Method for cutting propagation of cinnamomum septentrionale alkali-resistant improved variety
A cutting propagation and improved seed technology, which is applied in the field of cutting propagation of Alpinia japonica alkali-resistant fine varieties, can solve the problems such as the cultivation of Alkali Alkali Alkali-resistant fine varieties, the resource of Alkali Alkali Alkali-resistant seeds is on the verge of depletion, the self-propagation time is long, and the like.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0022] Construction of automatic spraying cutting pool: In the nursery of Wuhan Academy of Landscape Sciences, choose a place with sufficient light, flat terrain, good ventilation and convenient drainage to build a cutting pool. Bricks form a cutting pool with a diameter of 15 meters, and an automatic spraying system controlled by time is erected at a height of 1 meter above the middle of the cutting pool in the long direction; there is no sunshade net on the top, and it is under full light conditions.
[0023] Cutting substrate: spread a mixed substrate of Muhuangsha: peat: perlite = 5:3:2 (volume ratio) in the built cutting pool, and the laying thickness is 20cm. Use 600 times potassium permanganate solution to spray and disinfect the cutting substrate, and cover it with a plastic film for 3 days to kill the bacteria, then uncover the film for 3 days, and then cut the cutting after the drug volatilizes. Irrigate with water twice before cutting to make the substrate absorb en...
PUM
![No PUM](https://static-eureka.patsnap.com/ssr/23.2.0/_nuxt/noPUMSmall.5c5f49c7.png)
Abstract
Description
Claims
Application Information
![application no application](https://static-eureka.patsnap.com/ssr/23.2.0/_nuxt/application.06fe782c.png)
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com