Epoxy composite material and production method thereof
A composite material and epoxy technology, which is applied in the field of thermally conductive insulating materials, can solve the problems of complex preparation process and difficulty in meeting the requirements of anti-cracking performance, and achieve the effects of simple preparation method, reduced material cost, and enhanced thermal conductivity
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Embodiment 1
[0028] This embodiment provides an epoxy composite material. The raw materials include epoxy resin base material, inorganic filler, curing agent and fiber fabric; wherein the epoxy resin base material is bisphenol A epoxy resin, and the inorganic filler is boron nitride. , The curing agent is phthalic anhydride, and the fiber fabric is aramid fiber fabric. The inorganic filler is composed of two kinds of boron nitride fillers with different particle diameters. The ratio of the average particle diameter of the large particle diameter filler to the small particle diameter filler is 1:0.4, and the average particle diameter of the large particle diameter filler is 250μm . In terms of volume percentage, inorganic fillers account for 30% of the epoxy composite material, of which the large particle diameter filler accounts for 16.3% of the epoxy composite material, and the small particle diameter filler accounts for 13.7% of the epoxy composite material.
[0029] This embodiment also p...
Embodiment 2
[0031] This embodiment provides an epoxy composite material. The raw materials include epoxy resin base material, inorganic filler, curing agent and fiber fabric; wherein the epoxy resin base material is hydrogenated bisphenol A epoxy resin, and the inorganic filler is boron nitride. , A mixture of silicon nitride and silicon oxide in a mass ratio of 1:1:2, the curing agent is hexahydrophthalic anhydride, and the fiber fabric is a mixed braid of aramid fiber and polyimide fiber. The inorganic filler is composed of two different particle diameter fillers, the ratio of the average particle diameter of the large particle diameter filler to the small particle diameter filler is 1:0.412, and the average particle diameter of the large particle diameter filler is 18 μm. In terms of volume percentage, inorganic fillers account for 40% of the epoxy composite material, of which the large particle diameter filler accounts for 22.5% of the epoxy composite material, and the small particle di...
Embodiment 3
[0034] This embodiment provides an epoxy composite material. The raw materials include epoxy resin base material, inorganic filler, curing agent and fiber fabric; wherein the epoxy resin base material is bisphenol F epoxy resin, and the inorganic filler is boron nitride, A mixture of aluminum nitride and silicon nitride according to a mass ratio of 3:5:1, the curing agent is methyltetrahydrophthalic anhydride, and the fiber fabric is a mixed braid of glass fiber and basalt fiber. The inorganic filler is composed of two different particle diameter fillers, the ratio of the average particle diameter of the large particle diameter filler to the small particle diameter filler is 1:0.37, and the average particle diameter of the large particle diameter filler is 10 μm. In terms of volume percentage, inorganic fillers accounted for 37% of epoxy composite materials, of which, large particle diameter fillers accounted for 20.6% of epoxy composite materials, and small particle diameter fi...
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