Method for producing ultra-thick tungsten plate through tungsten rod upsetting

Abstract

The invention discloses a method for producing an ultra-thick tungsten plate through tungsten rod upsetting. The method for producing the ultra-thick tungsten plate through tungsten rod upsetting comprises the following steps that (1) tungsten powder with the Fisher particle size being 3.0-3.5 microns is selected, and the tungsten powder is pressed into tungsten rods with a cold isostatic pressingmethod; (2) in a sintering device in a hydrogen atmosphere, heating and sintering are conducted on the tungsten rods, and tungsten rod blanks are obtained after natural cooling, wherein the highest temperature of heating and sintering is 2300-2350 DEG C, and the temperature keeping time is 6-12 h; (3) in a hydrogen molybdenum wire furnace in a hydrogen atmosphere, the tungsten rod blanks are heated, wherein the heating temperature is 1550-1580 DEG C, and the heating time is 1.5-2.5 h; (4) upsetting forging is conducted on the tungsten rod blanks on a 750 kg air hammer, and a thick tungsten plate is obtained; (5) the forged thick tungsten plate undergoes stress relief annealing in the hydrogen molybdenum wire furnace; (6) the outline of the tungsten plate is cut through wire-electrode cutting, and the ultra-thick polished tungsten plate is obtained after grinding with a surface grinding machine.

Description

technical field [0001] The invention belongs to the technical field of preparation of refractory materials, and in particular relates to a method for producing ultra-thick tungsten plates by pierce tungsten rods. Background technique [0002] Due to its high hardness, high melting point, and high density, tungsten is widely used in contemporary communication technology, electronic computers, aerospace development, medicine and health, photosensitive materials, photoelectric materials, energy materials and catalyst materials. After 2000, with the advancement of Internet technology and communication technology, semiconductor technology developed rapidly, and semiconductor wafer production capacity exploded. The ion implanter is the main equipment for the production of semiconductor wafers, and more than 30% of the parts in the arc reaction chamber of the ion implanter are composed of finished parts of metal tungsten. Therefore, polished tungsten materials of different specific...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to overcome the above-mentioned deficiencies in the prior art, and provide a method for thickly producing ultra-thick tungsten plates with tungsten rod pier, which overcomes 1: the production of ultra-thick polished tungsten plates or tungsten circular plate raw materials with a thickness of more than 30mm cannot be heated by heat. It is produced by rolling method, but the production of thick tungsten slabs by hot rolling and hot isostatic pressing has high equipment investment, complex production process, high cost, and is not easy to promote; Head cracks, cross cracks and other problems, and the cracks are easy to extend and cause the whole root to crack, and the free forging of tungsten is more difficult to realize; 3: The method of forging first and then rolling is used to produce tungsten plates, and the processing of tungsten materials needs to be forged and rolling two different deformation methods, and the final tungsten plate produced is only 15.4mm thick. This method has problems such as complicated process, long process flow and high production cost.