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Thin film material and preparation method of thin film material

A technology of thin film materials and compounds, applied in the field of thin film materials and their preparation, can solve the problems that the heat resistance, mechanical properties and optical properties of polymer thin film materials are difficult to meet at the same time, and achieve the effect of improving heat resistance

Active Publication Date: 2021-11-02
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The application provides a film material and its preparation method, which is used to solve the problem that the heat resistance, mechanical properties and optical properties of the existing polymer film materials are difficult to meet the requirements of the flexible substrate material used for the display panel at the same time question

Method used

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  • Thin film material and preparation method of thin film material
  • Thin film material and preparation method of thin film material
  • Thin film material and preparation method of thin film material

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0088] see figure 1 , the preparation method of the film material comprises:

[0089] S1. In the first container, compound A reacts with the first reactant to form compound B.

[0090] S2. In the second container, the compound B reacts with the second reactant to form compound C.

[0091] S3. In a third container, the compound C reacts with a third reactant to form a polymer D.

[0092] S4. In the fourth container, the polymer D is reacted to obtain a second mixture including polymer F or polymer H.

[0093] S5. The solution including the polymer F or the solution including the polymer H forms the polymer F or the polymer H on the substrate.

[0094] Wherein, the general structural formula of the compound A is:

[0095]

[0096] The general structural formula of the polymer F is:

[0097]

[0098] The general structural formula of the polymer H is:

[0099]

[0100] Among them, R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 It is one of hydrogen atom or a...

Embodiment 1

[0193] S1. In the first container, compound A reacts with the first reactant to form compound B.

[0194] In this embodiment, step S1 includes:

[0195] S11. A first container is provided, and the first container includes 12 mL-50 mL of trifluoroacetic acid dissolved with 0.3-1.1 mol of the compound A.

[0196] In this embodiment, the compound A can be:

[0197]

[0198] S12. Add 2-5 mL of trifluoroacetic acid solution containing 0.1-2.5 mol of sodium nitrite dropwise into the first container, and form compound B1 at 25° C. for 12-30 minutes.

[0199] S13. Add 100 ml of deionized water into the first container, stir well and let it stand still.

[0200] S14. Adding dichloromethane into the first container, extracting, collecting the organic layer and rotary evaporating to obtain the first crude product including the compound B1 or the compound B2.

[0201] S15. The first crude product was rinsed with a mixed solution of dichloromethane and petroleum ether with a volume r...

Embodiment 2

[0238] This embodiment is the same or similar to Embodiment 1, except that:

[0239] In this embodiment, step S12 includes:

[0240] Add 2-5 mL of trifluoroacetic acid solution containing 0.1-2.5 mol of sodium nitrite into the first container at one time, and form compound B2 at 25° C. for 12-30 minutes.

[0241] The structural formula of the compound B2 is:

[0242]

[0243] In this embodiment, the structural formula of the compound C is:

[0244]

[0245] In this embodiment, the structural formula of the compound D is:

[0246]

[0247] In this embodiment, the structural formula of the compound H is:

[0248]

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Abstract

The application proposes a film material and a preparation method thereof. The preparation method of the thin film material comprises: in the first container, compound A reacts with the first reactant to form compound B; in the second container, the compound B reacts with the second reactant to form compound C; in the third container In, the compound C and the third reactant react to form polymer D; in the fourth container, the polymer D is reacted to obtain a second mixture comprising polymer F or polymer H; comprising the polymer A solution of F or a solution comprising said polymer H forms polymer F or polymer H on a substrate. The present application prepares a polyimide film material with a pyridine ring as the main chain structure through a new preparation method of the film material, which effectively improves the heat resistance, mechanical properties and optical properties of the polyimide film material.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a thin film material and a preparation method thereof. Background technique [0002] OLED is an Organic Light-Emitting Diode (Organic Light-Emitting Diode), which has the characteristics of self-illumination, high brightness, wide viewing angle, high contrast, flexibility, and low energy consumption. Therefore, OLED display panels, especially flexible OLED display panels, have received extensive attention. . [0003] The heat resistance, mechanical properties and optical properties of existing polymer film materials used as substrate materials for flexible OLED display panels are difficult to meet the requirements as substrate materials at the same time. [0004] Therefore, there is an urgent need for a new thin film material and a preparation method of the thin film material to solve the above technical problems. Contents of the invention [0005] This application...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C08J5/18C08L79/08
CPCC08G73/1085C08J5/18C08J2379/08
Inventor 汪亚民
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD