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High-efficiency environment-protective acidic etching solution and etching method thereof

An acid etching solution and an environmentally friendly technology, which is applied in the field of high-efficiency and environment-friendly acid etching solution and its etching, can solve the problems of high etching efficiency, achieve the effects of increasing etching rate, reducing exhaust emissions, and saving procurement costs

Inactive Publication Date: 2019-11-15
惠州市鸿宇泰科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, the technical problem to be solved in the present invention is a high-efficiency environment-friendly acid etching solution and its etching method with high etching efficiency and little pollution, thereby effectively improving the etching efficiency, reducing pollution, and saving production costs. Improved production efficiency of circuit boards

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0050] This embodiment discloses a high-efficiency and environment-friendly acid etching solution and an etching method thereof.

[0051] A high-efficiency and environment-friendly acid etching solution. The acidic etching solution includes an etching liquid base liquid containing hydrogen ions, chloride ions, copper ions and cuprous ions, an acidic etching liquid I containing chlorate ions and an acidic etching liquid II containing hydrogen ions; the etching liquid base The content of hydrogen ion in the liquid is 0.5g / L, and the content of chloride ion is 230g / L, and the content of copper ion is 120g / L, and the redox potential difference of copper ion and cuprous ion is 450 millivolts; The content of chlorate ions in the acidic etching solution I is 80g / L; the content of hydrogen ions in the acidic etching solution II is 100g / L.

[0052] Wherein, the acidic etching solution I includes sodium chlorate, sodium chloride, urea and water. The content of each component of this a...

Embodiment 2

[0065] This embodiment discloses a high-efficiency and environment-friendly acid etching solution and an etching method thereof.

[0066] A high-efficiency and environment-friendly acid etching solution. The acidic etching solution includes an etching liquid base liquid containing hydrogen ions, chloride ions, copper ions and cuprous ions, an acidic etching liquid I containing chlorate ions and an acidic etching liquid II containing hydrogen ions; the etching liquid base The content of hydrogen ion in the liquid is 1.5g / L, and the content of chloride ion is 260g / L, and the content of copper ion is 150g / L, and the redox potential difference of copper ion and cuprous ion is 550 millivolts; The content of chlorate ions in the acidic etching solution I is 80g / L; the content of hydrogen ions in the acidic etching solution II is 200g / L.

[0067] Wherein, the acidic etching solution I includes sodium chlorate, sodium chloride, urea and water. The content of each component of this a...

Embodiment 3

[0080] This embodiment discloses a high-efficiency and environment-friendly acid etching solution and an etching method thereof.

[0081] A high-efficiency environment-friendly acid etching solution, including an etching solution base solution containing hydrogen ions, chloride ions, copper ions and cuprous ions, an acid etching solution I containing chlorate ions, and an acid etching solution II containing hydrogen ions; The content of the hydrogen ion in the etching liquid base liquid described above is 1.0g / L, and the content of the chloride ion is 245g / L, and the content of the copper ion is 135g / L, and the redox potential difference of copper ion and cuprous ion is 500 milliseconds. V; The content of the chlorate ion in the described acidic etching solution I is 130g / L; The content of the hydrogen ion in the described acidic etching solution II is 150g / L.

[0082] Wherein, the acidic etching solution I includes sodium chlorate, sodium chloride, urea and water. The conten...

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PUM

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Abstract

The invention discloses a high-efficiency environment-protective acidic etching solution. The acidic etching solution comprises an etching solution base solution, an acid etching solution I and an acid etching solution II, wherein in the etching solution base solution, the content of hydrogen ions is 0. 5g / L-1.5 g / L, the content of chloride ions is 230 g / L-260 g / L, the content of the copper ions is 120 g / L-150 g / L, and the redox potential difference of the copper ions and cuprous ions is 450-550 millivolt, the content of chlorate ions in the acidic etching solution I is 80 g / L-180 g / L, and thecontent of the hydrogen ions in the acid etching solution II is 100 g / L-200 g / L. The invention further discloses an etching method of the high-efficiency environment-protective acidic etching solution. The method has the advantages of being high in etching efficiency, small in pollution and the like, the etching efficiency is effectively improved, the pollution is reduced, the production cost issaved, and the production efficiency of a circuit board is improved.

Description

technical field [0001] This field belongs to the technical field of circuit board etching, and specifically designs a high-efficiency and environment-friendly acid etching solution and an etching method thereof. Background technique [0002] With the rapid development of the electronic field, PCB is also more and more widely used. Etching is an important process in the production process of circuit boards. In the prior art, concentrated hydrochloric acid is generally used for etching, but concentrated hydrochloric acid is very volatile in the air. Due to the strong volatility of concentrated hydrochloric acid, the volatilized hydrogen chloride gas will combine with water vapor in the air to form hydrochloric acid fumes and spread in the air, which not only makes the production workshop have a strong pungent smell, but also affects the operation of the operator when inhaling hydrochloric acid fumes. If you are healthy, the direct discharge of exhaust gas will pollute the envi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/18
CPCC23F1/18
Inventor 徐刚蔡国军苑举春李瀚罗昭斌詹梓轩邵家维周选文钟丽君
Owner 惠州市鸿宇泰科技有限公司
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