Thermosetting resin composition and application thereof

Abstract

The invention discloses a thermosetting resin composition and an application thereof. The thermosetting resin composition comprises a first resin compound, a second resin compound and a third resin compound, wherein the first resin compound comprises a thermosetting phenolic resin and a first reinforcing fiber; the second resin compound comprises epoxy resin, flame-retardant epoxy resin, a latentcuring agent, vegetable oil modified resin, thermoplastic resin, a second reinforcing fiber, a common filler, a heat-conducting filler, a plasticizer and an accelerant; and the third resin compositioncomprises the epoxy resin, the flame-retardant epoxy resin, the latent curing agent, the vegetable oil modified resin and the accelerant. The fillable amount of the filler in a copper-clad plate produced from the thermosetting resin composition is increased, so the problem that the copper-clad plate cannot be developed towards the directions of multifunctionalization, high performance and high reliability due to no further filling with the functional filler because of small pores and low porosity of the reinforcing fibers is solved.

Description

technical field [0001] The application relates to the technical field of metal foil-clad laminates, in particular to a thermosetting resin composition. The application also relates to prepregs, laminates and laminates for printed circuits made of the thermosetting resin composition. Background technique [0002] CEM-1 Copper Clad Laminate is widely used in various electronic and electrical products as the insulating substrate of printed circuit boards. As people pay more and more attention to the safety and reliability of electronic and electrical products, corresponding, new and higher requirements are put forward for the safety and reliability of CEM-1 copper clad laminates. Such as: high heat resistance, high thermal conductivity, high dimensional stability, high tracking resistance, high resistance to silver ion migration, etc. are important indicators to measure the high reliability of copper clad laminates. [0003] However, CEM-1 copper-clad laminates use glass fiber...

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Problems solved by technology

[0004] Generally, the unit weight of wood pulp paper prepreg is 200-600g / m2, the glue content is 40-70%, and the filler filling rate is 0-20%. Saturated, but floating on the surface of the reinforcing material, the resin composition on the floating surface will be squeezed out in a large amount during the compression molding process, resulting in slippage and movement between the prepregs, uneven distribution of the resin composition inside the board, and poor performance. Consistency, stability and apparent deterioration of the plate

[0005] When the amount of filler in the resin composition increases, the permeability of the resin composition decreases, causing most of the filler to be blocked on the surface of the reinforcing material, and the filler that cannot be impregnated inside the reinforcing material forms a stacked layer at the interface between the prepreg layers, Severely weaken the bonding force and compactness between the reinforcing materials, making the copper clad laminate easy to blister and delaminate or stress crack from the interface under high temperature or mechanical force

The failure of functional fillers to further increase the filling rate hinders the development of copper-clad laminates in the direction of multi-function, personalization, high performance, and high reliability.

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