53results about How to "No height difference" patented technology

The invention provides a method for measuring the thickness of a coating layer of coated fuel particles. The method comprises the following steps: placing coated fuel particles in a sample-embedding die so that the coated fuel particles are closely arranged on the same sample plane, fixing the coated fuel particles in the sample-embedding die by using a curing agent to prepare a solid sample, grinding the solid sample, and enabling a grinding plane to be parallel to the sample plane until at least 80% of grinding surface of the coated fuel particles on the grinding plane observed under a microscope is tangent to the grinding surface of other coated fuel particles; polishing the ground solid sample so that the solid sample has no visible grinding crack on the grinding plane under the microscope, and the coating layers are clear in dividing line and free from height difference; acquiring an image of the solid sample on the grinding plane under the microscope; and then extracting the thickness of each coating layer from the image in combination of magnification times of the microscope. The method can be used for fast and accurately measuring the thickness of the coating layer of the coated fuel particles.

A gate wiring including a gate line, a gate electrode and a gate pad and extending in a lateral direction is formed on the substrate. A gate insulating layer is subsequently formed, and a semiconductor layer and an ohmic contact layer are sequentially formed thereon. A conductive material is deposited and patterned to form data wiring including data lines intersecting the gate lines, source electrodes, drain electrodes, and data pads. A first insulating layer made of silicon nitride is deposited on the substrate, and a second insulating layer made of photosensitive organic insulating material is coated on the first insulating layer. The second insulating layer is patterned to form a convex-concave pattern and a first contact hole opposite to the drain electrode exposing the first insulating layer on a surface thereof. Subsequently, the first insulating layer and the gate insulating layer are patterned together by photolithography using a photoresist pattern to form contact holes exposing the drain electrode, the gate pad, and the data pad, respectively. Next, indium tin oxide (ITO) or indium zinc oxide (IZO) is deposited and patterned to form light-transmitting electrodes, sub-gate pads, and sub-gate pads connected to drain electrodes, gate pads, and data pads, respectively. data pad. Finally, a reflective conductive material is deposited on the light-transmitting electrode and patterned to form a reflective film with corresponding holes in the pixel area.

The invention provides a large-area solid wood composite block floor, and a production method and an installation method thereof. The block floor provided by the invention comprises a plurality of sub floor blocks, wherein each sub floor block is manufactured individually according to the specification and the shape of a preset design requirement; sub floor blocks have different specifications and different shapes, or parts of the sub floor blocks are same, and parts of the sub floor blocks are different; and all sub floor blocks are spliced to form the large-area solid wood composite block floor with an integral block pattern. On the basis of the traditional solid wood composite floor, the installation efficiency of the solid wood composite block floor in decoration is improved, the appearance quality of the solid wood composite block floor product is improved, and the large-area solid wood composite block floor can be directly installed in field and is free from being cut. According to the geometrical shape of the solid wood composite floor, a whole is broken into parts, the whole block floor is divided into parts of small units, and the field installation efficiency and quality can be improved. In addition, subsequent product complaint, especially the product complaint under the geothermal condition, can be avoided in a gumming-type installation mode.

The invention provides a liquid crystal filling method which comprises the following steps of: providing a bearing table; placing a baseplate with a liquid crystal filling area on the bearing table, wherein the liquid crystal filling area is also provided with a buffer area; dripping liquid crystals into the liquid crystal filling area; and utilizing a wind cutter to enable the liquid crystals of the liquid crystal filling area to diffuse along one direction.

The invention belongs to the technical field of clothing, and particularly provides a split splicing technique, including a double-faced pile fabric piece split-splicing method and a fabric piece split-splicing structure. According to the split-splicing technique, both splicing parts of two double-faced pile fabric pieces to be spliced are split into two layers, the two splicing layers of the double-faced pile fabric pieces are spliced with each other and fixed by stitching. The split-splicing technique has the advantages that the splicing parts are thin and the splicing stitch is flat and shallow. Tenderness and elegance of women can be shown completely when women wear the dresses made by the split-splicing technique. Further, the split-splicing technique is also applicable to making men' formal wear.

