Low-temperature cured resin and curing process thereof

Abstract

The invention discloses a low-temperature cured resin. The raw materials comprise the following components in parts by weight: 160-170 parts of low-temperature cured polyester gum, 165-170 parts of epoxy resin mixture, 115-125 parts of titanium dioxide, 6-7 parts of a toughening agent, 10-25 parts of a curing agent, 1-5 parts of an accelerant and 6-15 parts of a diluent, wherein the curing agent is prepared from the following raw materials: 40%-50% of 2-ethyl-4-methylimidazole, 24%-36% of oxalic acid, 10%-13% of glutaraldehyde and 20%-30% of polyallylamine. According to the low-temperature cured resin and the curing process thereof, the toughening agent is inserted into a cured product to realize a good dispersion state so that the toughness can be improved, and the elasticity modulus canbe maintained; the 2-ethyl-4-methylimidazole component in the curing agent can be cured at a relatively low temperature to obtain a cured product with excellent heat resistance, and the cured producthas excellent mechanical properties; the curing temperature is low, and rapid curing can be achieved at the temperature of 45-55 DEG C; the produced low-temperature cured resin has lower requirementson the use environment, and is excellent in mechanical property, and the curing process is simple and easy to implement.

Description

technical field [0001] The invention relates to the technical field of low-temperature curing resins, in particular to a low-temperature curing resin and its curing process. Background technique [0002] As a thermosetting resin, resin has good electrical insulation, chemical stability, cohesiveness, processability and other characteristics, so it is widely used in construction, machinery, electronics, aerospace and other fields. However, it contains a large number of epoxy groups inside. After curing, the crosslinking density is high, the internal stress is high, and the mechanical properties of the cured product are poor. Therefore, it is difficult to meet the requirements of engineering technology, and its application is limited. Contents of the invention [0003] The purpose of the present invention is to solve the shortcomings in the prior art, and propose a low-temperature curing resin and its curing process. [0004] In order to achieve the above object, the presen...

AI Technical Summary

Problems solved by technology

However, it contains a large number of epoxy groups inside. After curing, the crosslinking density is high, the internal stress is high, and the mechanical properties of the cured product are poor. Therefore, it is difficult to meet the requirements of engineering technology, and its application is subject to certain restrictions.