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A kind of preparation method of metal material surface deformation layer transmission electron microscope sample

A technology for TEM samples and metal materials, which is applied in the field of metal material TEM sample preparation, can solve the problems of low cost and difficulty in preparing TEM samples on the surface of metal materials by electrochemical double-spray method, and achieves low cost and a preparation process. Simple and efficient results

Active Publication Date: 2022-07-12
ANHUI POLYTECHNIC UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the above-mentioned defects, the present invention provides a method for preparing a transmission electron microscope sample of a deformed layer on the surface of a metal material, which solves the problem that it is difficult to prepare a transmission electron microscope sample of a deformed layer on the surface of a metal material by the electrochemical double-spray method, and effectively ensures that the double-spray thinning area is generated in the material In surface deformation, the preparation process of this method is simple and easy, with high efficiency and low cost

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  • A kind of preparation method of metal material surface deformation layer transmission electron microscope sample
  • A kind of preparation method of metal material surface deformation layer transmission electron microscope sample

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Experimental program
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Effect test

Embodiment 1

[0023] (1) From the surface-treated pure copper plate, cut a 10x10mm square by wire cutting, and carry out alkali washing, acid washing and activation treatment;

[0024] (2) The activated square sample is placed in the electroplating tank, and the outer cladding layer is electroplated. The electroplating solution formula is CuSO4 aqueous solution, the Cu2+ concentration is about 80g / ml, and the pH value is about 4; pure copper plate is used as the anode plate. , constant current control, current density 35mA / cm2, room temperature electroplating, electromagnetic stirring.

[0025] (3) Cutting and grinding: EDM wire cutting is used, perpendicular to the treated surface, with a thickness of 1mm. Using sandpaper, mechanically grind to a thickness of 60 μm.

[0026] (4) Electrochemical polishing corrodes the electroplating interface: Hold the ground sheet sample with pointed stainless steel tweezers, connect the tweezers to the positive electrode of the DC power supply, electropo...

Embodiment 2

[0032] (1) From the surface-treated copper-aluminum alloy (Cu-11w.t.%Al) board, cut 8x8mm squares by wire cutting, and carry out alkali washing, acid washing and activation treatment;

[0033] (2) Place the activated square sample in the electroplating pool to carry out electroplating outer coating; the electroplating solution formula is CuSO4 aqueous solution, the Cu2+ concentration is about 60g / ml, and the pH value is about 3; the pure copper plate is used as the anode plate, Constant current control, current density 25mA / cm2, room temperature electroplating, electromagnetic stirring;

[0034] (3) Cutting and grinding: EDM wire cutting is used, perpendicular to the treated surface, thin slices with a thickness of 1mm, and sandpaper is used to mechanically grind to a thickness of 80μm;

[0035] (4) Electrochemical polishing corrodes the electroplating interface: Use pointed stainless steel tweezers to hold the ground sheet sample, connect the tweezers to the positive electrod...

Embodiment 3

[0041] (1) From the surface-treated IF steel plate, cut a 5x5mm square by wire cutting, and carry out alkali washing, acid washing and activation treatment;

[0042] (2) The activated square sample is placed in the electroplating tank, and the outer coating is electroplated; the formula of the electroplating solution is CuSO4 aqueous solution, the Cu2+ concentration is about 50g / ml, and the pH value is about 3; the pure copper plate is used as the anode plate, Constant current control, current density 30mA / cm2, room temperature electroplating, electromagnetic stirring;

[0043] (3) Cutting and grinding: EDM wire cutting is used, perpendicular to the treated surface, thin slices with a thickness of 1mm, and sandpaper is used to mechanically grind to a thickness of 100μm;

[0044] (4) Electrochemical polishing corrodes the electroplating interface: Use pointed stainless steel tweezers to hold the ground sheet sample, connect the tweezers to the positive electrode of the DC power...

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Abstract

The invention provides a method for preparing a transmission electron microscope sample of a surface deformation layer of a metal material. The specific preparation process includes material preparation, electroplating outer cladding, mechanical cutting and grinding, electropolishing and corroding the interface, marking the punching position, punching, and mechanical grinding. , Electrochemical double spray 8 preparation steps, used to prepare TEM samples of the surface deformation layer of metal materials, and can effectively control the position of the thin area of ​​the transmission sample. The method of the invention has the advantages of simple and easy preparation process, high efficiency and low cost, solves the problem that the electrochemical double spray method is difficult to prepare the TEM sample of the surface deformation layer of the metal material, and effectively ensures that the double spray thin area is generated in the deformation of the material surface.

Description

technical field [0001] The patent of the present invention discloses a method for preparing a TEM sample of a metal material surface deformation layer, which belongs to the field of metal material TEM sample preparation, and particularly relates to a TEM sample preparation technology for a surface nanocrystalline layer prepared by plastic deformation on the surface of copper and copper alloys. Background technique [0002] The plastic deformation technology on the surface of metal materials is one of the important technical methods to refine the microstructure of the surface layer of metal materials and realize surface strengthening and surface modification. In order to ensure the quality of processing and preparation, it is often necessary to observe the microstructure of the prepared surface deformation layer. Transmission electron microscopy is an effective means to observe the microstructure of metal materials, and the preparation of high-quality TEM samples is the most ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N1/32
CPCG01N1/32
Inventor 龙建周商莉
Owner ANHUI POLYTECHNIC UNIV