Solid dielectric for filter and its surface metallization process and dielectric filter

Abstract

The invention discloses a solid medium for a filter, which includes a solid medium body, and is characterized in that it also includes a conductor structure arranged on the surface of the solid medium body, and the conductor structure at least includes a first A conductive metal layer and a second conductive metal layer for the surface soldering layer; the first conductive metal layer is located on the surface of the solid medium body; the second conductive metal layer is located on the surface of the first conductive metal layer; the first conductive metal layer layer and the second conductor metal layer are conductor layers of different metal materials. The invention also discloses a solid medium surface metallization process and a dielectric filter. The solid medium of the present invention realizes the replacement of various metals by setting a multi-layer conductor layer structure, reduces the cost and protects the conductor layer actually used for signal transmission from damage, thereby ensuring the signal transmission performance of the solid medium.

Description

technical field [0001] The invention relates to the technical field of communication, in particular to a solid medium used for a filter, its surface metallization process and a dielectric filter. Background technique [0002] Wireless mobile communication base stations are an important physical support for modern communication systems. In order to filter or delete specific frequency signals in the communication process, each base station in the communication network is required to have strong signal processing capabilities to ensure that signal transmission does not appear to be distorted. Microwave filter is a key device for signal processing in base stations, and the improvement of its performance determines the improvement of communication quality and the development direction of communication technology. At present, the miniaturization of filters is one of the key technologies for the development of wireless communication base stations, and the solid dielectric body with...

AI Technical Summary

Problems solved by technology

However, the matching degree of thermal expansion coefficient and lattice constant between silver and microwave ceramics is not high. In order to strengthen its adhesion on the surface of solid media, it is necessary to increase the thickness appropriately, which will inevitably lead to high manufacturing costs; on the other hand , the metal silver conductor layer is directly exposed on the outer surface of the medium, which is easy to be worn and corroded, which will affect the signal transmission performance of the solid medium when it is used as a dielectric filter; There will be interface reaction, diffusion or deformation between the electrodes, which will easily cause defects such as cracking and delamination of the metal film layer, and reduce the performance of the device; therefore, there is currently no scheme to replace precious metals with multi-layer metal layers

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