Preparation method of nanoscale ultra-pure silicon oxide microsphere powder

Abstract

The invention discloses a preparation method of nanoscale ultra-pure silicon oxide microsphere powder. The preparation method comprises the steps: putting silicon into a first container which is madeof graphite, putting the first container into an airtight reaction cavity with the environment temperature of 50-150 DEG C, connecting the first container with an anode of a current controller, and connecting a cathode of the current controller with an electronic gun; making the electron gun generate electron beams to bombard the silicon by controlling the current controller, and enabling the silicon to generate silicon steam molecules; and after the silicon steam molecules reach a certain pressure in the reaction cavity, introducing oxygen in a corresponding proportion into the reaction cavity, controlling the working reaction pressure in the reaction cavity to be 2*10<-3>-5*10<-3> Pa, and carrying out a reaction to obtain the silicon oxide microsphere powder. Silicon is bombarded by theelectron beams to generate the silicon steam molecules, the silicon steam molecules are combined with ultra-pure oxygen having the corresponding proportion and introduced into the reaction cavity to react, and due to intermolecular combination, the formed microspheres are small in particle size, good in roundness, low in energy consumption and high in production efficiency.

Description

technical field [0001] The invention relates to the technical field of nanomaterial powder preparation, in particular to a preparation method of nanoscale ultra-high-purity silicon oxide microsphere powder. Background technique [0002] In the field of electronic packaging, 97% of semiconductor devices all use epoxy molding compound (EMC) as the packaging outer material, and the key insulating filling material in epoxy molding compound is silicon oxide microsphere powder, silicon oxide microsphere powder It accounts for more than 70% of the entire epoxy molding compound, and more than 90% for many high-end chips. With the global demand for electronic products increasing year by year, the demand for silica microsphere powder is also increasing year by year. In addition, silicon oxide microsphere powder is also used in the insulating layer filler of electronic copper-clad circuit board (CCL) in the field of electronic circuits, and the demand is also increasing. With the mini...

AI Technical Summary

Problems solved by technology

The preparation and operation technology of this method is still relatively complicated, the steps are relatively cumbersome, the roundness of the powder is poor, and the uniformity of the particles is poor.

[0005] Therefore, the traditional silicon oxide microsphere powder material is subject to certain restrictions in the application field, and it is difficult to develop better in the field of electronic technology packaging in the post-Moore's Law era.

Images