Device for high-depth-diameter-ratio micro-hole high-speed electrosparking
Patent Information
- Authority / Receiving Office
- CN ยท China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- DALIAN UNIV OF TECH
- Publication Date
- 2019-12-13
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Abstract
Description
technical field
[0001] The invention relates to a method and device for high-speed electrical discharge machining of microholes with a large depth-to-diameter ratio, and belongs to the field of mechanical processing and tools. Background technique
[0002] Micropores with large aspect ratio are more and more widely used in automobiles, biomedicine, nuclear industry, aviation, aerospace and other fields. When machining holes with traditional machining methods, the cutting environment of the tool is poor, and there are problems such as low rigidity of the tool holder, difficulty in cooling, and difficulty in chip removal. In micro hole processing, when the hole diameter is less than 1mm, traditional machining can hardly be completed. Micro-EDM is non-contact processing. During the processing, the tool electrode does not touch the workpiece, the tool electrode will not be deformed by force, and the micro-EDM is almost not affected by the strength and hardness of the workpiece....