Organic silicon conductive adhesive and preparation method thereof
A technology of silicone and conductive adhesive, which is applied in the field of conductive adhesive, can solve the problems of poor impact resistance, poor weather resistance, and poor heat resistance of conductive adhesive, and achieve the effects of strong bonding strength, good electrical conductivity, and good weather resistance
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Embodiment 1
[0064] At 25°C, add 8 parts of methyl vinyl silicone oil with a viscosity of 300cps, 45 parts of methyl vinyl polysiloxane resin with a viscosity of 12000cps, and 10 parts of white carbon black in the reactor, and then stir at 60°C After cooling to room temperature for 5 hours, continue to add 45 parts of methyl hydrogen-containing polysiloxane, the viscosity is 60 cps, 1 part of inhibitor, the composition is 5-methyl-1-hexyn-3-ol, and 3 parts of tackifier , catalyst 0.1 part, catalyst effective concentration 5000ppm, nano-silver powder 50 parts, nano-silver powder particle size is 100nm, micro-silver powder 200 parts, micro-silver powder particle size is 5 microns, stir for 2 hours, vacuumize for 30 minutes, pass through the grinder after receiving Grind to a fineness below 5 microns.
[0065] The conductive adhesive prepared by this method needs to be stored at low temperature, and the curing condition is 160°C / 5min.
Embodiment 2
[0067] At 25°C, add 5 parts of methyl vinyl silicone oil with a viscosity of 100cps, 50 parts of methyl vinyl polysiloxane resin with a viscosity of 10000cps, and 10 parts of white carbon black in the reaction kettle, and then stir at 60°C After cooling to room temperature for 5 hours, continue to add 50 parts of methyl hydrogen-containing polysiloxane, the viscosity is 60 cps, 1 part of inhibitor, the composition is 5-methyl-1-hexyn-3-ol, and 3 parts of tackifier , catalyst 0.1 part, catalyst effective concentration 5000ppm, 80 parts of nano silver powder, nano silver powder particle size is 100nm, 200 parts of micron silver powder, micron silver powder particle size is 5 microns, stirring for 2 hours, vacuuming for 30 minutes, passing through the grinder after receiving Grind to a fineness below 5 microns.
[0068] The conductive adhesive prepared by this method needs to be stored at low temperature, and the curing condition is 160°C / 5min.
Embodiment 3
[0070] At 25°C, add 7 parts of methyl vinyl silicone oil with a viscosity of 400cps, 60 parts of methyl vinyl polysiloxane resin with a viscosity of 8000cps, and 13 parts of white carbon black in the reactor, and then stir at 70°C 4 hours, cooled to room temperature, continue to add 60 parts of methyl hydrogen polysiloxane, viscosity is 80cps, 2 parts of inhibitor, composition is ethynyl cyclohexanol, 2 parts of tackifier, 0.3 parts of catalyst, effective concentration of catalyst 2000ppm, 100 parts of nano-silver powder, the particle size of nano-silver powder is 150nm, 190 parts of micro-silver powder, the particle size of micro-silver powder is 7 microns, stirring for 3 hours, vacuuming for 45 minutes, after receiving the material, grind it with a grinder until the fineness is less than 5 microns .
[0071] The conductive adhesive prepared by this method needs to be stored at low temperature, and the curing condition is 160°C / 5min.
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Abstract
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