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Silver-coated copper powder, preparation method thereof, and electronic paste

A technology of silver-coated copper powder and electronic paste, which is applied in the direction of conductive materials, conductive materials, circuits, etc., can solve the problems of reducing the resistivity of silver-coated copper powder, achieve improved coating rate, high conductivity, and inhibit oxidation Effect

Active Publication Date: 2022-03-18
深圳市哈深智材科技有限公司
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Problems solved by technology

[0005] The purpose of the present invention is to provide a preparation method of silver-coated copper powder, aiming at solving the problem of oxides attached to the surface of copper powder in the existing silver-coated copper powder preparation method, which leads to loose silver coating in silver-coated copper powder and reduces the silver-coated copper powder. Technical issues such as resistivity

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  • Silver-coated copper powder, preparation method thereof, and electronic paste
  • Silver-coated copper powder, preparation method thereof, and electronic paste
  • Silver-coated copper powder, preparation method thereof, and electronic paste

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preparation example Construction

[0038] The embodiment of the present invention provides a method for preparing silver-coated copper powder, comprising the following steps:

[0039] S10. Obtain copper powder, mix the copper powder with the first silver ammonia solution and the first reducing agent, add ammonia water, mix and process, and separate to obtain an intermediate product; wherein, the copper powder and the first silver ammonia solution The molar ratio to the first reducing agent is 1.26: (0.06-0.30): (0.05-0.25);

[0040]S20. After the intermediate product is mixed and reacted with the second silver ammonia solution and the second reducing agent, the silver-coated copper powder is obtained by separating; wherein, the molar amount of the copper powder and the second silver ammonia solution and the second reducing agent The ratio is 1.26:(0.06~0.20):(0.02~0.15).

[0041] The preparation method of the silver-coated copper powder provided by the embodiment of the present invention, first, according to t...

Embodiment 1

[0061] A kind of silver clad copper powder, its preparation comprises steps:

[0062] ①Copper powder pretreatment: The purchased copper powder is first ultrasonically cleaned with octylphenol polyoxyethylene ether-10 on micron copper for 5-10 minutes, and repeated ultrasonic cleaning with deionized water three times to remove octylphenol polyoxyethylene ether-10 ; Then use 5% dilute sulfuric acid to ultrasonically clean the micron copper powder for 5-10 minutes to remove the oxide film on its surface, and then use deionized water to repeatedly ultrasonically clean it three times until the washing solution is neutral, and the obtained copper powder is ready for use.

[0063] ② Configuration of silver ammonia solution: Dissolve 4.5g of silver nitrate in 100ml of aqueous solution, and drop ammonia water with a volume fraction of 20% into the silver nitrate solution while stirring, until the precipitate just disappears, and set aside.

[0064] ③ Take 40ml of prepared silver ammoni...

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Abstract

The invention belongs to the technical field of electronic paste, and in particular relates to a method for preparing silver-coated copper powder, comprising the steps of: obtaining copper powder, mixing the copper powder with a first silver-ammonia solution and a first reducing agent, adding ammonia water, mixing treatment, separation to obtain an intermediate product; wherein, the molar ratio of the copper powder to the first silver ammonia solution and the first reducing agent is 1.26: (0.06-0.30): (0.05-0.25); the intermediate product and The second silver ammonia solution and the second reducing agent are mixed and reacted to separate and obtain silver-coated copper powder; wherein, the molar ratio of the copper powder to the second silver ammonia solution and the second reducing agent is 1.26:(0.06~0.20 ): (0.02~0.15). The preparation method of the silver-coated copper powder provided by the invention is simple to operate and is suitable for large-scale industrial production and application. The prepared silver-coated copper powder has high electrical conductivity and a resistivity as low as 1.1×10 ‑5 Ω·cm.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, and in particular relates to a preparation method of silver-coated copper powder, a silver-coated copper powder and an electronic paste. Background technique [0002] With the development of the printed electronics industry, the market for electronic pastes has drawn increasing attention. Because silver has high conductivity and is not easily oxidized, most of the electronic pastes on the market are silver pastes. However, silver paste has the problem of high price and prone to electromigration failure, so people have turned their attention to copper, which has similar conductivity to silver. However, copper is easily oxidized in the air, which reduces the conductivity of the copper paste. The silver-clad copper paste combines the advantages of both, which can not only solve the electromigration problem of silver, but also reduce the cost and improve the oxidation problem of copper. T...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/44B22F1/17B22F1/05B22F9/24H01B1/02H01B13/00
CPCC23C18/44B22F9/24H01B1/026H01B13/00B22F1/17
Inventor 赵维巍傅振邦李康
Owner 深圳市哈深智材科技有限公司
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