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Resin composition and prepreg, laminated board, printed wiring board having same

A technology of resin composition and compound, applied in the direction of printed circuit, printed circuit, printed circuit parts, etc., can solve the problem that it is difficult to choose compatible phosphorus-containing flame retardants, and achieve low dielectric loss and low dielectric Constant, the effect of dielectric constant of halogen-free flame retardant

Active Publication Date: 2022-05-13
常熟生益科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to improve environmental problems, phosphorus-containing flame retardants, such as phosphoric acid ester, DOPO, phosphazene or phosphate, are widely used at present, but it is difficult to choose a good flame retardant in the polyphenylene ether resin system with poor solubility and compatibility. Compatible and reactive phosphorus-containing flame retardants

Method used

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  • Resin composition and prepreg, laminated board, printed wiring board having same
  • Resin composition and prepreg, laminated board, printed wiring board having same
  • Resin composition and prepreg, laminated board, printed wiring board having same

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0088] The preparation method of the prepreg is: immersing the reinforcing material in the above-mentioned resin composition glue, then baking the impregnated reinforcing material at 50-170°C for 1-10min, and drying to obtain the present invention. prepregs.

[0089] The present invention also provides a laminate, comprising at least one prepreg mentioned above, and a metal foil formed on at least one side of the prepreg.

[0090] The laminate means that one or two of the above-mentioned prepregs are bonded together by heating and pressure to form a laminate, and then one or both sides of the laminate are bonded with metal foil by heating and pressure.

[0091] The preparation steps of the laminate are as follows: one or both sides of the above-mentioned prepregs are covered with metal foil, or at least two of the above-mentioned prepregs are stacked, and then one or both sides of the above-mentioned prepregs are covered with metal foil, and hot-pressed , to obtain a laminate...

Synthetic example 1

[0101] Synthesis Example 1: Synthesis of Phosphorous Compound (I)

[0102] Nadic anhydride and phosphorus compounds React under the existence of initiator benzoyl peroxide, its temperature of reaction is 135 ℃, and the carbon-carbon double bond in the Nadic acid anhydride is reacted with the active hydrogen group in the phosphorus compound, obtains following structure A phosphorus-containing compound (I ).

[0103]

Synthetic example 2

[0104] Synthesis Example 2: Synthesis of Phosphorous Compound (I)

[0105] endomethyl nadic anhydride and phosphorus compounds React in the presence of initiator benzoyl peroxide, and its temperature of reaction is 135 ℃, and the carbon-carbon double bond in the Nadic acid anhydride is reacted with the active hydrogen group in the phosphorus compound, obtains following structure B phosphorus-containing compound (I ).

[0106]

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PUM

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Abstract

The invention provides a resin composition and its prepreg, laminated board and printed circuit board. The resin composition includes: a hydrocarbon resin, a crosslinking aid, and a flame retardant; the hydrocarbon resin contains at least an epoxy-modified hydrocarbon resin; the flame retardant contains at least a phosphorus-containing compound (I) , the phosphorus-containing compound (I) is a phosphoric anhydride-containing compound. The resin composition of the present invention, through the reaction of phosphoric anhydride-containing compounds and epoxy-modified hydrocarbon resins, phosphorus atoms are well introduced into the curing cross-linking system of hydrocarbon resins, so as to meet the requirements of both halogen-free flame retardancy and Substrate material with low dielectric constant and low dielectric loss value.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a resin composition and a prepreg, a laminate, and a printed circuit board having the resin composition. Background technique [0002] In recent years, with the rapid development of wireless communication technology and electronic products, electronic circuits have entered the stage of high-speed information processing and high-frequency signal transmission. However, when the frequency is greater than 300MHz or even above GHz, the electrical properties of the substrate will be seriously affected. The characteristics of electronic circuits, so there are higher requirements for the dielectric constant and dielectric loss value of the substrate. [0003] On the other hand, due to the strict requirements on safety and combustion performance of electronic and electrical equipment, the corresponding printed circuit boards, prepregs, laminates, and metal foil-clad laminates us...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L47/00C08L25/10C08K5/5313C08K5/5397C08K5/5333C08K5/5435B32B15/092H05K1/03
CPCC08L47/00H05K1/0326B32B15/092H05K2201/0145B32B2457/08C08L2205/03C08L2205/035C08L2205/025C08L2203/20C08L2201/02C08L2201/08C08L2201/22C08L25/10C08K5/5313C08K5/5397C08K5/5333C08K5/5435
Inventor 杨宋焦锋崔春梅陈诚马建
Owner 常熟生益科技有限公司
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