A packaged substrate distributed antenna

Abstract

The invention belongs to the antenna field of electronic communication technology, and relates to a packaged substrate distributed antenna. The antenna structure is distributed and designed on the package and the substrate, and the low-loss interaction of the electromagnetic signal from the package to the substrate is realized through the coupling inside the antenna instead of the conductor connection. The package and the substrate are interconnected through electromagnetic coupling; through the radiation structure integrated in the substrate, the electromagnetic wave coupled from the package is radiated in a specific way. The packaged substrate distributed antenna is multiplexed by changing the substrate, and without changing the package, the radiation structure on the substrate is changed to realize the multiplexing of the packaged substrate distributed antenna. The invention reduces the loss of the internal interconnection of the antenna, solves the limitation of the working frequency band of the chip-packaged distributed antenna, makes it possible to realize the distributed antenna of the millimeter-wave low-frequency band, and brings more design freedom and flexibility to the design of the millimeter-wave antenna At the same time, it reduces the design cycle and cost of millimeter-wave integrated antennas, and realizes the reuse of packaging designs.

Description

technical field [0001] The invention belongs to the antenna field of electronic communication technology, and relates to a packaged substrate distributed antenna. Background technique [0002] Antennas are an integral part of any wireless system and come in both discrete and integrated forms. Split antennas are the most common form of traditional wireless systems. In the millimeter-wave frequency band, the integration of wireless systems based on separate antennas is low, and the front-end and antennas need to be interconnected multiple times, causing large losses and degrading system performance. In recent years, with the advancement of technology, high integration has become the development trend of wireless systems, and integrated antennas just follow this trend. It overcomes the problems of separate antennas and provides a good solution for system-level wireless chips. The antenna solution is very suitable for applications in the mmWave frequency band. Current integra...

AI Technical Summary

Problems solved by technology

[0006] 1. Encapsulated antenna: Due to the limitation of interconnection loss, it is difficult to apply to the middle and high frequency bands of millimeter waves;

[0007] 2. On-chip antenna: If the high-resistance silicon lens solution is used, the substrate surface wave loss can be avoided and high gain can be achieved, but the lens is large in size and high in profile, which also makes it difficult to package the chip; if other solutions are used, it is limited by the on-chip antenna Aperture and loss, the gain will be very limited;

[0008] 3. Chip-packaged distributed antenna: limited by the size of the chip and package, it is only applicable to the high frequency band of millimeter wave and the terahertz frequency band, and cannot be applied to the low frequency band of millimeter wave (such as the 5G millimeter wave frequency band);

If the application changes, the antenna needs to be redesigned, which limits the application range of the antenna

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