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Monocrystalline silicon rod cutting device based on monocrystalline silicon wafer production and method

A technology of single crystal silicon rods and single crystal silicon wafers, applied in the field of single crystal silicon rod cutting devices based on the production of single crystal silicon wafers, can solve the problem that the production process of single crystal silicon wafers cannot continue to be popularized and used, increase the labor intensity of workers, reduce Monocrystalline silicon wafer production efficiency and other issues, to achieve the effect of reducing labor intensity, improving rolling efficiency, and improving production efficiency

Inactive Publication Date: 2020-06-02
张知先
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the cleaning basket and the water are always still, so the monocrystalline silicon wafer needs to be soaked for a long time to clean and completely remove the impurities and waste debris attached to the monocrystalline silicon wafer, which undoubtedly reduces the quality of the monocrystalline silicon wafer. production efficiency
In addition, the monocrystalline silicon wafer needs to be salvaged manually after cleaning, which undoubtedly increases the labor intensity of the workers.
Therefore, the existing production process of monocrystalline silicon wafers cannot continue to be popularized and used.

Method used

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  • Monocrystalline silicon rod cutting device based on monocrystalline silicon wafer production and method
  • Monocrystalline silicon rod cutting device based on monocrystalline silicon wafer production and method
  • Monocrystalline silicon rod cutting device based on monocrystalline silicon wafer production and method

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Embodiment 1

[0049] Embodiment one: if Figure 1~2 As shown, a single crystal silicon rod cutting device based on the production of single crystal silicon wafers, it includes a workbench 1, a through groove 2 opened on the top of the workbench 1, and the top surface of the workbench 1 is located in the through groove 2 A single crystal silicon rod rolling device 3 and a slicing device 4 are respectively provided on the front and rear sides of the workbench 1, and a left clamping device 5 and a right clamping device 6 are respectively provided on the top surface of the workbench 1 and on the left and right sides of the through groove 2 , A single crystal silicon wafer cleaning device is provided directly below the through groove 2 .

[0050] Such as Figure 1~2 As shown, the left clamping device 5 includes a speed reducer 7, a driving pulley 8, a belt 9, a driven pulley 10, a three-jaw chuck I11 and a motor I12, and the speed reducer 7 is fixed on the top surface of the workbench 1 Above,...

Embodiment 2

[0068] Embodiment two: if Figure 11 As shown, a single crystal silicon rod cutting device based on the production of single crystal silicon wafers, the difference between this embodiment and the first embodiment is that it also includes a controller 51, and the controller 51 communicates with the motor I12, the motor II18, the hydraulic cylinder 13. Feed oil cylinder 28, vertical oil cylinder 37, horizontal oil cylinder 23, and longitudinal oil cylinder 24 are electrically connected, and the extension of the piston rod of feed oil cylinder 28, vertical oil cylinder 37, horizontal oil cylinder 23, and longitudinal oil cylinder 24 can be controlled by the controller 51 or retract, and at the same time, it can also control the start or close of the motor I12 and the motor II18, which is convenient for workers to operate and has the characteristics of a high degree of automation.

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Abstract

The invention discloses a monocrystalline silicon rod cutting device based on monocrystalline silicon wafer production. The monocrystalline silicon rod cutting device based on monocrystalline siliconwafer production comprises a workbench (1) and a through groove (2). The through groove (2) is formed in the top of the workbench (1). A monocrystalline silicon rod barrelling device (3) and a slicingdevice (4) are arranged on the top surface of the workbench (1) and located on the front side and the rear side of the through groove (2) correspondingly. A left clamping device (5) and a right clamping device (6) are arranged on the top surface of the workbench (1) and located on the left side and the right side of the through groove (2) correspondingly. A monocrystalline silicon wafer cleaningdevice is arranged under the through groove (2). The invention further discloses a monocrystalline silicon wafer production method. The monocrystalline silicon rod cutting device based on monocrystalline silicon wafer production and the monocrystalline silicon wafer production method have the beneficial effects that the structure is compact, the monocrystalline silicon wafer production efficiencyis greatly improved, the monocrystalline silicon wafer cleaning efficiency is improved, the labor intensity of a worker is reduced, and the operation is easy.

Description

technical field [0001] The invention relates to the technical field of monocrystalline silicon rod slicing applied to photovoltaics, in particular to a single crystal silicon rod cutting device and method based on the production of single crystal silicon wafers. Background technique [0002] As an important semiconductor material, single crystal silicon has good electrical properties and thermal stability, and it has replaced other semiconductor materials soon after it was discovered and utilized. Silicon material has become the most widely used semiconductor material because of its high temperature resistance and radiation resistance, and is especially suitable for making high-power devices. Most integrated circuit semiconductor devices are made of silicon materials. Among the methods for manufacturing silicon single crystals with good performance, the Czochralski method for growing silicon single crystals has relatively simple equipment and processes, and is easy to realiz...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04B28D7/04B28D7/02B28D7/00B24B5/50
CPCB24B5/50B28D5/0058B28D5/0076B28D5/0082B28D5/04
Inventor 张知先
Owner 张知先
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