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Copper-clad plate and preparation method thereof

A copper-clad laminate and inorganic filler technology, applied in chemical instruments and methods, paper/cardboard layered products, synthetic resin layered products, etc., can solve the problem of limited material use temperature and application range, reduced electrical performance, and inability to adapt to high-end markets And other problems, to achieve the effect of good machining performance, good reliability, high tracking index

Pending Publication Date: 2020-10-30
重庆德凯实业股份有限公司
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The Tg of the material refers to the key temperature at which the polymer changes from a hard glass state at room temperature to a soft rubber state during heating. When the material is below the Tg temperature, it behaves as a hard solid state and has some mechanical strength. When the material is at the Tg temperature When above, the molecular chain segment starts to move, the material softens, showing the characteristics of high elastic state, at the same time, the specific volume, specific heat, insulation and dielectric loss will all change greatly, and the electrical performance will also be greatly reduced. If the Tg of the material If it is too low, it will greatly limit the use temperature and application range of the material, and cannot meet the needs of the high-end market

Method used

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  • Copper-clad plate and preparation method thereof
  • Copper-clad plate and preparation method thereof

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preparation example Construction

[0032] The present application also provides a method for preparing a copper clad laminate, which specifically includes the following steps:

[0033] Glue compounding: Stir 70-90 parts of solvent and 350-450 parts of brominated epoxy resin in a beaker according to parts by weight. After stirring evenly, continue to add 7-10 parts of dicyandiamide and 0.1-0.25 parts of curing accelerator , 35-60 parts of inorganic filler and 0.5-1 part of silane, stirred until completely dissolved to form a prepreg;

[0034] Impregnation: pour the compounded glue into the impregnation tank, impregnate the above-mentioned prepreg with glass cloth, and bake at 160-220°C for 3-10 minutes; put a layer of glass cloth or Laminate multiple layers together, and finally cover both sides of the laminated glass cloth with copper foil, and press 8 to 12 pieces of kraft paper at 0.4 to 3.7 MPa and 130 to 195°C for 120 to 160 minutes to obtain a laminated glass cloth. Copper foil laminate samples.

[0035]...

Embodiment 1

[0049]The raw material composition of the copper clad laminate includes: 70 parts of dimethylformamide and 350 parts of brominated epoxy resin are stirred in a beaker, and after stirring evenly, continue to add 7 parts of dicyandiamide, 0.1 part of 2-methyl Imidazole, 28 parts of aluminum hydroxide, 7 parts of zinc borate and 0.5 part of silane were stirred until they were completely dissolved to form a prepreg. In this embodiment, the particle size of the inorganic filler was selected to be 3um.

[0050] Pour the compounded glue solution into the impregnation tank, impregnate the above prepreg with glass cloth, and bake it at 160°C for 9 minutes; stack the baked glass cloths one by one, and finally put the laminated The laminated glass cloth is covered with copper foil on both sides, and pressed together with 9 pieces of kraft paper at 0.7MPa and 150°C for 150min to obtain a copper-clad laminate sample.

[0051] Test: Take out the laminate and test according to each test meth...

Embodiment 2

[0053] The raw material composition of the copper clad laminate includes: 80 parts of dimethylformamide and 400 parts of brominated epoxy resin are stirred in a beaker, and after stirring evenly, 8.6 parts of dicyandiamide and 0.17 parts of 2-methyl Imidazole, 35 parts of aluminum hydroxide, 5 parts of zinc borate and 0.7 part of silane were stirred until they were completely dissolved to form a prepreg. In this embodiment, the particle size of the inorganic filler was selected to be 14um.

[0054] Pour the compounded glue solution into the impregnation tank, impregnate the above prepreg with glass cloth, and bake it at 190°C for 8 minutes; stack the baked glass cloths one by one, and finally put the laminated The laminated glass cloth is covered with copper foil on both sides, and pressed together with 10 pieces of kraft paper at 3.5MPa and 140°C for 140min to obtain a copper-clad laminate sample.

[0055] Test: Take out the laminate and test according to each test method, an...

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Abstract

The invention discloses the raw material composition of a copper-clad plate and a preparation method of the copper-clad plate. The copper-clad plate is prepared from the following raw materials in parts by weight: 350-450 parts of brominated epoxy resin, 7-10 parts of dicyandiamide, 0.1-0.25 part of a curing accelerator, 70-90 parts of a solvent, 35-60 parts of an inorganic filler and 0.5-1 part of silane. The copper-clad plate prepared by the method has high glass-transition temperature and good machining performance, so the copper-clad plate has good reliability in the application aspect ofa circuit board; and the copper-clad plate has high tracking index, and can well meet the requirement of a PCB on the machining performance of the copper-clad plate.

Description

technical field [0001] The invention relates to the technical field of copper clad laminate preparation, in particular to a copper clad laminate and a preparation method thereof. Background technique [0002] Copper Clad Laminate (CCL) is the main material for the manufacture of printed circuit boards (PCBs), and is therefore an indispensable basic electronic material for any electronic product. With the rapid development of the PCB industry, the market demand for high-performance copper clad laminates is increasing day by day. Value) and other properties have attracted much attention, the toughness of the material, PCB processability, and adhesion have also become a focus of attention. The balanced development of the performance of the copper clad laminate substrate has become an important development trend for the development of new copper clad laminate materials. [0003] Today's electronic products are light, thin, short, small and digital, miniaturization, multi-functi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/22C08K3/38C08K5/54C08K7/14C08K13/04C08J5/24B32B17/04B32B17/06B32B27/04B32B15/12B32B15/14B32B15/20B32B29/06B32B37/06B32B37/10
CPCC08J5/24B32B5/02B32B15/12B32B15/14B32B15/20B32B29/002B32B29/06B32B37/06B32B37/10C08J2363/00C08K2003/2227C08K2003/387C08K5/54C08K7/14C08K13/04C08K2201/003B32B2260/021B32B2260/046
Inventor 王顺程廖浩施忠仁尹立孟曹磊磊
Owner 重庆德凯实业股份有限公司
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