Spray granulation method and preparation method of microwave medium powder

A technology of spray granulation and microwave medium, which is used in the preparation of microwave medium materials and the field of spray granulation of microwave medium powder, can solve the problems of high molding pressure, easy cracking during pressing, poor fluidity of microwave medium powder, etc. The effect of forming performance, eliminating green body cracking, and improving flowability and formability

Inactive Publication Date: 2020-05-29
SHANDONG SINOCERA FUNCTIONAL MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] For this reason, the technical problem to be solved by the present invention is to provide a method for spray granulation of microwave medium powder, to solve the problem of poor fluid

Method used

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  • Spray granulation method and preparation method of microwave medium powder

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Embodiment 1

[0033] The preparation method of the microwave dielectric material described in this embodiment comprises the following steps:

[0034] (1) with CaAlO 4 Based on microwave dielectric material as an example, take CaAlO 4 Adding modified additives to the raw materials of the components for mixing to obtain a mixture, adding water accounting for 60% of the amount of the mixture and 0.5wt% dispersant for mixing, and putting them into a ball mill for ball milling for 3 hours;

[0035] (2) Put the dispersed mixture into the sand mill, use zirconium balls as the grinding medium, grind for 3-8 times, control the solid content of the slurry after grinding between 60%-65%, and obtain the required raw materials slurry;

[0036] (3) Get PEG20000 glue, PVA glue and polyacrylic acid glue, add water respectively and fully dissolve through heating, respectively make PEG glue, PVA glue and polyacrylic acid glue, set aside;

[0037] In the raw material slurry of step (2) gained, add above-me...

Embodiment 2

[0042] The preparation method of the microwave dielectric material described in this embodiment comprises the following steps:

[0043] (1) with CaAlO 4 Based on microwave dielectric material as an example, take CaAlO 4 Adding modified additives to the raw materials of the components for mixing to obtain a mixture, adding water accounting for 60 wt% of the mixture and 0.5 wt% dispersant for mixing, and putting them into a ball mill for ball milling for 3 hours;

[0044] (2) Put the dispersed mixture into the sand mill, use zirconium balls as the grinding medium, grind for 3-8 times, control the solid content of the slurry after grinding between 60%-65%, and obtain the required raw materials slurry;

[0045] (3) Get PEG20000 glue, PVA glue and polyacrylic acid glue, add water respectively and fully dissolve through heating, respectively make PEG glue, PVA glue and polyacrylic acid glue, set aside;

[0046] In the raw material slurry of step (2) gained, add above-mentioned PE...

Embodiment 3

[0051] The preparation method of the microwave dielectric material described in this embodiment comprises the following steps:

[0052] (1) with CaAlO 4 Based on microwave dielectric material as an example, take CaAlO 4 Add modified additives to the raw materials of the components for mixing, and add 60wt% of water and 0.5wt% of dispersant for mixing, and put them into a ball mill for ball milling for 3 hours;

[0053] (2) Put the dispersed mixture into the sand mill, use zirconium balls as the grinding medium, grind for 3-8 times, control the solid content of the slurry after grinding between 60%-65%, and obtain the required raw materials slurry;

[0054] (3) Get PEG20000 glue, PVA glue and polyacrylic acid glue, add water respectively and fully dissolve through heating, respectively make PEG glue, PVA glue and polyacrylic acid glue, set aside;

[0055] In the raw material slurry of step (2) gained, add above-mentioned PEG glue, PVA glue and polyacrylic acid glue successiv...

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Abstract

The invention belongs to the technical field of microwave dielectric materials, particularly relates to a spray granulation method of microwave dielectric powder, and further discloses a preparation method of the microwave dielectric material. According to the spray granulation method of the microwave dielectric material powder, spray granulation treatment is carried out by adopting the mixed gluesolution of the PEG glue, the PVA glue and the polyacrylic acid glue in a proper proportion, and the plasticity of a green body can be effectively improved, the pressing pressure of the green body isreduced and the cracking of the green body is eliminated by utilizing the PEG glue; polyacrylic acid and PVA are matched for use; the viscosity of the slurry can be effectively improved under the condition of high solid content, the strength of the green body is improved, the problem of mold sticking caused by PEG during subsequent dry pressing molding can be effectively solved, the problems of high pressing pressure, easiness in cracking and the like of various microwave dielectric materials during dry pressing molding of porous parts and special-shaped parts can be effectively solved, and the molding performance of spray granulation powder is improved.

Description

technical field [0001] The invention belongs to the technical field of microwave dielectric materials, in particular relates to a spray granulation method of microwave dielectric powder, and further discloses a preparation method of microwave dielectric materials. Background technique [0002] Microwave dielectric ceramics refer to ceramics that are used as dielectric materials in microwave frequency band (mainly UHF, SHF frequency band, 300MHz-300GHz) circuits and perform one or more functions. They have high dielectric constant, low dielectric loss, low Excellent properties such as resonant frequency temperature coefficient, etc., play the functions of dielectric isolation, dielectric waveguide and dielectric resonance in microwave circuits, and are important components of resonators, filters, duplexers, antennas, frequency stabilized oscillators, waveguide transmission lines and other devices Components can be widely used in many fields such as personal portable mobile ph...

Claims

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Application Information

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IPC IPC(8): C04B35/626C04B35/44
CPCC04B35/62695C04B35/44C04B2235/5427C04B2235/5436
Inventor 付清波刘光明杨彬杨月霞
Owner SHANDONG SINOCERA FUNCTIONAL MATERIAL CO LTD
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