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Glass core, multilayer wiring substrate, and method for manufacturing glass core

A manufacturing method, glass core technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, including printed capacitors, etc., to achieve the effect of suppressing cracks

Pending Publication Date: 2020-06-26
TOPPAN PRINTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

call this the glass core

Method used

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  • Glass core, multilayer wiring substrate, and method for manufacturing glass core
  • Glass core, multilayer wiring substrate, and method for manufacturing glass core
  • Glass core, multilayer wiring substrate, and method for manufacturing glass core

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0153] according to Figures 6A-6I Manufactured by the manufacturing process shown Figure 5 Glass core 4 shown.

[0154] First, if Figure 6A As shown, a glass panel 1000 (EAGLE XG; manufactured by Corning Co., Ltd.) having a through hole TH having a size of 500 mm×500 mm and a thickness of 200 μm was prepared. The surface roughness of the obtained glass plate 1000 measured by a non-contact interference microscope was 0.5 nm.

[0155] In addition, the diameter of the through-hole TH provided in the glass plate 1000 is 80 μm on one main surface of the glass plate 1000 , and is 60 μm on the other main surface of the glass plate 1000 . However, the diameters are set to be the same in the drawings.

[0156] Next, a 50-nm titanium layer 200A and a 300-nm copper layer 200B were sequentially formed on one main surface of the glass plate 1000 by a sputtering method as the first metal layer 200 .

[0157] Next, if Figure 6B As shown, a photosensitive dry film resist is laminate...

Embodiment 2

[0171] In Example 2, the bath composition of the electroless nickel plating A described in Example 1 was prepared by the same method as in Example 1, except that the pH was set to 9 and the temperature was set to 50°C. the glass core. The plating time was adjusted so that the thickness of the electroless nickel plating layer became 0.1 μm.

[0172] The thickness of the electroless nickel plating layer prepared in this example was measured and found to be 0.1 μm. In addition, the phosphorus content rate of this electroless nickel plating layer was measured by the said method, and the content rate was 1 mass %.

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Abstract

The purpose of this invention is to provide a glass core, a multilayer wiring substrate, and a method for manufacturing a glass core that allows copper wiring to be adequately performed and cracking or the like to be reduced. The glass core 1 comprises: a glass sheet 10; a first metal layer 20 provided on the glass sheet 10; a first electrolytic copper plating layer 30 provided on the first metallayer 20; a dielectric layer 40 provided above the first electrolytic copper plating layer 30; a second metal layer 50 provided on the dielectric layer 40; an electroless nickel plating layer 60 provided on the second metal layer 50, the electroless nickel plating layer 60 having a phosphorus content of less than 5 wt%; and a second electrolytic copper plating layer 70 provided on the electrolessnickel plating layer 60.

Description

technical field [0001] The present invention relates to a glass core, a multilayer wiring board, and a method for manufacturing the glass core. Background technique [0002] In recent years, higher functionality and miniaturization of electronic devices have been advanced, and along with this, higher densities of semiconductor components mounted on electronic devices have been demanded. In order to respond to such demands, studies have been made to increase the wiring density of wiring boards on which semiconductor chips are mounted. [0003] A glass epoxy resin is generally used as a core material contained in a wiring board, but in recent years, a wiring board using a glass plate as a core material has attracted attention. A glass plate can achieve a higher degree of smoothness than a core made of glass epoxy. Therefore, since ultrafine wiring can be formed on a wiring board using a glass plate, high-density mounting can be realized by using a wiring board using a glass ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/16H01L23/12H01L23/15H05K1/09H05K3/46
CPCH01L23/15H01L23/49822H01L23/49827H01L23/49894H05K3/4605H05K3/4644H05K3/108H05K1/162H05K3/388H05K3/422H01L2224/13H05K1/0306H05K3/46H05K1/116H05K1/11H05K1/18
Inventor 土田彻勇起
Owner TOPPAN PRINTING CO LTD