Preparation method of circuit board for CCMs

Abstract

A preparation method of a circuit board for CCMs (CMOS Camera Module) comprises the following steps: inner core board making; insulating layer attaching; copper foil attaching and pressing; etching and windowing; seed copper; exposing and developing; copper column electroplating; grinding after film stripping; drilling; copper depositing and plating; outer circuit making; and solder resist making.A copper column is electroplated at the windowing position, a chip is directly attached to the copper column, and the heat dissipating capacity is improved. The strength of the steel column determines the deformation amount of the chip, and the deformation of the chip in a high-temperature environment can be ignored through a module assembling process. A grinding process is added after the coppercolumn is electroplated, so that the surface is smooth, and no height difference exists during chip attachment. In addition, the chip is attached to the copper column, the deformation is small, the resolution ratio is high, and the image blur rate is low. The technology is simple and reasonable. The prepared product has the advantages of good heat dissipation performance, high flatness, small deformation and high resolution ratio. The rate of good modules is increased.

Description

technical field [0001] The invention belongs to the technical field of circuit board production, and relates to a method for preparing a circuit board for a high-pixel CCM module. Background technique [0002] With the improvement of people's requirements for quality of life, photography or lighting has become an indispensable thing in people's life, and cameras and video cameras are also developing towards miniaturization, low power and low cost. [0003] CCM is the abbreviation of CMOS Camera Module. It is the core device used in various new generation portable camera equipment. Compared with the traditional camera system, it has the advantages of miniaturization, low power consumption, low cost and high image quality. However, with the improvement of pixels, the requirements for circuit boards are also getting higher and higher. The production of the existing high pixel CCM module circuit board is as follows: figure 1 As shown, the process is as follows: production of i...

AI Technical Summary

Problems solved by technology

[0006] 3. The chip is attached to the surface of the solder resist, and the surface of the solder resist has a difference in height, which will affect the flatness of the chip attachment;

[0007] 4. The chip area is large, and the heat dissipation at the bottom is not good

In this structure, a high-temperature-resistant deformation-reinforcing layer is provided on the main body of the circuit board, and the photosensitive IC and the base are mounted on the high-temperature-resistant deformation-reinforcing layer. ability, so as to realize the smooth surface of the circuit board, but adding a high temperature resistant deformation reinforcement layer will inevitably increase the thickness of the circuit board, affect heat dissipation, and increase the production cost

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