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Low-viscosity two-component sealant and preparation method thereof

A two-component, sealant technology, used in adhesives, epoxy resins, adhesive types, etc., can solve problems such as reduced heat dissipation performance, corrosion of electronic precision components, short circuits, etc., and is conducive to uniform dispersion and thixotropy. Exponentially high effect

Inactive Publication Date: 2020-06-02
江苏明昊新材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Putting electronic products in a closed environment, equipped with a sealing device can have a certain dust-proof effect, but the heat dissipation performance will be significantly reduced. There is no doubt that long-term heat accumulation will lead to a decline in the working effect of sophisticated integrated circuits. In addition, the water vapor in the atmosphere will also cause corrosion to electronic precision components, and even cause a short circuit and cause a fire

Method used

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  • Low-viscosity two-component sealant and preparation method thereof

Examples

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Effect test

Embodiment 1

[0022] A low-viscosity two-component sealant, including A component and B component, A component includes 100 parts of α, ω-dihydroxypolysiloxane, 35 parts of magnesium oxide, and 5.5 parts of hexamethyldisiloxane , 6 parts of bis(2-ethylhexyl) phthalate; component B includes 7.5 parts of hexamethyldisiloxane, 5 parts of methyltriacetoxysilane, and 7.5 parts of bisphenol A epoxy resin , 2 parts of dibutyltin dilaurate, 10 parts of bis(2-ethylhexyl) phthalate, 8.5 parts of hydrogenated castor oil, and 10 parts of diallyl glycidyl ether.

[0023] The preparation method is as follows: S1) Prepare component A, weigh α, ω-dihydroxypolysiloxane, magnesium oxide, hexamethyldisiloxane and bis(2-ethyl phthalate) in parts by weight Hexa) ester is put into a mixer for dispersion and stirring, the stirring vacuum is 0.08MPa, the stirring temperature is 125°C, the stirring time is 90min, the stirring speed is 500rpm, and the material is discharged and filled to obtain the A component; S2) ...

Embodiment 2

[0025] A low-viscosity two-component sealant, including A component and B component, A component includes 100 parts of α, ω-dihydroxypolysiloxane, 30 parts of magnesium oxide, and 7.5 parts of hexamethyldisiloxane , 12 parts of bis(2-ethylhexyl) phthalate; component B includes 4.5 parts of hexamethyldisiloxane, 1 part of methyltriacetoxysilane, and 2 parts of bisphenol A epoxy resin , 1.5 parts of dibutyl tin diacetate, 8 parts of bis(2-ethylhexyl) phthalate, 10 parts of polyethylene wax, and 10 parts of dodecyl glycidyl ether.

[0026] The preparation method is as follows: S1) Prepare component A, weigh α, ω-dihydroxypolysiloxane, magnesium oxide, hexamethyldisiloxane and bis(2-ethyl phthalate) in parts by weight Hexa) ester was put into a mixer to disperse and stir, the stirring vacuum was 0.095MPa, the stirring temperature was 115°C, the stirring time was 80min, the stirring speed was 550rpm, and the material was discharged and filled to obtain the A component; S2) Prepare ...

Embodiment 3

[0028] A low-viscosity two-component sealant, including A component and B component, A component includes 100 parts of α, ω-dihydroxypolysiloxane, 50 parts of aluminum oxide, γ-[2,3-epoxy 8 parts of propoxy]propyltrimethoxysilane, 8.5 parts of diisononyl phthalate; component B includes 2 parts of γ-[2,3-glycidoxy]propyltrimethoxysilane, methyl 2.5 parts of tributylketoxime silane, 12 parts of bisphenol A epoxy resin, 2.5 parts of dibutyltin dilaurate, 5 parts of diisononyl phthalate, 5 parts of hydrogenated castor oil, ethylene glycol glycidyl ether 20 servings.

[0029] Its preparation method is: S1) Prepare A component, weigh α, ω-dihydroxypolysiloxane, aluminum oxide, γ-[2,3-glycidyloxy]propyltrimethoxysilane by weight parts and diisononyl phthalate, put into a mixer to disperse and stir, the stirring vacuum is 0.09MPa, the stirring temperature is 125°C, the stirring time is 100min, the stirring speed is 550rpm, and the material is discharged and filled to obtain the A com...

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Abstract

The invention discloses a low-viscosity two-component sealant and a preparation method thereof. The low-viscosity double-component sealant is prepared from a component A and a component B, wherein thecomponent A comprises 100 parts of alpha, omega-dihydroxy polysiloxane, 30-50 parts of a filler, 3-8 parts of a silane coupling agent and 2-12 parts of a plasticizer; and the component B comprises 2-10 parts of a silane coupling agent, 1-5 parts of a cross-linking agent, 2-12 parts of epoxy resin, 1-3 parts of a catalyst, 5-10 parts of a plasticizer, 5-10 parts of a thixotropic agent and 10-20 parts of a diluent. According to the invention, the thixotropic agent and the diluents are added into the component B, and through combination of epoxy resin with low viscosity, the component A and thecomponent B are mixed in proportion to form a mixture, the viscosity of the mixture is 3000-4000 mPa.s, the viscosity is low, the thixotropic index is larger than or equal to 1.2, the thixotropic index is high, uniform dispersion of the sealant is facilitated, and meanwhile, the surface drying speed of the sealant is not affected.

Description

technical field [0001] The invention relates to the technical field of sealant materials, in particular to a low-viscosity two-component sealant and a preparation method thereof. Background technique [0002] With the rapid development of the electronics industry, electronic equipment is developing in the direction of miniaturization, high capacity and high performance. With the popularization of electronic products, the protection requirements for electronic products are getting higher and higher, and the application environment of integrated circuits is becoming more and more harsh. Putting electronic products in a closed environment, equipped with a sealing device can have a certain dust-proof effect, but the heat dissipation performance will be significantly reduced. There is no doubt that long-term heat accumulation will lead to a decline in the working effect of sophisticated integrated circuits. In addition, water vapor in the atmosphere can also cause corrosion to e...

Claims

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Application Information

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IPC IPC(8): C09J183/04C09J163/02C09J191/00C09J123/06C09J11/04C09J11/06C09J11/08
CPCC09J183/04C09J11/04C09J11/06C09J11/08C08L2205/03C08K2003/222C08K2003/2227C08K2003/265C08L63/00C08L91/00C08K13/02C08K3/22C08K5/12C08L23/06C08K3/26
Inventor 王晓岚费志刚祝金涛
Owner 江苏明昊新材料科技股份有限公司
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