Unlock instant, AI-driven research and patent intelligence for your innovation.

Semiconductor device

A semiconductor, conductive technology, applied in the manufacturing/processing of measuring devices, electromagnetic devices, and the use of electromagnetic/magnetic devices to transmit sensing components, etc., can solve problems such as increased cost, larger chip size, and complex control circuits. Cost reduction and chip size reduction effect

Inactive Publication Date: 2019-11-26
SII SEMICONDUCTOR CORP
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] However, in the method of Patent Document 2, a plurality of depletion layer control electrodes must be used, and a complicated control circuit is required, so there is a difficulty in that the chip size increases and the cost increases.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor device
  • Semiconductor device
  • Semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] Below, while referring to the attached Figure 1 Modes for implementing the present invention will be described in detail.

[0027] figure 1 is a diagram for explaining a semiconductor device including a Hall element 100 according to an embodiment of the present invention, figure 1 (a) is a plan view, figure 1 (b) is along figure 1 (a) Sectional view of L-L line. Such as figure 1 As shown, the semiconductor device of this embodiment includes: a P-type (first conductivity type) semiconductor substrate 10 , a Hall element 100 provided on the semiconductor substrate 10 , and a P type element isolation diffusion layer 50 .

[0028] The Hall element 100 includes: a magnetic receptacle 20 formed of an N-type (second conductivity type) impurity diffusion layer provided on a semiconductor substrate 10 and having a square shape in plan view; The electrodes 31 to 34 are composed of N-type impurity regions with a higher concentration than the magnetic receptacle 20 pro...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a semiconductor device. A Hall element is provided with: a magnetism sensing unit (20) which is configured from a second conductivity-type impurity diffusion layer provided ona first conductivity-type semiconductor substrate (10), and which has four ends in plan view; and four electrodes (31) to (34). The surface of the magnetic sensing part is composed of a second conductivity type impurity diffusion layer which is arranged at each of four end parts and is higher in concentration than the magnetic sensing part. The impurity diffusion layer, which is a magnetic sensing part, has a first depth (D1) from the surface of the semiconductor substrate. The semiconductor device has a first concentration gradient (S1) in which the impurity concentration of the second conductivity type increases in the depth direction from the surface of the semiconductor substrate to a second depth (D2) shallower than the first depth. And a second impurity gradient (S2) in which the impurity concentration of the second conductivity type decreases in the depth direction from the second depth to the first depth, the second depth being less than or equal to half of the first depth, and the first concentration gradient being steeper than the second concentration gradient.

Description

technical field [0001] The present invention relates to a semiconductor device, and more particularly, to a semiconductor device having a Hall element. Background technique [0002] The Hall element is used in various applications because it can perform non-contact position sensing or angle sensing as a magnetic sensor. [0003] With a real Hall element, an output voltage is produced even when no magnetic field is applied. The voltage output when the magnetic field is zero is referred to as an offset voltage. The cause of the offset voltage is considered to be an imbalance in potential distribution inside the element due to mechanical stress applied to the element from the outside, alignment deviation during manufacturing, or the like. When a Hall element is used as a magnetic sensor, it is necessary to remove such an offset voltage. [0004] In order to remove (eliminate) the offset voltage, the spinning current method is generally used. [0005] Hall elements can be i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L43/06G01D5/14G01R33/07
CPCG01R33/07G01D5/145H10N52/101G01R33/077H10N52/80H10N52/01G01R33/075
Inventor 飞冈孝明
Owner SII SEMICONDUCTOR CORP