Recovery process of valuable components in waste thick film

A process and thick film technology, applied in the field of recycling valuable metals, can solve the problems of waste of resources, high energy consumption, high risk of recycling operations, and achieve the effect of less exhaust gas emissions and simple process flow

Inactive Publication Date: 2020-07-24
DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the acceleration of the upgrading of electrical products and electronic products, more and more waste electrical and electronic products are produced. If the waste thick film circuits contained in these products are not recycled and reused, it will not only lead to the waste of resources Great waste, but also lead to serious pollution

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] The waste thick film circuit is disassembled from the product by mechanical dismantling, and then the disassembled thick film is leached in the mixed acid solution of nitric acid and sulfuric acid according to the solid-liquid ratio of 1:5 (the nitric acid The volume ratio of sulfuric acid to sulfuric acid is 9:1), and the leaching process is stirred and leached for 5 hours at a reaction temperature of 65°C to separate the thick-film ceramics from the stainless steel; the thick-film ceramic components are dried and ground with a ball mill to obtain ceramic powder, and then The ceramic powder is subjected to hydraulic gravity separation with a gravity separator to obtain a powder containing ruthenium dioxide, and finally the powder containing ruthenium dioxide is treated with hydrofluoric acid and recovered, and the recovery rate of ruthenium dioxide is about 90%.

Embodiment 2

[0037] The waste thick film circuit is disassembled from the product by mechanical disassembly, and then the disassembled thick film is leached in nitric acid according to the ratio of solid to liquid ratio of 1:3. The leaching process is carried out at a reaction temperature of 70°C. Stir and leach for 5 hours to separate the thick-film ceramics from the stainless steel; after drying, the ceramic components are ground with a ball mill to obtain ceramic powder, and then the ceramic powder is subjected to hydraulic gravity separation with a gravity separator to obtain a gold-containing powder. Finally, the gold-containing powder is recovered after treatment with hydrofluoric acid, and the recovery rate of gold is about 83%.

Embodiment 3

[0039] The waste thick film circuit is disassembled from the product by mechanical dismantling, and then the disassembled thick film is leached in the mixed acid solution of nitric acid and sulfuric acid according to the solid-liquid ratio of 1:9 (the nitric acid The volume ratio of sulfuric acid to sulfuric acid is 10:1), and the leaching process is stirred and leached for 15 hours at a reaction temperature of 45°C to separate the thick-film ceramics from the stainless steel; the thick-film ceramic components are dried and ground with a ball mill to obtain ceramic powder, and then The ceramic powder is separated by hydraulic gravity with a gravity separator to obtain platinum-containing powder. Finally, the platinum-containing powder is treated with hydrofluoric acid and recovered. The recovery rate of platinum is about 81%.

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PUM

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Abstract

The invention discloses a recovery process of valuable components in a waste thick film. The recovery process comprises the steps of disassembling a thick film circuit, specifically, the waste thick film circuit is disassembled from a product by a mechanical disassembling method; soaking and separating, specifically, the disassembled thick film circuit is soaked in an acidic medium to separate a metal plate from a thick film ceramic material in the thick film circuit, and a material after separating and removing the metal plate is filtered to obtain an insoluble electronic waste; performing ball milling and sorting, specifically, after the electronic waste is dried, the ball milling is carried out by using a ball mill, and ball-milled powder is separated by hydraulically power and gravityin a gravity mixer to separate the valuable components; and performing acid washing and impurity removal, specifically, the valuable components are recovered after acid treatment. According to the recovery process, a high-temperature alkali fusion method is replaced with a wet method, and the valuable components of the waste thick film are subjected to recycling treatment.

Description

technical field [0001] The invention relates to the technical field of material recovery and recycling, in particular to a process for recovering valuable metals from waste thick-film circuit boards. Background technique [0002] Thick film circuits are developed in response to the miniaturization requirements of electronic products. Thick film circuits are the product of the combination of electronic circuit design technology and thick film process technology. Thick-film circuits are widely used in communication, military, automobile, instrument, computer, industry and other fields. There are a wide variety of products with different structures, which realize the miniaturization, combination and modularization of products. [0003] With the rapid development of science and technology at home and abroad, the rapid development of national defense equipment has greatly promoted the development of hybrid thick film integrated circuits. Today, hybrid thick film integrated circu...

Claims

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Application Information

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IPC IPC(8): C22B7/00C22B11/00
CPCC22B7/006C22B11/046Y02P10/20
Inventor 张晓飞苏冠贤廖玉超孙永涛周嘉念廖潮兴
Owner DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD
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