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Acrylic resin composition

A technology of acrylic resin and composition, applied in the field of acrylic resin composition, can solve problems such as poor hardness and strength, etc., and achieve the effects of improving performance, reducing energy consumption and good flexibility

Active Publication Date: 2020-05-08
COLLTECH DONGGUAN BONDING TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in recent years, with the vigorous development of science and technology, people's requirements for living standards are getting higher and higher. Because traditional acrylic resins also have certain defects in the application process, such as poor hardness and strength, the traditional Acrylic resins can no longer meet the needs of industrial production

Method used

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  • Acrylic resin composition
  • Acrylic resin composition
  • Acrylic resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Preparation of modified acrylic resin:

[0046] The reactor is placed on the stirrer, and 20 grams of tris (2-hydroxyethyl) isocyanurate, 11 grams of acrylic acid, 5 grams of acetic acid, 25 grams of toluene, 6 grams of n-heptane, 1.5 gram p-toluenesulfonic acid, 0.1 gram hydroquinone. The temperature of the reactor was raised to 80° C. and stirred for 1 hour, and then the temperature of the reactor was raised to 115° C. and stirred for 4 to 6 hours to obtain the product. The product was cooled to room temperature, washed three times with deionized water, distilled under reduced pressure to remove the solvent in the product, and filtered to obtain the modified acrylic resin.

[0047] Preparation of acrylic resin composition:

[0048] Get 10 grams of the above-mentioned modified acrylic resin, add 3 grams of isobornyl acrylate, add 0.25 grams of (2-ethylhexanoic acid) tert-butyl peroxide, 0.3 grams of silicon dioxide, stir for degassing, and then put Put it into an ov...

Embodiment 2

[0050] Preparation of modified acrylic resin:

[0051] The reactor is placed on the stirrer, and 20 grams of tris (2-hydroxyethyl) isocyanurate, 18.6 grams of bisphenol F type epoxy resin, 0.025 grams of vitriol oil, 30 grams of toluene are added successively in the reactor to 130°C, stirred for 4-6 hours, cooled the reactor to 80°C, and added 0.08 g of p-tert-butylphenol, 0.04 g of hydroquinone, 1 g of p-toluenesulfonic acid, and 8 g of cyclohexane into the reactor , stirred for 10 min, then added 6.56 g of methacrylic acid and 11.3 g of n-octanoic acid, raised the temperature to 125° C., and stirred for 4 to 6 hours to obtain the product. The product was cooled to room temperature, washed three times with deionized water, distilled under reduced pressure to remove the solvent in the product, and filtered to obtain the modified acrylic resin.

[0052] Preparation of acrylic resin composition:

[0053] Get 10 grams of the above-mentioned modified acrylic resin, add 3 grams of ...

Embodiment 3

[0055] Preparation of modified acrylic resin:

[0056] The reaction vessel is placed on the stirrer, and 20 grams of tris (2-hydroxyethyl) isocyanurate, 8.53 grams of methacrylic acid, 8.24 grams of n-octanoic acid, 25 grams of toluene, 6 grams of n-heptyl are added successively in the reactor Alkanes, 0.36 grams of p-toluenesulfonic acid, 0.1 grams of hydroquinone. The reactor was heated to 80° C., stirred for 1 hour, then heated to 100° C., stirred for 2 to 3 hours, then cooled to room temperature and subjected to water removal treatment. Then add 30 grams of isocyanate-terminated polyurethane prepolymer and 0.02 grams of environment-friendly catalyst into the reactor, and stir for 3-4 hours to obtain the product. Wash the product three times with deionized water, distill under reduced pressure, remove the solvent in the product, and filter to obtain the modified acrylic resin.

[0057] Preparation of acrylic resin composition:

[0058] Get 10 grams of the above-mentioned...

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Abstract

The invention belongs to the technical field of high polymer materials, and particularly relates to an acrylic resin composition. The acrylic resin composition is prepared from the following raw materials in parts by mass: 50-90 parts of modified acrylic resin, 10-40 parts of an active diluent, 1-30 parts of filler and 1-6 parts of a thermal initiator. The modified acrylic resin is formed by polymerizing tri(2-hydroxyethyl)isocyanurate, organic acid or organic alcohol containing carbon-carbon double bonds, and organic acid, organic alcohol, organic amine, polyurethane or epoxy resin. The modified acrylic resin composition prepared from the modified acrylic resin prepared in the invention can be rapidly cured at a low temperature, so the curing rate of the acrylic resin composition at a lowtemperature is improved, and the application range of the acrylic resin composition is broadened.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to an acrylic resin composition. Background technique [0002] Acrylic resin is widely used because of its light color, high transparency, full brightness, tough coating film, strong adhesion, and corrosion resistance. But the thermosetting temperature of traditional acrylic resin is generally 100-140°C. Acrylic resins can only be cured at higher temperatures, which not only consumes a lot of energy, but also limits the application of acrylic resins in non-high temperature fields. For example, when the acrylic resin composition is used as a coating on glass, the acrylic resin composition needs to be cured at 100-140° C., but this temperature may cause cracks to appear when the glass is cooled suddenly at a higher temperature. Therefore, reducing the curing temperature of the acrylic resin so that the acrylic resin can be cured quickly at a lower temperature i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F220/36C08F222/22C08F220/18C08K3/36C08F283/10C08F222/14C08F283/00
CPCC08F220/36C08F222/22C08F283/008C08F283/105C08K3/36
Inventor 库斌黄成生
Owner COLLTECH DONGGUAN BONDING TECH CO LTD
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