Organic bentonite modified high-strength high-heat-resistance epoxy molding compound for semiconductor packaging and preparation method thereof

An epoxy molding compound, semiconductor technology, applied in the directions of epoxy resin glue, non-polymer adhesive additives, adhesive types, etc., can solve problems such as high cost, and achieve low cost, high reliability, and motion resistance. intensified effect

Active Publication Date: 2020-05-08
江苏中科科化新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The technical problem to be solved in the present invention is to provide a high-strength and high-heat-resistant epoxy molding compound for organic bentonite modified semiconductor packaging and its preparation method in view of the high cost and the shortcomings of the prior art

Method used

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  • Organic bentonite modified high-strength high-heat-resistance epoxy molding compound for semiconductor packaging and preparation method thereof
  • Organic bentonite modified high-strength high-heat-resistance epoxy molding compound for semiconductor packaging and preparation method thereof
  • Organic bentonite modified high-strength high-heat-resistance epoxy molding compound for semiconductor packaging and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0087] See Table 1 for the composition of the raw material formulation of the high-strength, high-heat-resistant epoxy molding compound for organic bentonite modified semiconductor packaging in Example 1.

[0088] In this embodiment, the method for preparing organic bentonite modified semiconductor packaging with high strength and high heat-resistant epoxy molding compound is as follows:

[0089] (1) Melt 127.5g of epoxy resin SQCN 700-3 and 15g of modified organic nano-bentonite at a high temperature of 130°C, fully stir for 30min, mix well, cool, pulverize, and sieve for use.

[0090] (2) 71.25g epoxy resin and modified organic nano-bentonite mixture, 24g phenolic resin PF 8010, 2.25g ion trapping agent DHT-4C, 1.5g low stress modifier SF-8241EG, 2.25g coupling agent KH560, 1.5g accelerator 2-ethyl-4 methylimidazole, 645g fused silica, 0.75g release agent carnauba wax and 1.5g colorant carbon black were put into a high-speed mixer and mixed for 5min, and the epoxy molding co...

Embodiment 2

[0093] See Table 1 for the raw material formulation composition of the organobentonite-modified semiconductor packaging high-strength and high-heat-resistant epoxy molding compound in Example 2.

[0094] In this embodiment, the method for preparing organic bentonite modified semiconductor packaging with high strength and high heat-resistant epoxy molding compound is as follows:

[0095] (1) Melt 135g of epoxy resin SQCN 700-3 and 120g of modified organic nano-bentonite at a high temperature of 180°C, fully stir for 90min, mix well, cool, pulverize, and sieve for use.

[0096] (2) 127.5g epoxy resin and modified organic nano-bentonite mixture, 28.5g phenolic resin PF 8010, 0.75g ion trapping agent DHT-4C, 3.75g low stress modifier SF-8241EG, 3.75g coupling agent KH560 , 0.75g accelerator 2-ethyl-4 methylimidazole, 577.5g fused silica, 6g release agent carnauba wax, and 1.5g coloring agent carbon black were dropped into a high-speed mixer and mixed for 5min, and the discharge ob...

Embodiment 3

[0099] See Table 1 for the composition of raw materials of the high-strength, high-heat-resistant epoxy molding compound for organic bentonite modified semiconductor packaging in Example 3.

[0100] In this embodiment, the method for preparing organic bentonite modified semiconductor packaging with high strength and high heat-resistant epoxy molding compound is as follows:

[0101] (1) Melt 150g of epoxy resin SQCN 700-3 and 90g of modified organic nano-bentonite at a high temperature of 160°C, fully stir for 60min, mix well, cool, pulverize, and sieve for use.

[0102] (2) 120g epoxy resin and modified organic nano-bentonite mixture, 24.75g phenolic resin PF 8010, 0.75g ion trapping agent DHT-4C, 3g low stress modifier SF-8241EG, 1.88g coupling agent KH560, 1.12 g accelerator 2-ethyl-4 methylimidazole, 592.5g fused silica, 3g release agent carnauba wax, and 3g colorant carbon black were put into a high-speed mixer and mixed for 5 minutes, and the epoxy molding compound mixtur...

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Abstract

The invention provides an organic bentonite modified high-strength high-heat-resistance epoxy molding compound for semiconductor packaging. The organic bentonite modified high-strength high-heat-resistance epoxy molding compound comprises the following components, 10 to 90 parts by weight of epoxy resin, 30 to 70 parts by weight of phenolic resin, 300 to 800 parts of a solid filler, 1 to 100 parts of modified organic nano bentonite, 0.1 to 5 parts of an ion trapping agent, 0.5 to 5 parts of a low-stress modifier, 0.1 to 5 parts of a coupling agent, 0.1 to 5 parts of an accelerant, 0.1 to 10 parts of a release agent and 0.1 to 5 parts of a coloring agent. Compared with the prior art, the epoxy molding compound disclosed by the invention has the main advantages that (1) the epoxy molding compound has extremely high bending strength and glass-transition temperature; (2) the epoxy molding compound is good in packaging appearance and packaging operability, and free of bad problems such asair holes, sand holes and mold sticking; and (3) the epoxy molding compound is high in reliability and low in cost.

Description

technical field [0001] The invention relates to a high-strength and high-heat-resistant epoxy molding compound for organic bentonite modified semiconductor packaging and a preparation method thereof, belonging to the field of electronic packaging. Background technique [0002] Epoxy resin as the main resin and curing agent is cured at high temperature under the action of a curing accelerator. The combination of epoxy resin and phenolic resin is the mainstream of electronic molding compounds today. Among the above materials, silica, calcium carbonate, etc. Inorganic fillers, as well as flame retardants and various additives, can prepare plastic packaging materials that meet the needs of electronic packaging. Epoxy molding compounds have many beneficial properties and are widely used in the field of electronic packaging. [0003] However, the strength and heat resistance of ordinary epoxy molding compounds are average. In order to meet more and more high-performance packaging...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J161/08C09J11/04
CPCC09J163/00C09J11/04C08L2203/206C08L2201/08C08K2201/011C08L61/06C08K13/06C08K9/04C08K9/06C08K3/346
Inventor 李卓李海亮李刚王善学卢绪奎
Owner 江苏中科科化新材料股份有限公司
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