A kind of polyimide resin containing furan ring and preparation method thereof
The technology of polyimide resin and furan ring is applied in the field of polyimide resin containing furan ring and its preparation, and can solve the problems of high rigid melt viscosity, high water absorption rate, unsuitability for engineering plastics, and the like, Achieving the effect of high service temperature and thermal stability
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Embodiment 1
[0054] In the present embodiment, the polyimide resin containing furan structure has the following structure:
[0055]
[0056] where n is an integer greater than 0.
[0057] The specific preparation method is: under nitrogen protection, add 1.2414g (4.0mmol) of 2,5-furan bis(methylene ether m-phenylenediamine) and 20ml of N,N-dimethylacetamide into a 50mL reaction flask , stir at room temperature, and after the furan diamine is completely dissolved, add 1.192 g (4.0 mmol) of biphenyltetracarboxylic dianhydride, then dilute the solution to a weight percent concentration of 10%, and continue stirring at room temperature for 24 hours to obtain Viscous polyamic acid solution. Then spread the polyamic acid solution on a glass plate, bake in a common oven at 60°C for 2h, 80°C for 2h, 100°C for 2h, 120°C for 2h, 150°C for 2h, and then in a vacuum oven at 250°C for 2h , 300 ℃ for 2h, and 350 ℃ for 2h to obtain the polyimide film containing furan ring. The glass transition tempe...
Embodiment 2
[0059] In the present embodiment, the polyimide resin containing furan structure has the following structure:
[0060]
[0061] where n is an integer greater than 0.
[0062]The specific preparation method is: under nitrogen protection, add 1.2414g (4.0mmol) of 2,5-furan bis (methylene ether p-phenylenediamine) and 20ml of N,N-dimethylacetamide into a 50mL reaction flask , stirring at room temperature, after the furandiamine containing furan diamine is completely dissolved, then add 1.192g (4.0 mmol) of biphenyltetracarboxylic dianhydride, then dilute the solution to a weight percent concentration of 10%, and continue stirring at room temperature for 24 hours to obtain Viscous polyamic acid solution. Then spread the polyamic acid solution on a glass plate, bake in a common oven at 60°C for 2h, 80°C for 2h, 100°C for 2h, 120°C for 2h, 150°C for 2h, and then in a vacuum oven at 250°C for 2h , 300 ℃ for 2h, and 350 ℃ for 2h to obtain the polyimide film containing furan ring....
Embodiment 3
[0064] In the present embodiment, the polyimide resin containing furan structure has the following structure:
[0065]
[0066] where n is an integer greater than 0.
[0067] The specific preparation method is: under nitrogen protection, add 1.2414g (4.0mmol) of 2,5-furan bis (methylene ether p-phenylenediamine) and 20ml of N,N-dimethylacetamide into a 50mL reaction flask , stir at room temperature, and after the furan diamine is completely dissolved, add 1.192 g (4.0 mmol) of 2,2'3,3'-biphenyltetracarboxylic dianhydride, and then dilute the solution to a concentration of 10% by weight , continue stirring at room temperature for 24 hours to obtain a viscous polyamic acid solution. Then spread the polyamic acid solution on a glass plate, bake in a common oven at 60°C for 2h, 80°C for 2h, 100°C for 2h, 120°C for 2h, 150°C for 2h, and then in a vacuum oven at 250°C for 2h , 300 ℃ for 2h, and 350 ℃ for 2h to obtain the polyimide film containing furan ring. The glass transiti...
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