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High-performance epoxy resin and preparation method thereof

An epoxy resin, high-performance technology, applied in the field of epoxy resin, can solve the problems of complex POSS improvement method and insufficient performance improvement, and achieve resistance to damage by external force, improvement of limiting oxygen index, good heat resistance and flame retardancy Effect

Active Publication Date: 2020-05-29
厦门市宜帆达新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the prior art, POSS is used in epoxy resin to improve flame retardancy, mechanical strength, heat resistance, etc., and there are still shortcomings such as insufficient performance improvement and complicated improvement methods of POSS.

Method used

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  • High-performance epoxy resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The epoxy resin is composed of the following components: 50 parts of bisphenol A type epoxy resin, 2 parts of benzyl glycidyl ether, 1 part of octagamma-(2,3-glycidoxy) propyl POSS, 3 parts Polyaryl phosphate, 30 parts of active silica powder, 0.6 part of wetting and dispersing agent and 0.6 part of defoamer;

[0028] The curing agent consists of the following components: 3 parts of diaminopropylhexapropyl POSS and 6 parts of diethylenetriamine;

[0029] Bisphenol A type epoxy resin, benzyl glycidyl ether and eight γ-(2,3-epoxypropoxy) propyl POSS are mixed and stirred evenly, and active silica powder is added in three times, stirred and mixed evenly, and polyaromatic base phosphate, wetting and dispersing agent and defoamer, stir and mix evenly, add curing agent composed of diaminopropylhexapropyl POSS and diethylenetriamine, stir evenly, vacuum defoaming, pour into the mold, heat up Curing at 60°C for 20 minutes, raising the temperature to 100°C and curing for 30 min...

Embodiment 2

[0031] The epoxy resin is composed of the following components: 60 parts of bisphenol F type epoxy resin, 3.5 parts of butyl glycidyl ether, 3 parts of tetraepoxyethyl tetravinyl POSS, 4 parts of tert-butylphenyl diphenyl phosphate , 45 parts of wollastonite, 0.9 part of wetting and dispersing agent and 0.8 part of defoamer;

[0032] The curing agent is composed of the following components: 7 parts of diaminopropylhexaphenyl POSS and 10 parts of m-phenylenediamine;

[0033] Bisphenol F type epoxy resin, butyl glycidyl ether and tetraepoxyethyl tetravinyl POSS are mixed and stirred evenly, wollastonite is added in 4 times, stirred and mixed evenly, tert-butylphenyl diphenyl phosphate, moistening Wet dispersant and defoamer, stir and mix evenly, add curing agent composed of diaminopropylhexaphenyl POSS and m-phenylenediamine, stir evenly, vacuum defoaming, pour into the mold, heat up to 50°C and cure for 20 Minutes, the temperature was raised to 90°C and cured for 30 minutes, a...

Embodiment 3

[0035] The epoxy resin is composed of the following components: 80 parts of bisphenol A type epoxy resin, 5 parts of dodecyl glycidyl ether, 5 parts of eight β-(3,4-epoxycyclohexyl) ethyl POSS, 5 parts 1 part of aluminum hydroxide, 60 parts of active silica powder and 1 part of wetting and dispersing agent;

[0036] The curing agent is composed of the following components: 12 parts of aminopropylheptaphenyl POSS and 20 parts of diaminodiphenylmethane;

[0037] Bisphenol A type epoxy resin, dodecyl glycidyl ether and eight β-(3,4-epoxycyclohexyl) ethyl POSS are mixed and stirred evenly, and active silica powder is added in 4 times, stirred and mixed evenly, and hydrogen Alumina and wetting and dispersing agent, stir and mix evenly, add curing agent composed of aminopropyl heptaphenyl POSS and diaminopropyl diphenylmethane, stir evenly, vacuum defoaming, pour into the mold, heat up to 60 Cure for 2 hours, raise the temperature to 150°C and cure for 2 hours, then lower the tempe...

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Abstract

The invention belongs to the technical field of epoxy resin, and especially relates to a high-performance epoxy resin and a preparation method thereof. The high-performance epoxy resin comprises a curing agent and is prepared from the following components in parts by weight: 50-80 parts of an epoxy resin polymer, 1-5 parts of a diluent, 1-5 parts of epoxy polyhedral oligomeric silsesquioxane, 1-5parts of a flame retardant, 30-60 parts of filler and 0.1-2 parts of an auxiliary agent, the curing agent is prepared from the following components in parts by weight: 3-12 parts of amino polyhedral oligomeric silsesquioxane, 0-5 parts of curing accelerator and 6-50 parts of amino curing agent. The epoxy resin provided by the invention has high mechanical strength, heat resistance and flame retardance after being cured.

Description

technical field [0001] The invention belongs to the technical field of epoxy resin, and relates to a high-performance epoxy resin and a preparation method thereof. Background technique [0002] As a traditional polymer material, epoxy resin has the characteristics of chemical resistance, good electrical insulation, and small shrinkage, but it also has disadvantages such as poor heat resistance, poor flame retardancy, and low impact strength. Fostering strengths and offsetting weaknesses is an important research direction in the field of epoxy resin. [0003] Cage polysilsesquioxane (POSS) is a new type of nanomaterial, which can be added to polymers to improve the mechanical properties, heat resistance, flame retardancy, etc. of polymers. There have been many reports on the use of POSS in epoxy resins. [0004] However, in the prior art, POSS is used in epoxy resin to improve flame retardancy, mechanical strength, heat resistance, etc., and there are still shortcomings suc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L83/06C08K3/36C08K3/34C08L85/02C08K5/523C08K3/22C08G59/50
CPCC08L63/00C08G59/504C08G59/5006C08G59/5033C08L2201/02C08L2201/08C08K2003/2227C08L83/06C08L85/02C08K3/36C08K3/34C08K5/523C08K3/22
Inventor 叶锦春
Owner 厦门市宜帆达新材料有限公司
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