The invention discloses a bolster spring dismounting robot and a bogie damping device dismounting system, and belongs to the technical field of railway vehicle bogie dismounting. The bogie damping device dismounting system comprises a bogie supporting device, a wedge supporting robot, a bolster spring and wedge transfer robot and the bolster spring dismounting robot; the bogie supporting device is used for supporting and jacking a bogie; the wedge supporting robot is used for supporting a wedge of the bogie; the bolster spring dismounting robot is used for dismounting and clamping a bolster spring of the bogie and is used for dismounting the wedge of the bogie; the bolster spring and wedge transfer robot is used for transferring the bolster spring and the wedge to the conveying line. The dismounting system is high in intelligent degree, the dismounting process of the bolster spring and the wedge is convenient, and the dismounted bolster spring and wedge can be accurately transferred, so that the labor intensity of workers is greatly reduced, and the dismounting efficiency is improved.

The invention relates to the field of architectural ornament, in particular to a floor tile gluing device with tile supply and cleaning functions. The floor tile gluing device comprises a base part, asupport frame part, a tile gluing part, a cleaning box, a tile supply part and a control panel. According to the floor tile gluing device with the tile supply and cleaning functions, automatic gluingof tiles can be realized, the tile position is accurate in control and high in precision, the high gluing quality of the tiles is ensured, and the effect of automatic cleaning tile bottom surfaces before gluing the tiles is achieved.

The invention provides a variable stigmatic opening transmission device of an engine, wherein the engine with elasticity applied on the valve closing direction is in linkage connection with a cam driven member and the cam driven member is equipped with a cam abutting part for the abutting against a first and a second cams.According to the device, when the second cam moves toward the first cam, the impact of the cam abutting part to the first cam is avoided and the generation of the strike sound is also avoided.The first cam (31) is fixed to a camshaft (32).The second cam (33) can axially movebetween the motion position that the second cam can abut against the cam abutting part (56) and approach the first cam (31) and the non-motion position that the second cam cannot abut against the camabutting part (56) and go far from the first cam (31). The second cam (33) supported by the camshaft (32) is not capable of rotating relative to an axis.The first cam side of the mountain portion (33b) of the second cam is equipped with an inclined surface and the inclined surface inclines toward the internal of the radial direction of the camshaft.

A preparation method of a circuit board for CCMs (CMOS Camera Module) comprises the following steps: inner core board making; insulating layer attaching; copper foil attaching and pressing; etching and windowing; seed copper; exposing and developing; copper column electroplating; grinding after film stripping; drilling; copper depositing and plating; outer circuit making; and solder resist making.A copper column is electroplated at the windowing position, a chip is directly attached to the copper column, and the heat dissipating capacity is improved. The strength of the steel column determines the deformation amount of the chip, and the deformation of the chip in a high-temperature environment can be ignored through a module assembling process. A grinding process is added after the coppercolumn is electroplated, so that the surface is smooth, and no height difference exists during chip attachment. In addition, the chip is attached to the copper column, the deformation is small, the resolution ratio is high, and the image blur rate is low. The technology is simple and reasonable. The prepared product has the advantages of good heat dissipation performance, high flatness, small deformation and high resolution ratio. The rate of good modules is increased.

The invention discloses an assembling and welding method for a space bent pipe of an all-terrain vehicle and a welding tool. The assembling and welding method comprises the following steps: (1) assembling parts of the space bent pipe; and (2) conducting welding to form the space bent pipe. The welding tool comprises a main plate for conducting multi-point supporting on the bottom of the space bent pipe, and a positioning plate which is obliquely installed on the main plate and used for supporting an upwarp section of the space bent pipe; and part sections forming the space bent pipe are fixedly positioned on panel surfaces of the positioning plate and the main plate respectively. When welding needs to be conducted to form the space bent pipe, the part sections forming the space bent pipe are fixedly positioned on the panel surfaces of the positioning plate and the main plate respectively to be supported, thus it is guaranteed that no height difference exists in supporting of the part sections forming the space bent pipe, meanwhile, repeated adjustment is not needed, the problem that height difference exists in the different part sections of the space bent pipe is solved, and it is guaranteed that the overall space position precision of the space bent pipe which is formed after welding is conducted meets the design requirement.

