamine dropwise, the temperature is controlled at 130°C, after the dropwise addition, keep warm for 1 hour. Then add 1.48g of 2,2-dimethylolbutyric acid, and start to slowly raise the temperature to about 240°C. During the heating process, water will distill out. When the reaction temperature reaches 240°C, use a vacuum pump to vacuumize and reduce the pressure. 100 Pa, keep the stirring rate at a certain value, and release the vacuum after 3 hours to complete the reaction.

Embodiment 2

[0035] Add 225.97g of C18 dimerized linoleic acid, 20.22g of sebacic acid, and 100ml of constant pressure dropper into a 500ml reaction flask equipped with a thermometer, a mechanical stirrer, a condenser tube and a nitrogen inlet tube. 49.54g, feed nitrogen to prevent oxidation, stir and heat up at the same time, when the temperature in the reaction bottle reaches 130°C, start to add diethylenetriamine dropwise, the temperature is controlled at 130°C, after the dropwise addition, keep warm for 1 hour. Then add 2.96g of 2,2-dimethylolbutyric acid, and start to slowly raise the temperature to about 240°C. During the heating process, water will distill out. When the reaction temperature reaches 240°C, use a vacuum pump to vacuumize and reduce the pressure. 100 Pa, keep the stirring rate at a certain value, and release the vacuum after 3 hours to complete the reaction.

Embodiment 3

[0037] Add 225.97g of C18 dimerized linoleic acid, 20.22g of sebacic acid, and 100ml of constant pressure dropper into a 500ml reaction flask equipped with a thermometer, a mechanical stirrer, a condenser tube and a nitrogen inlet tube. 48.50g, pass nitrogen gas to prevent oxidation, stir and heat up at the same time, when the temperature in the reaction bottle reaches 130°C, start to add diethylenetriamine dropwise, control the temperature at 130°C, and keep warm for 1 hour after the dropwise addition. Then add 4.44g of 2,2-dimethylolbutyric acid, and start to slowly heat up to about 240°C. During the heating process, water will distill out. When the reaction temperature reaches 240°C, use a vacuum pump to vacuumize and reduce the pressure. The vacuum degree is < 100 Pa, keep the stirring rate at a certain value, and release the vacuum after 3 hours to complete the reaction.

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PUM

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Abstract

The invention discloses a copolyamide binder which can be used for metal powder injection molding and a preparation method thereof, and relates to the technical field of copolyamide binder. In molar percentage, it includes the following components: 30%-45% of aliphatic dimer acid, 6%-20% of aliphatic dicarboxylic acid, 45%-49% of aliphatic diamine, and the side chain has carboxyl polarity Group of aliphatic diols 1%‑5%. The copolyamide binder used for metal powder injection molding provided by the invention is easy to dissolve, especially easy to dissolve in alcohol solvents. The copolyamide binder has good compatibility with metal powder, high powder loading capacity, small volume shrinkage, low melt viscosity, and is easy for injection molding.

Description

technical field [0001] The invention relates to the technical field of copolyamide binders, in particular to a copolyamide binder which can be used for metal powder injection molding and a preparation method. Background technique [0002] Metal powder injection molding technology combines the advantages of powder metallurgy and injection molding technology. It is a near-net processing technology with the characteristics of high precision, uniform structure, low production cost and high product quality. It is suitable for a variety of metal materials and can be Forming parts with complex structures has high production efficiency. It has obvious advantages in the processing of small or micro complex structure metal parts. Metal powder injection molding technology is widely used in the manufacturing of consumer electronics, medical equipment, industrial tools, aerospace, automobiles, ships and military products. [0003] In metal powder injection molding, the binder plays a ke...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G69/34B22F1/103B22F3/22
CPCC08G69/34B22F3/225B22F1/103B22F1/10
Inventor 马其祥康海杨刘鸿杨
Owner 安徽泰合新材料科技有限公司