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Substrate for flexible devices

A flexible device and substrate technology, applied in lighting devices, transportation and packaging, climate sustainability, etc., can solve the problems of vulnerability to impact, lack of adhesion to stainless steel substrates, easy bending, etc., to reduce air bubbles, excellent durability Improvement of bendability and adhesion

Active Publication Date: 2020-02-11
TOYO SEIKAN GRP HLDG LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in general, the coefficient of thermal expansion of silica-based glass is smaller than that of stainless steel, so it lacks adhesion to stainless steel substrates
Another problem with silica-based glasses is that they are easily bent and susceptible to impact

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0078]

[0079] In the preparation of the glass paste, the glass frit of the above glass composition is pulverized to form a glass composition powder, which is then mixed with a medium and dispersed.

[0080]The glass composition powder is obtained by mixing the glass composition, heating at a temperature of 800 to 1200° C. to form molten glass, quenching to obtain frit, and pulverizing the frit. Pulverization may be performed by any conventionally known method, and examples include JET pulverization, flash mill pulverization, and ball mill pulverization.

[0081] In order to smooth the glass surface, the average particle diameter of the glass composition powder is 20 μm or less, preferably in the range of 1 to 10 μm, more preferably in the range of 1 to 5 μm. In order to obtain a fine powder, JET comminution is preferred.

[0082] Then, the glass composition powder thus obtained is mixed with a medium and dispersed. Examples of the mixing-dispersing method include dispers...

Embodiment

[0094] 1. Stainless steel substrate

[0095] Five types of stainless steel substrates with a thickness of 0.05 mm were used.

[0096] NK-430MA: Ferritic stainless steel foil (manufactured by Nippon Kinzoku Co., Ltd.)

[0097] NCA-1: Ferritic stainless steel foil (manufactured by Nippon Steel Nisshin Co., Ltd.)

[0098] SUS430: Ferritic stainless steel foil

[0099] SUS304: Austenitic stainless steel foil

[0100] SUS316L: Austenitic stainless steel foil

[0101] For the steel substrate used in the comparative example, a steel sheet obtained by annealing and degreasing a cold-rolled sheet (thickness: 0.05 mm) of ordinary steel was prepared.

[0102] Next, the above base material (dimensions: 20 cm in length, 50 cm in width) was subjected to alkaline electrolytic degreasing and pickling by immersion in sulfuric acid.

[0103] 2. Substrate treatment

[0104] The surface of the substrate is subjected to any one of the treatments of firing-1, nickel plating and firing-2 as sh...

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Abstract

The present invention provides a substrate for flexible devices, which has excellent bending resistance and excellent surface smoothness of a glass layer surface, while exhibiting excellent antirust properties, moisture barrier properties and adhesion of a glass layer. This substrate for flexible devices is characterized by comprising: a stainless steel base material; a nickel plating layer that is formed on the surface of the stainless steel base material; and a glass layer that is formed on the surface of the nickel plating layer in the form of a bismuth glass layer having electrical insulating properties.

Description

technical field [0001] The present invention relates to a substrate for a flexible device. More specifically, the present invention relates to substrates for flexible devices that are excellent in rust prevention, moisture barrier properties, bending resistance, and adhesion of insulating layers without surface defects, and are therefore preferably suitable for use in devices related to organic EL . Background technique [0002] Substrates for flexible devices used for organic EL lighting, organic EL displays, organic solar cells, and the like are required to have barrier properties such as moisture barrier properties and gas barrier properties, as well as smoothness and insulation properties. In addition, the substrate needs to have excellent flexibility (bending resistance) so that it can be applied on a curved surface or can be manufactured in a roll-to-roll process. [0003] The following Patent Document 1 discloses the structure of an organic EL device prepared by seq...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05B33/02B32B15/04C03C8/16C23C8/12C23C28/00H01L51/50H05B33/04
CPCC03C8/16H01B3/088H05B33/22C03C8/04C23C28/32C23C28/345C23C28/325C23C28/36C23C24/08C23C8/12C03C3/066H10K77/111C23C28/322C23D5/00C25D5/48H05B33/02H05B33/04C03C2207/02H10K50/00C03C3/145C23D5/02C25D3/12C25D5/50Y10T428/12611
Inventor 南部光司宫崎俊彦升田裕久下村洋司
Owner TOYO SEIKAN GRP HLDG LTD
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