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Ketimine latent curing agent, reactive polyurethane hot melt adhesive containing ketimine latent curing agent and application of ketimine latent curing agent

A technology of polyurethane hot-melt adhesive and latent curing agent, applied in the field of materials, can solve problems such as unmanned application, and achieve the effects of improving sizing and leveling, eliminating bubbles and reducing crystallinity

Inactive Publication Date: 2020-01-17
北京长润化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, no one at home and abroad has applied for a patent for reactive polyurethane hot melt adhesives containing ketimine latent curing agents.

Method used

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  • Ketimine latent curing agent, reactive polyurethane hot melt adhesive containing ketimine latent curing agent and application of ketimine latent curing agent
  • Ketimine latent curing agent, reactive polyurethane hot melt adhesive containing ketimine latent curing agent and application of ketimine latent curing agent
  • Ketimine latent curing agent, reactive polyurethane hot melt adhesive containing ketimine latent curing agent and application of ketimine latent curing agent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0076] Reactive polyurethane hot melt adhesives, made from the following raw materials by weight:

[0077] Butylene adipate diol (hydroxyl value 36mgKOH / g) 100kg, neopentyl glycol adipate\butylene glycol ester copolyethylene glycol (hydroxyl value 36mgKOH / g) 150kg, PPG 2000 (hydroxyl value 56mgKOH / g) 150kg, diphenylmethane diisocyanate (MDI-100) 90kg, polyacrylate resin (BR-113) 75kg, tetrakis [β-(3,5-di-tert-butyl-4-hydroxyphenyl) propane Acid] pentaerythritol ester (antioxidant 1010) 2kg, dibutyl hydroxytoluene (antioxidant BHT) 2kg, catalyst dibutyltin dilaurate 1kg, ketimine latent curing agent A 50kg.

[0078] Preparation:

[0079] (1) Take each raw material by the above weight;

[0080] (2) Add butanediol adipate diol, neopentyl glycol adipate\butylene glycol ester copolymerized diol, and PPG2000 into the agitator and mix evenly, heat up to 80°C, add polyacrylate resin (BR- 113), then warming up to 120°C, removing water for 2 hours under vacuum until the water content...

Embodiment 2

[0085] Reactive polyurethane hot melt adhesives, made from the following raw materials by weight:

[0086] Butylene adipate diol (hydroxyl value 31mgKOH / g) 100kg, propylene glycol adipate\butylene glycol ester copolyethylene glycol (hydroxyl value 21mgKOH / g) 100kg, PPG 2000 (hydroxyl value 56mgKOH / g ) 150kg, diphenylmethane diisocyanate (MDI-100) 75kg, polyacrylate resin ((BR-113)) 75kg, tetrakis [β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionic acid ] Pentaerythritol ester (antioxidant 1010) 2kg, dibutyl hydroxytoluene (antioxidant BHT) 2kg, catalyst dibutyltin dilaurate 1kg, ketimine latent curing agent A 50kg.

[0087] Preparation:

[0088] (1) Take each raw material by the above weight;

[0089] (2) Add butanediol succinate diol, propylene glycol adipate\butylene glycol ester copolymerized diol and PPG2000 to the mixer and mix evenly, heat up to 80°C, add polyacrylate resin (BR-113), and then Raise the temperature to 120°C, remove water for 2 hours under vacuum until the...

Embodiment 3

[0094] Reactive polyurethane hot melt adhesives, made from the following raw materials by weight:

[0095] Butylene adipate diol (hydroxyl value 31mgKOH / g) 100kg, propylene glycol adipate\butylene glycol ester copolyethylene glycol (hydroxyl value 21mgKOH / g) 100kg, PPG 2000 (hydroxyl value 56mgKOH / g ) 150kg, diphenylmethane diisocyanate (MDI-100) 75kg, polyacrylate resin ((BR-113)) 75kg, tetrakis [β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionic acid ] Pentaerythritol ester (antioxidant 1010) 2kg, dibutyl hydroxytoluene (antioxidant BHT) 2kg, catalyst dibutyltin dilaurate 1kg, ketimine latent curing agent B 60kg.

[0096] Preparation:

[0097] (1) Take each raw material by the above weight;

[0098] (2) Add butanediol succinate diol, neopentyl glycol adipate\butylene glycol ester copolymerized diol and PPG2000 into the mixer and mix evenly, heat up to 80°C, add polyacrylate resin (BR-113 ), then heat up to 120°C, remove water for 2 hours under vacuum until the water content ...

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Abstract

The invention discloses a ketimine latent curing agent. A general formula of the ketimine latent curing agent is shown in the specification, wherein R1 is any one selected from C1 to C16 alkyl, aryl and cycloalkyl, R2 is any one selected from C1 to C6 alkyl, aryl and cycloalkyl, R3 is any one selected from alkyl, aryl, cycloalkyl, polyethylene oxide and polypropylene oxide, and n is 1 to 8. The invention also discloses a reactive polyurethane hot melt adhesive. The hot melt adhesive is prepared by mixing polyurethane resin and the above ketimine latent curing agent. More environmentally friendly and safer ketimine is used as a the latent curing agent, the reactive polyurethane hot melt adhesive prepared by using the latent curing agent has the advantages of a high solid content, short opening time, high shear strength, strong adhesion, a long validity period, environmental protection and safety.

Description

technical field [0001] The invention relates to the technical field of materials, and more specifically relates to a ketimine latent curing agent and a reactive polyurethane hot-melt adhesive with it and its application. Background technique [0002] Reactive polyurethane hot melt adhesive is widely used in the bonding of metal, wood, paper, plastic and other materials due to its advantages of high bonding strength, wide application range of substrates, and high cost performance. With the continuous deepening of my country's industrialization process, the use of reactive polyurethane hot melt adhesives is becoming more and more extensive, and the consumption is increasing. According to incomplete statistics, the consumption of reactive polyurethane hot melt adhesives in 2018 has increased by more than 40% compared with 2017. Much higher than other types of hot melt adhesive or adhesive products, it can be seen that high-grade reactive polyurethane hot melt adhesive will play ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G18/32C09J175/08C09J175/06C07C251/08C07C249/02
CPCC07C251/08C08G18/3256C09J175/06C09J175/08
Inventor 耿志忠董彦林张弘胤曹贵昌魏小刚
Owner 北京长润化工有限公司
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