A preparation method of nano needle tip with controllable crystal orientation and size

A crystal orientation and needle tip technology, applied in nanotechnology and other directions, can solve the problems of uncontrollable nano single particle grain structure and size, and difficult calculation of the contact state between particles and needle tip, so as to facilitate analysis and processing operations, and achieve controllability. Effect

Active Publication Date: 2021-04-06
SHAANXI UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the nanoparticles obtained by this method are highly accidental, and the grain structure and size of the single nanoparticle cannot be controlled, and the contact state between the particle and the needle tip is difficult to calculate, which will cause large experimental errors.

Method used

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  • A preparation method of nano needle tip with controllable crystal orientation and size
  • A preparation method of nano needle tip with controllable crystal orientation and size
  • A preparation method of nano needle tip with controllable crystal orientation and size

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] CeO prepared in this example with controllable crystal orientation and size 2 Nano needle tip size r=120nm, the preparation method comprises the following steps:

[0037] 1) Cut the cerium oxide block material prepared in the previous stage into a cuboid of 5mm×1mm×1mm by machining. Then use manual grinding and polishing to process the shape into a needle point shape. In order to match the TI950 indenter seat, the size of the thickest end of the needle point should not exceed 0.2 mm, and the tip size should be processed to 50 μm.

[0038] 2) Manually place the CeO under a standing microscope 2 The micron needle tip is inserted into the indenter seat, fixed with metal thermosetting glue, and the micron needle tip and the indenter seat are put into the FIB vacuum chamber together.

[0039] 3) Use the EBSD probe in the FIB system to analyze and test the crystal orientation of the micron tip, and select suitable grains for processing.

[0040] 4) Use a gallium ion beam w...

Embodiment 2

[0043]CeO prepared in this example with controllable crystal orientation and size 2 Nano tip size r=180nm, the preparation method comprises the following steps:

[0044] 1) Firstly, the cerium oxide bulk material prepared in the previous stage is cut into a 5mm×1mm×1mm cuboid by machining. Then use manual grinding and polishing to process the shape into a needle point shape. In order to match the TI950 indenter seat, the size of the thickest end of the needle point should not exceed 0.2 mm, and the tip size should be processed to 50 μm.

[0045] 2) Manually place the CeO under a standing microscope 2 The micron needle tip is inserted into the indenter seat, fixed with metal thermosetting glue, and the micron needle tip and the indenter seat are put into the FIB vacuum chamber together.

[0046] 3) Use the EBSD probe in the FIB system to analyze and test the crystal orientation of the micron tip, and select suitable grains for processing.

[0047] 4) Use a gallium ion beam w...

Embodiment 3

[0050] CeO prepared in this example with controllable crystal orientation and size 2 Nano needle tip size r=270nm, the preparation method comprises the following steps:

[0051] 1) Firstly, the cerium oxide bulk material prepared in the previous stage is cut into a 5mm×1mm×1mm cuboid by machining. Then use manual grinding and polishing to process the shape into a needle point shape. In order to match the TI950 indenter seat, the size of the thickest end of the needle point should not exceed 0.2 mm, and the tip size should be processed to 50 μm.

[0052] 2) Manually place the CeO under a standing microscope 2 The micron needle tip is inserted into the indenter seat, fixed with metal thermosetting glue, and the micron needle tip and the indenter seat are placed together in the FIB vacuum chamber and processed by gallium ion beam (vacuum degree is ~10 -6 mbar).

[0053] 3) Use the EBSD probe in the FIB system to analyze and test the crystal orientation of the micron tip, and s...

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Abstract

The invention discloses a method for preparing a nano needle tip with controllable crystal orientation and size, and belongs to the field of nano material preparation. The method includes the steps of: 1) processing the bulk material to be processed into a microrod with a needle point at one end and reaching the micron level; 2) analyzing the crystal orientation of the needle point part of the microrod, and selecting a Grains suitable for processing, and then using gallium ion beams to process the suitable crystal grains into nano needle tips with controllable crystal orientation and size. This method solves the current problem of controllable crystal orientation and size in the process of simulating single nano-particles with the help of nano-tips, and further establishes a more reasonable physical model for the contact between single nano-particles and the surface of materials, which can be widely used in the microscopic process between nanoparticles and the surface of substrate materials in the research.

Description

technical field [0001] The invention belongs to the field of nanometer material preparation, and in particular relates to a method for preparing nanometer needle tips with controllable crystal orientation and size. Background technique [0002] At present, ultra-smooth surfaces have important applications in technical fields such as precision optics, aerospace, and chip industry. Therefore, a lot of research work has been actively carried out in ultra-precision processing technology. Chemical mechanical polishing is currently the most widely used and commercialized ultra-precision polishing technology. Its essence is the flattening effect of the solid abrasive particles in the polishing liquid on the surface of the material under certain conditions. Usually, the surface to be processed needs to reach an atomic level plane. Degree, and there are strict requirements on the damage, residual stress, defects and lattice integrity of the machined surface. The current research tec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B1/00B82Y40/00
CPCB24B1/00B82Y40/00
Inventor 许宁刘琦
Owner SHAANXI UNIV OF SCI & TECH
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