Floating gate type field effect transistor memory and manufacturing method thereof
A field effect transistor and memory technology, applied in the field of memory, can solve the problems of reduced memory performance, less obvious memory erasing and writing effects, etc., and achieves the effects of shortened voltage range, high mechanical strength, and strong oxidation resistance.
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[0039] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.
[0040] For better illustrating the present invention, facilitate understanding technical scheme of the present invention, typical but non-limiting embodiment of the present invention is as follows:
[0041] 1. Materials, reagents and instruments
[0042] Table 1-1 Main reagent information of the experiment
[0043]
[0044] Table 1-2 Experimental instruments and equipment
[0045]
[0046] 2. Device construction process
[0047] (1) Making a silicon wafer substrate
[0048] In this experiment, a silicon oxide wafer with an oxide layer thickness of 90nm was used as the substrate of the device. In order to facilitate the fabrication of the device, it is first necessary to cut the silicon wafer into 2×2cm with a silicon knife. 2 A small square silicon wafer, and then cleaned to obtain a clean...
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