Zirconia ceramic backboard and processing method thereof

Abstract

The invention relates to a processing method of a zirconia ceramic backboard. The processing method at least comprises the following steps: mixing and grinding a material which is required for preparing a ceramic layer matrix and is prepared taking a yttrium-stabilized zirconium oxide material as a framework material, and carrying out powder forming to obtain a ceramic layer biscuit; carrying outsurface modification on the ceramic layer biscuit for at least one time so as to stably compound a thermosetting transition layer which has the thickness of more than nanometer and is used for transmitting stress on the surface of the ceramic layer biscuit; obtaining a memory deformation layer which has the thickness of more than nanometer and is used for applying stress, and carrying out surfacemodification on the memory deformation layer for at least one time so that the memory deformation layer can be stably compounded on the surface of the thermosetting transition layer; forming a multi-layer composite structures among the memory deformation layer, the thermosetting transition layer and the ceramic layer biscuit; under certain physical or chemical stimulation, driving the multi-layercomposite structure by a memory deformation layer to form an expected bending radian, and carrying out size and surface processing on the structure to obtain the zirconia ceramic backboard.

Description

technical field [0001] The invention relates to the technical field of mobile phone back plates, in particular to a zirconia ceramic back plate and a processing method thereof. Background technique [0002] As a mobile phone backplane, its material is required to have less shielding of electronic signals and high strength, followed by aesthetic requirements. Likewise, the backplanes of other electronic devices also have the same requirements. The backplane materials of mobile phones are mainly plastic, metal, glass and ceramics. Due to its good appearance, texture, heat dissipation, and toughness, the metal backplane can meet the requirements of thinner and lighter mobile phones, and is currently the mainstream configuration of mid-to-high-end mobile phones. With the advent of the era of 5G networks and wireless charging, smartphones have higher and higher requirements for signal transmission, and metal backplanes have a greater effect on signal shielding. The current main...

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Problems solved by technology

[0007] However, due to the methods for preparing zirconia ceramics provided by the above-mentioned patents in the prior art, most of them adopt dry pressing and injection molding, and dry pressing and injection molding are only suitable for forming thick parts with a thickness greater than 1 mm. Common plastic mobile phone cases It is only 0.4mm. The above

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