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Low-temperature conductive silver adhesive for silk-screen printing and preparation method thereof

A technology of screen printing and conductive silver glue, which is used in the manufacture of printed circuits, printed circuits, and the assembly of printed circuits with electrical components. The curing time is short and the effect of meeting the requirements of sintering temperature

Active Publication Date: 2020-06-05
常州烯奇新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The curing temperature of the above-mentioned conductive pastes is relatively high. If the curing temperature is to be properly lowered, the corresponding curing time should be prolonged. However, this may lead to a decrease in conductivity and bring problems such as silver layer falling off or line loss.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Embodiment 1: A low-temperature conductive silver paste for screen printing, comprising the following components by weight: 62 parts by weight of silver powder, 16 parts by weight of mixed resin, 7 parts by weight of curing agent, 1 part by weight of catalyst, and 11 parts by weight of organic solvent , 1 part by weight of coupling agent, 2 parts by weight of additive, wherein, the silver powder is a mixture of flaky silver powder with a particle size of 5 μm and spherical silver powder with a particle size of 200 nm in a weight ratio of 10:1, and the mixed resin is epoxy resin E51 and poly A mixture of ester resins, wherein the weight of epoxy resin accounts for 55% of the total weight of the mixed resin, the curing agent is modified imidazole, the catalyst is polyethylene glycol butyl ether, and the organic solvent is dibutyl phthalate. The agent is an aluminate coupling agent JTW-181, and the additive is a thixotropic agent.

[0021] The above-mentioned low-temperatu...

Embodiment 2

[0026] Embodiment 2: A kind of low-temperature conductive silver paste for screen printing, comprising the following components by weight: 65 parts by weight of silver powder, 13 parts by weight of mixed resin, 6 parts by weight of curing agent, 1.3 parts by weight of catalyst, and 10 parts by weight of organic solvent , 1.5 parts by weight of coupling agent, 3.2 parts by weight of additives, wherein the silver powder is a mixture of flake silver powder with a particle size of 5 μm and spherical silver powder with a particle size of 500 nm according to a weight ratio of 5:1, and the mixed resin is epoxy resin E51 and polyurethane A mixture of resins, wherein the weight of the epoxy resin accounts for 60% of the total weight of the resin, the curing agent is a mixture of dicyandiamide and modified imidazole, the catalyst is polyethylene glycol dimethyl ether, and the organic solvent is diethylene glycol butyl Ether acetate, the coupling agent is silane coupling agent KH560, and ...

Embodiment 3

[0032] Embodiment 3: A kind of low-temperature conductive silver paste for screen printing, comprising the following components by weight: 68 parts by weight of silver powder, 11 parts by weight of mixed resin, 5 parts by weight of curing agent, 1.5 parts by weight of catalyst, and 12.5 parts by weight of organic solvent , 0.5 parts by weight of a coupling agent, and 1.5 parts by weight of an additive, wherein the silver powder is a mixture of flaky silver powder with a particle size of 5 μm and spherical silver powder with a particle size of 300 nm in a weight ratio of 1:5, and the mixed resin is epoxy resin E44 and poly A mixture of ester resins, wherein the weight of epoxy resin accounts for 65% of the total weight of the resin, the curing agent is a modified polyamine, the catalyst is a mixture of polyethylene glycol dimethyl ether and polyethylene glycol butyl ether, and the organic solvent is pine Oleyl alcohol, the coupling agent is silane coupling agent KH560, and the a...

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PUM

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Abstract

The invention belongs to the technical field of conductive silver adhesives, and particularly relates to a low-temperature conductive silver adhesive for silk-screen printing and a preparation methodthereof. The low-temperature conductive silver adhesive is prepared from the following components in parts by weight of 50-70 parts of silver powder, 8-20 parts of mixed resin, 0.5-10 parts of curingagent, 0.05-2 parts of catalyst, 5-16 parts of organic solvent, 0.1-2 parts of coupling agent and 0.3-4 parts of additive, and the mixed resin is the mixture of epoxy resin and polyester resin or polyurethane resin. The conductive silver adhesive disclosed by the invention meets the sintering temperature requirement of a flexible base material with low heat resistance, has better conductivity, andcan be well applied to the field of silk-screen printing.

Description

technical field [0001] The invention belongs to the technical field of conductive silver glue, and in particular relates to a low-temperature conductive silver glue for screen printing and a preparation method thereof. Background technique [0002] In the field of chip packaging and printed circuit boards, soldering techniques are usually used to connect various components and printed wires together. The solder used in this type of soldering process generally contains harmful elements such as lead or tin, which can be harmful to the environment. As a new type of connecting material, conductive adhesive has the advantages of low processing temperature, good conductivity, and little impact on the environment, and has been used more and more in the electronics industry. It is mainly composed of conductive fillers, resins and additives, etc., and has conductive and adhesive properties after heating and curing. Conductive fillers are generally materials such as copper, silver, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00H05K3/32
CPCH01B1/22H01B13/00H05K3/321
Inventor 喻金星汪永彬徐晓翔李洪元刘记林杨军
Owner 常州烯奇新材料有限公司