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Packaging paste based on multi-dimensional nano material and preparation method of packaging paste

A technology of nanomaterials and pastes, which is applied in the direction of nanotechnology, nanotechnology, nanotechnology, etc. for materials and surface science. Effects of improving shear strength, mild execution conditions, and simple process

Active Publication Date: 2020-06-30
SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] During the research and development process, it was found that in related technologies, no matter the packaging paste made of gold, silver, copper or other metal materials, the bonding strength and fracture resistance have not been able to meet the needs of use, and those skilled in the art have never been able to find effective solution

Method used

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  • Packaging paste based on multi-dimensional nano material and preparation method of packaging paste
  • Packaging paste based on multi-dimensional nano material and preparation method of packaging paste

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preparation example Construction

[0034] During the research and development and practical application, the applicant found that the sintering effects of nano-metals with different forms are different. The bonding strength is about 9MPa, which is lower than that of the zero-dimensional nanoparticle paste. This is because the ability of nanowires to form an interconnected network during sintering is weaker than that of nanoparticles. After repeated verification by a large number of experiments, based on the size effect and shape effect, the enhancement of low activation energy and high surface energy diffusion at the nanoscale, the sintering temperature is significantly reduced, and the sintering rate is greatly improved. In order to be able to combine different forms of nano-metals such as zero-dimensional nanoparticles, one-dimensional nanowires or nanotubes, and two-dimensional nanosheets and other multi-dimensional nanometals to provide packaging paste materials with better sintering performance. At the sam...

Embodiment 1

[0053] In a preferred embodiment of the present invention 1, the following steps are used to prepare the packaging paste:

[0054] Use dry etching to form a number of holes with a diameter of 10nm on the surface of the nano silver wire and the nano silver sheet, configure the ascorbic acid solution with a mass concentration of 0.5wt%, soak the nano silver particles, the etched nano silver wire and the etched After etching the nano-silver sheet for 24 hours, the mass ratio of the ascorbic acid solution to the above-mentioned nano-silver materials was 5:2; after that, the soaking solution was centrifuged, separated, washed, and dried, and the cleaned nano-silver particles, nano-silver wires, Nano-silver flakes are mixed at a mass ratio of 8:3:4, and the mixed nano-silver material is mixed with adipic acid, phenolic resin, and terpineol at a mass ratio of 0.8:0.05:0.01:0.2, and the mixture is ultrasonicated for 20 minutes, shaken Rotary steaming under reduced pressure for 1 hour ...

Embodiment 2

[0056] In a preferred embodiment of the present invention 2, the following steps are used to prepare the packaging paste:

[0057] Use dry etching to form a number of holes with a diameter of 40nm on the surface of nano silver wires and nano silver sheets, configure a solution of ascorbic acid with a mass concentration of 0.5wt%, soak nano silver particles, etched nano silver wires and etched After etching the nano-silver sheet for 24 hours, the mass ratio of the ascorbic acid solution to the above-mentioned nano-silver materials was 5:2; after that, the soaking solution was centrifuged, separated, washed, and dried, and the cleaned nano-silver particles, nano-silver wires, Nano-silver flakes are mixed at a mass ratio of 8:3:4, and the mixed nano-silver material is mixed with adipic acid, phenolic resin, and terpineol at a mass ratio of 0.8:0.05:0.01:0.2, and the mixture is ultrasonicated for 20 minutes, shaken Rotary steaming under reduced pressure for 1 hour obtained a unifo...

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Abstract

The invention provides packaging paste based on a nano material and a preparation method of the packaging paste. The nano material comprises at least two nano metals with different dimensions, and isprepared by the following steps: step 1, etching holes in the surface of a first nano metal wire and / or a first nano metal sheet to form a second nano metal wire and / or a second nano metal sheet, wherein the diameter of each hole is 10nm-40nm; 2, cleaning the first nano metal particles, the second nano metal wire and / or the second nano metal sheet by adopting a first solvent to obtain second nanometal particles, a third nano metal wire and / or a third nano metal sheet; 3, mixing the second nano metal particles, a third nano metal wire and / or a third nano metal sheet to obtain a first mixture,and mixing the first mixture with a second solvent to obtain a second mixture; and 4, concentrating the second mixture to obtain the packaging paste. The method is simple in process, mild in executioncondition and suitable for large-batch low-cost production.

Description

technical field [0001] The invention relates to the technical field of semiconductor interconnection materials, in particular to a packaging paste based on multidimensional nanomaterials and a preparation method thereof. Background technique [0002] In emerging fields such as flexible electronic packaging, there is a growing demand for lead-free solders. The soldering temperature of traditional Sn-based lead-free solders usually exceeds 200 °C, which is not conducive to flexible packaging on heat-sensitive organic substrates such as polymers and paper. Perform sintered interconnection. [0003] The low-temperature packaging and interconnection process can effectively solve the above technical problems, and some solutions can be realized through the advantages of nano-metal materials in nano-sintering. In the nanosintering process, relying on the driving force from high surface energy, nanomaterials are sintered together by diffusion to form an encapsulation paste. [0004...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B13/00H01B1/02B23K37/00B82Y30/00B82Y40/00
CPCB23K37/00B82Y30/00B82Y40/00H01B1/02H01B13/00
Inventor 唐宏浩张卫红黄显机叶怀宇张国旗
Owner SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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