Heating ceramic tile and preparing method thereof

A ceramic tile and heating paint technology, applied in the field of materials, can solve the problems of long heating time, unsuitable for batch production, unstable heat transfer, etc., and achieve the effect of easy laying

Inactive Publication Date: 2020-04-10
佛山裕德天智科技合伙企业(有限合伙)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the lack of good thermal conductivity of wood in the floor heating floor on the market, there are common problems in the industry such as long heating time, uneven temperature distribution, and unstable heat transfer.
In order to improve the heat conduction performance of the floor, related domestic enterprises set up a metal heat conduction layer structure in the middle of the multi-layer solid wood floor, which not only increases the thickness, weight and cost of the floor, but also affects the texture of the floor
[0003] Graphene itself has good thermal conductivity, and its unique two-dimensional crystal structure endows graphene with a large specific surface area. In the prior art, a

Method used

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  • Heating ceramic tile and preparing method thereof

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Effect test

preparation example Construction

[0024] Please refer to figure 1 , a method for preparing a heating tile provided in an embodiment of the present invention, comprising the following steps:

[0025] S1 uses the unpacking machine to unpack the tiles. The unpacking machine includes a positioning system and a dismantling robot arm. The size of the tiles is calculated through the positioning system, and the robotic arm is further driven to perform dismantling actions. The tiles of different specifications and sizes are passed through the unpacking machine. Disassemble the outer packaging, put it on the conveyor belt and send it to the next process. The size of the tiles involved is from 1mm*1mm-1200mm*2400mm. After that, use the shower head to clean the tiles, and remove the particles and dust on the back of the tiles. The spray head pumps water mist with a certain pressure through the booster pump, so that the particles on the tiles are dissolved or taken away by the flowing droplets, and the cleaned tiles are ...

Embodiment 1

[0032] A method for preparing a heating tile according to this embodiment comprises the following steps:

[0033] S1 Unpack the 120mm*120mm tiles, and then use the spray head to clean the tiles, remove the particles and dust on the back of the tiles, and blow the cleaned tiles with high-pressure air until the surface is completely dry until;

[0034] S2 Use an ultrasonic kettle to mix the fluorinated graphene and water-based silicone resin by ultrasonic stirring. The ultrasonic time is 100Min and the ultrasonic power is 500W. Then the material is sent into the reactor for high-shear dispersion. After completion, the material is sent to the centrifuge to settle the poorly dispersed particles. Wherein the centrifugal speed of the centrifuge is 1000rpm, and the duration is 10min, and then the heating coating is obtained.

[0035] S3 introduces the carbon conductive tape into the surface of the tiles by using a photolithography coater through mask spraying, the wiring thickness ...

Embodiment 2

[0040] A method for preparing a heating tile according to this embodiment comprises the following steps:

[0041]S1 Unpack the 80mm*80mm tiles, and then use the spray head to clean the tiles, remove the particles and dust on the back of the tiles, and blow the cleaned tiles with high-pressure air until the surface is completely dry until;

[0042] S2 Use an ultrasonic kettle to mix the graphene material and water-based silicone resin by ultrasonic stirring. The ultrasonic power is 400W for 80 minutes, and then the material is sent to the reactor for high-shear dispersion. Send the material into the centrifuge to settle the poorly dispersed particles. Wherein the centrifugal speed of the centrifuge is 1000rpm, and the duration is 10min, and then the heating coating is obtained.

[0043] S3 introduces conductive carbon black into the surface of the ceramic tile by using a direct-writing photolithography machine through mask spraying, the wiring thickness is 100u, and the wirin...

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Abstract

The invention discloses a preparing method of a heating ceramic tile. The method includes the following steps of S1, cleaning and blow-drying the ceramic tile; S2, ultrasonically mixing graphene/functional graphene with water-based organic silicon resin through an ultrasonic kettle, immediately performing high-shearing dispersion through an emulsifying machine, and performing centrifugal purification through a centrifugal machine after high-shearing dispersion is completed to obtain heating paint; S3, photoetching and introducing a conductive material to the surface of the ceramic tile througha photoetching coating machine to form a conductive path of a special structure so as to obtain a ceramic tile with an introduced wiring layer; S4, spray-coating the ceramic tile with the heating coating through a pressure spraying nozzle, and then thermo-curing a heating layer through a thermo-curing machine to obtain a ceramic tile with a coated heating coating; and S5, spray-coating the ceramic tile with protection layer coating through a pressure spraying nozzle to form a protection layer, and completing illumination through a light curing machine to obtain the heating ceramic tile. The invention meanwhile discloses the heating ceramic tile. The heating ceramic tile has the advantages of being easy to lay, little occupying storey height, stopping combustion and preventing fire, beingfree of thermal runaway and capable of performing heating under the driving of low voltage and the like.

Description

technical field [0001] The invention belongs to the technical field of materials, and in particular relates to a heating tile and a preparation method thereof. Background technique [0002] With the gradual improvement of people's demand for heating functionality and comfort in winter, floor heating floors are gradually becoming well-known and accepted by the public in my country, and the heating forms are constantly being innovated. At present, the research and development of underfloor heating floors focus on the anti-deformation ability and heat-generating layer materials and structures, while ignoring the heat conduction ability of the floor itself. It usually takes a lot of energy and time to slowly heat up the floor and indoor space. The thermal conductivity of wood is low, generally 0.04-0.12W / (m·K), and it is not easy to dissipate heat or conduct heat. Due to the lack of good thermal conductivity of wood in the floor heating floor on the market, there are common pro...

Claims

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Application Information

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IPC IPC(8): E04F15/02E04F15/18B05D7/24B05D1/02B05D3/02B05D3/04B05D3/06B05D5/00B05D7/00
CPCB05D1/02B05D3/0254B05D3/0263B05D3/0413B05D3/067B05D5/00B05D7/24B05D7/534B05D7/536E04F15/02E04F15/18E04F2290/023E04F2290/045
Inventor 李振邦
Owner 佛山裕德天智科技合伙企业(有限合伙)
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