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A kind of plating solution and application of high temperature resistant and oxidation resistant alloy copper foil

A technology of oxidation resistance and high temperature resistance, which is applied in the field of electroplating, can solve the problems of electrolytic copper foil resistance to chemicals and high temperature resistance and oxidation resistance, and achieve fine coating, high thermodynamic stability, and good high temperature corrosion resistance. Effect

Active Publication Date: 2021-03-09
建滔(连州)铜箔有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, in order to meet the basic requirements in the production of electrolytic copper foil in my country, electrolytic galvanization is mainly used in the surface treatment process of the substrate. The chemical resistance, high temperature resistance and oxidation resistance of the electrolytic copper foil produced are compared with those of copper foil produced in Japan. there is a clear gap

Method used

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  • A kind of plating solution and application of high temperature resistant and oxidation resistant alloy copper foil
  • A kind of plating solution and application of high temperature resistant and oxidation resistant alloy copper foil
  • A kind of plating solution and application of high temperature resistant and oxidation resistant alloy copper foil

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Experimental program
Comparison scheme
Effect test

Embodiment 1-5

[0040] Embodiment 1-5 A kind of high-temperature-resistant oxidation-resistant alloy copper foil plating solution and its preparation method

[0041] Embodiments 1-5 are the components, consumption and electroplating process parameters of the plating solution, as shown in Table 1. Among them, " / " indicates that it does not exist.

[0042] Table 1

[0043] unit Example 1 Example 2 Example 3 Example 4 Example 5 Stannous Sulfate SnSO 4

[0044] The preparation method of the above-mentioned high-temperature-resistant and oxidation-resistant alloy copper foil includes conventional steps such as pickling, roughening, sealing, weak roughening, zinc-tin alloy plating, passivation, water washing, surfactant treatment, and drying. The zinc-tin alloy step adopts the plating solution and electroplating process parameters in the above table, the anode plate is a titanium plate, and a 35-micron high-temperature-resistant and oxidation-resistant alloy copper foil...

Embodiment 6-10

[0055] Embodiment 6-10 A kind of plating solution of high temperature resistance and oxidation resistance alloy copper foil and its preparation method

[0056] The components, consumption and electroplating process parameters of the plating solution are as shown in Table 2. Among them, " / " indicates that it does not exist.

[0057] Table 2

[0058] unit Example 6 Example 7 Example 8 Example 9 Example 10 Stannous Sulfate SnSO 4

[0059] The preparation method of the above-mentioned high-temperature-resistant and oxidation-resistant alloy copper foil includes conventional steps such as pickling, roughening, sealing, weak roughening, zinc-tin alloy plating, passivation, water washing, surfactant treatment, and drying. The zinc-tin alloy step adopts the plating solution and parameters in the above table, the anode plate is a zinc plate, and a 35-micron high-temperature-resistant and oxidation-resistant alloy copper foil is prepared.

Embodiment 11-15

[0068] Example 11-15 A plating solution for high temperature resistant and oxidation resistant alloy copper foil and its preparation method

[0069] The components, consumption and electroplating process parameters of the plating solution are as shown in Table 3. Among them, " / " indicates that it does not exist.

[0070] table 3

[0071] unit Example 11 Example 12 Example 13 Example 14 Example 15 Stannous Sulfate SnSO 4

[0072] The preparation method of the above-mentioned high-temperature-resistant and oxidation-resistant alloy copper foil includes conventional steps such as pickling, roughening, sealing, weak roughening, zinc-tin alloy plating, passivation, water washing, surfactant treatment, and drying. The zinc-tin alloy step adopts the plating solution and parameters in the above table, the anode plate is a titanium plate, and a 35-micron high-temperature-resistant and oxidation-resistant alloy copper foil is prepared.

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Abstract

The invention discloses a high-temperature-resistant and anti-oxidation alloy copper foil plating solution and its application. The plating solution is composed of the following raw materials: stannous sulfate, zinc sulfate, auxiliary additives, brighteners and water; the auxiliary additives are At least two of citric acid, tartaric acid, sodium gluconate, ammonium sulfate, triethanolamine, polyethylene glycol alkyl ether and vanillin; the brightener is peptone and / or gelatin; Application in the preparation of high temperature resistant and oxidation resistant alloy copper foil. The copper foil coating produced by the invention is dense, smooth and bright; the copper foil has high thermodynamic stability, and the zinc-tin alloy coating also has good high-temperature corrosion resistance, and can be used in the manufacture of high-precision printed circuit boards.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a plating solution for a high-temperature-resistant and oxidation-resistant alloy copper foil and an application thereof. Background technique [0002] As one of the basic materials of the electronics industry, electrolytic copper foil is widely used in the electronics industry and plays a very important role in the development of the entire electronics industry. Electrolytic copper foil is a metal copper deposition layer obtained by electrodeposition technology under a certain current density of a suitable electrolyte solution, and is widely used in the production of copper clad laminates (CCL for short) and printed circuit boards (PCB for short). [0003] The quality of electrolytic copper foil is not only related to the raw foil substrate, but also closely related to the surface treatment technology of copper foil. With the development of high-density and multi-layer p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/56C25D3/60C25D7/06
CPCC25D3/565C25D3/60C25D7/0614
Inventor 林家宝
Owner 建滔(连州)铜箔有限公司
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