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Composite film packaging method of perovskite solar cell

A technology of solar cells and composite thin films, applied in circuits, electrical components, photovoltaic power generation, etc., can solve problems such as PSC failure and achieve the effect of avoiding damage

Inactive Publication Date: 2020-05-19
JILIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, these films usually have a process temperature range of 80°C to 300°C. Such a high temperature will lead to pyrolytic denaturation of the organic materials in the PSC and make the PSC invalid. Therefore, it is necessary to develop a new PSC encapsulation layer preparation process under low temperature and weak radiation conditions.

Method used

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  • Composite film packaging method of perovskite solar cell
  • Composite film packaging method of perovskite solar cell
  • Composite film packaging method of perovskite solar cell

Examples

Experimental program
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Embodiment 1

[0044] refer to figure 1 As shown, Embodiment 1 of the present invention provides a thin film encapsulation structure of a perovskite solar cell on a rigid substrate, which structure includes a rigid substrate 40, a perovskite solar cell 30 disposed on the substrate 40, and a perovskite solar cell disposed on the perovskite solar cell. On the solar cell 30 and used to protect the composite barrier layer of the perovskite solar cell 30 in the process of encapsulation and practical application, the composite barrier layer 20 (including a multi-layer laminated structure of an organic barrier layer 201 and an inorganic barrier layer 202, the uppermost One layer is an organic barrier layer 201).

[0045] Wherein, the rigid substrate 40 is a glass substrate, and the perovskite solar cell 30 is a planar perovskite solar cell in an organic metal halide perovskite solar cell (structure: glass substrate / ITO / SnO 2 / MaPbI 3 / spiro-MeOTAD / Ag). The composite barrier layer 20 includes thr...

Embodiment 2

[0056] refer to image 3 As shown, the present embodiment provides a film encapsulation structure of a perovskite solar cell on a flexible substrate, the structure includes a flexible substrate 40, and a cap set on the lower surface of the substrate for protecting the perovskite solar cell 30 during practical application. The base encapsulation barrier layer 21 is disposed on the upper surface of the perovskite solar cell 30 and used to protect the composite barrier layer 20 of the perovskite solar cell 30 during the encapsulation process. Among them, the composite barrier layer 20 includes 3 layers of organic barrier layers 201 and 2 layers of barrier layers 202 arranged between two adjacent layers of organic barrier layers. The two layers between adjacent two organic barrier layers have barrier layer 202 or not. The structure of the solar cell is: flexible substrate / Au / SnO 2 / MaPbI 3 / spiro-MeOTAD / Ag.

[0057] Specific steps are as follows:

[0058] 1) Prepare 6 PET sub...

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Abstract

The invention discloses a composite film packaging method of a perovskite solar cell, and belongs to the technical field of film packaging. The method specifically comprises the steps: using decamethylcyclopentasiloxane for diluting a mixture of two precursors of PDMS according to the mass ratio of 1: 1, spin coating the diluted viscous mixture on the upper surface and the side surface of an organic metal halide perovskite solar cell, and then forming a film formed through ultraviolet light curing; then, carrying out remote plasma treatment on PDMS, and forming a compact SiOX film; and repeating the operation for many times to obtain a PDMS / SiOX laminated structure, thereby completing the composite film packaging of the organic metal halide perovskite solar cell. All packaging processes donot need high-temperature conditions, so that damage of high temperature to the perovskite solar cell is avoided; and according to the invention, the remote plasma technology is applied, and the packaging film with high water-oxygen barrier property can be grown at a low temperature.

Description

technical field [0001] The invention belongs to the technical field of thin film packaging, in particular to a composite thin film packaging method for perovskite solar cells, that is, using remote oxygen plasma to treat polydimethylsiloxane (polydimethylsiloxane, PDMS), so that the surface part of PDMS is converted into a dense Inorganic silicon oxide (SiO x ) layer, prepared PDMS / SiO x Organic-inorganic laminated films. Background technique [0002] Perovskite solar cells (PSCs) have attracted extensive attention due to their advantages such as high carrier mobility and long carrier diffusion length. Nowadays, the power conversion efficiency (power conversion efficiency, PCE) of rigid PSC has reached about 25.2%, but its stability is the main bottleneck of the technology development and commercial application. The organic materials in PSCs are easily dissolved by reacting with moisture and oxygen in the atmosphere, which leads to poor stability of PSCs. In addition, the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/44H01L51/42H01L51/48
CPCH10K30/00H10K30/88Y02E10/549
Inventor 段羽李泽王振宇王浩然陈平
Owner JILIN UNIV
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