The invention discloses a stone floor tile levelness maintaining device. The stone floor tile levelness maintaining device comprises flexible embedded parts and embedded grooves formed on the sides ofstone floor tiles and used for allowing the embedded parts to be embedded. When the two sides of each embedded part are spliced on the corresponding stone floor tile, the two sides of the embedded part are embedded into the opposite embedded grooves of two adjacent stone floor tiles. The embedded grooves are formed on the sides of the stone floor tiles, when the stone floor tiles are spliced, each embedded part with certain flexibility is embedded into the opposite embedded grooves of two adjacent stone floor tiles; and during assembling, it can be ensured that the spliced position of two adjacent stone floor tiles keeps level, and even though the levelness of the ground where stone floor tiles are paved is not perfect, the device can ensure that no height difference is generated to joints of the adjacent stone floor tiles in the stone floor tiles with pavement completed.

The invention relates to the field of building decoration, in particular to a floor tile fitting device with a tile supply function. The device comprises a base component, a supporting frame component, a tile fitting component, a bonding material scraping component, a tile supply assembly and an operation and control platform. Not only are the functions of automatic fitting, aligning and positioning of tiles achieved, but also the device is provided with the tile supply assembly. The device has the advantage that the tile supply position is accurate and stable.

The invention relates to a processing and installing process for a titanium alloy hitting panel of a golf club. The processing and installing process comprises the procedures of blanking, processing of an installing groove and compression-joint embedding. In compression joint, titanium alloy deforms and is firmly fixed into the installing groove, meanwhile, an edge pressing lip is subjected to compression joint to cover a gap, and the hitting panel is further prevented from coming out; and finally, a whole plane is processed, and the flatness of the whole plane is guaranteed. By means of the processing and installing process, the problem that the hitting panel is not flatly and firmly installed is solved, and the product quality is guaranteed.

The invention belongs to the technical field of semiconductors, and discloses an SGT-MOSFET and a manufacturing method thereof. The method comprises the steps: depositing a masking layer on a substrate epitaxial layer, and photoetching a deep groove; removing the masking layer, growing a field oxide layer, and depositing shielding gate polycrystalline silicon; etching back shielding gate polycrystalline silicon, and photoetching a shallow groove; and photoetching a field oxide layer, forming a gate groove, growing a gate oxide layer, depositing gate polycrystalline silicon, performing back etching, and performing subsequent manufacturing. According to the invention, a new manufacturing method is adopted to connect the shield gate polycrystalline silicon and the gate polycrystalline silicon contact hole; and the manufacturing method adopted by the invention does not involve a photoetching process of shield gate polycrystalline silicon and grid polycrystalline silicon, and the shield gate polycrystalline silicon and the grid polycrystalline silicon are basically flush with the surface of the silicon substrate after being etched, so that the height difference of the polycrystalline silicon is eliminated, and the shield grid polycrystalline silicon and the grid polycrystalline silicon are punched well without generating the risk of bridging of the shield grid polycrystalline silicon and the grid polycrystalline silicon.

The invention discloses a modularized floor of a passenger train. The modularized floor of the passenger train is provided with a floor module, wherein the left side and the right side of a honeycombcomposite board of the floor module separately extend out of a sound-insulation and heat-insulation board to form a connecting portion of the floor module; a main floor is composed of a plurality of I-shaped floor modules, side section bars are separately arranged on the left side and the right side of each I-shaped floor module, a lower connector groove is formed in the lower portion of the innerside surface of each side section bar, the side section bars are clamped on the connecting portions of the I-shaped floor modules through the lower connector grooves and then are connected with the I-shaped floor modules, the inner side surface of the upper portion of each lower connector groove is arc-shaped, and floor cloth extends towards two sides and covers the arc-shaped inner side surfacesof the side section bars; and at least one of the front end and the rear end of each I-shaped floor module is provided with insertion section bars, the insertion section bars are embedded in the honeycomb composite board, and are divided into fork-shaped insertion head section bars and U-shaped insertion seat section bars, and the adjacent I-shaped floor modules are connected by inserting the fork-shaped insertion head section bars into the U-shaped insertion seat section bars which are matched with the fork-shaped insertion head section bars. The modularized floor of the passenger train is simple in connection structure and firm in strength, tools are not required during assembling of the modularized floor, and the modularized floor is quite convenient to assemble.