Subminiature radial glass packaging thermistor and manufacturing method thereof

Abstract

The invention provides a manufacturing method of a subminiature radial glass packaged thermistor. The method comprises the following steps: S1, arranging two lead wires on a porcelain column in a penetrating manner, and enabling the two lead wires to be flush and exposed out of the porcelain column; S2, exposing one end of each of the two lead wires out of the porcelain column to be stained with silver paste; S3, filling a thermosensitive chip between the two lead wires, connecting two electrode ends of the thermosensitive chip with the silver paste adhering ends of the leads respectively, andsintering to form a semi-finished product; S4, preparing glass slurry, and coating the surface of the semi-finished product in S3 with the glass slurry; S5, heating and drying, so that the glass slurry on the surface is preliminarily cured; S6, performing low-temperature sintering on the preliminary cured product obtained in S5 at 450 DEG C to form a thermistor semi-finished product with a glasslayer; and S7, selecting two PI tubes soaked in a PI liquid, respectively installing the PI tubes on the lead wires of the semi-finished thermistor in S5, enabling one end of each PI tube to enter thethrough hole of the porcelain column, and then heating to cure the PI liquid to obtain a finished thermistor. The manufactured product can adapt to smaller sizes, and is low in cost, good in sealingperformance and high in external force resistance strength.

Description

technical field [0001] The invention relates to a glass-encapsulated thermistor, in particular to an ultra-small radial glass-encapsulated thermistor and a manufacturing method thereof. Background technique [0002] With the continuous expansion of the application field of thermistors, the continuous development of miniaturization trends and the diverse needs of people for thermistor processing methods, NTC thermistors with traditional radial glass package structures will face extremely severe challenges. The radial glass encapsulation method has entered a new technical bottleneck. The thermistor of the traditional radial glass package structure is packaged in a glass bulb (such as figure 1 As shown, 10-1, 10-2 leads, 10-1, 10-2 silver paste, 30 thermal chip, 40 glass paste), the size of the thermistor after packaging is affected by the size of the glass bulb of each manufacturer on the one hand, The package size is relatively fixed (usually φ2.0mm, φ1.5mm, φ1.3mm, etc.), ...

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Problems solved by technology

And as the volume of the head glass becomes smaller, the strength of the external force decreases, the distance between the two leads gradually decreases, and the electrical gap between the two leads decreases. In the process of production and application, the risk of glass layer cracking and the risk of shorting the leads are prone to occur, resulting in product failure. Quality risk and production difficulty

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