Resin composition, prepreg containing same and dielectric substrate for antenna

Abstract

The invention provides a resin composition, a prepreg containing the resin composition and a dielectric substrate for an antenna. The resin composition is prepared from the following components: thermosetting resin with unsaturated double bonds, a resin melt viscosity adjusting material, an inorganic nano viscosity adjusting material, hollow microspheres which are not treated by alkali liquor, non-hollow inorganic filler, a flame retardant and an initiator, wherein the mass sum of the resin melt viscosity adjusting material and the inorganic nano viscosity adjusting material accounts for 3-6%of the total mass of the resin composition, and the mass ratio of the resin melt viscosity adjusting material to the inorganic nano viscosity adjusting material is (1-25): 1. The dielectric substrateobtained by adopting the resin composition provided by the invention has the advantages of low dielectric constant, low dielectric loss and excellent consistency of thickness and dielectric constant,and can meet the performance requirements of the dielectric substrate for the low-dielectric-constant antenna.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a resin composition, a prepreg containing it, and a dielectric substrate for an antenna. Background technique [0002] 5G communication technology is the fifth-generation system of mobile communication technology, which is oriented to the needs of mobile communication after 2020 and meets the development needs of mobile Internet and Internet of Everything business. Compared with 4G communication technology, 5G communication technology has faster information transmission rate, stronger spectrum utilization efficiency, lower delay, more reliable information transmission and higher link density, etc. In order to meet the design requirements of wireless communication products in the 5th generation communication era, the product design of MIMO antennas, active antennas, and multilayer board antennas has become an inevitable trend in the 5G era. For the antenna application ...

AI Technical Summary

Problems solved by technology

At the same time, the deviation of thickness will also lead to different resin content, which will directly affect the stability of dielectric constant.

[0005] CN108164834A discloses a resin composition and a film and a circuit board using the resin composition. The resin composition contains EPDM rubber, polybutadiene, organic peroxide and solvent. In the resin composition, the The content of the EPDM rubber is 100 parts by weight, the content of the polybutadiene is 5-30 parts by weight, and the content of the organic peroxide is 0.1-10 parts by weight; in addition, the invention also provides a The film using the resin composition and the circuit board made using the resin composition, although the resin composition of the invention has a lower dielectric constant, its thickness consistency and dielectric constant consistency are poor

US6048807 discloses a resin composition comprising thermosetting polybutadiene or polyisoprene resin, ethylene propylene rubber and optional thermoplastic unsaturated butadiene or isoprene-containing polymer, particle filler, barrier Combustible additives, curing agents and woven or non-woven fabrics, the final obtained circuit substrate has better thermal aging performance and lower dielectric constant, but the thickness uniformity and dielectric constant uniformity of the substrate are not mentioned.

Images