Method for growing single-layer telluride doping structure through impulse type injection of reactants
A pulsed injection and reactant technology, applied in coating, gaseous chemical plating, metal material coating process, etc., can solve the problems of immature preparation process, low yield, unsuitable for large-area production, etc., and achieve growth conditions. Accurate and controllable, simple and convenient operation, broad application prospects
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Embodiment 1
[0011] A clean silicon substrate of 100 square centimeters is placed in the deposition reaction chamber, the reaction pressure is controlled at 300 torr, and the reaction temperature is 900°C; the carrier gas is pulsed into the chamber to inject molybdenum hexacarbonyl tungsten hexacarbonyl and diethyl tellurium, Set the carrier gas flow rate to 500 cubic centimeters per second, the pulse injection time of molybdenum hexacarbonyl to 1 minute, the pulse injection time of tungsten hexacarbonyl to 7 seconds, and the pulse injection time of diethyl tellurium to 3 minutes. A total of 200 cycles were injected, and the deposition obtained Monolayer Mo 0.9 W 0.1 Te 2 .
Embodiment 2
[0013] A clean silicon substrate of 6 square centimeters was placed in the deposition reaction chamber, the reaction pressure was controlled at 40 torr, and the reaction temperature was 600°C; the carrier gas was injected into the chamber in a pulsed manner, molybdenum hexacarbonyl tungsten hexacarbonyl and diethyl tellurium, Set the carrier gas flow rate to 60 cubic centimeters per second, the pulse injection time of molybdenum hexacarbonyl to 30 seconds, the pulse injection time of tungsten hexacarbonyl to 10 seconds, and the pulse injection time of diethyl tellurium to 2 minutes. A total of 400 cycles were injected, and the deposition obtained Monolayer Mo 0.8 W 0.2 Te 2 .
Embodiment 3
[0015] Place a 54 square centimeter clean silicon substrate in the deposition reaction chamber, control the reaction pressure at 230 Torr, and the reaction temperature at 710°C; pulse molybdenum hexacarbonyl, diethylsulfur and diethyl For tellurium, set the carrier gas flow rate to 80 cubic centimeters per second, the pulse injection time of molybdenum hexacarbonyl to 1 minute, the pulse injection time of diethylsulfur to 30 seconds, and the pulse injection time of diethyl tellurium to 4 minutes, and a total of 800 cycles of injection , the deposition of monolayer MoS 0.4 Te 1.6 .
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