Subminiature radial glass packaging thermistor and manufacturing method thereof

A thermistor and glass encapsulation technology, applied in the direction of resistors with negative temperature coefficients, etc., can solve problems such as the reduction of the electrical gap between the two leads, the reduction of external force resistance, and the risk of product quality, so as to avoid the thinning of the glass layer and reduce the risk of product quality. Small internal stress, good uniformity

Active Publication Date: 2020-12-04
XIAOGAN HUAGONG GAOLI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

And as the volume of the head glass becomes smaller, the strength of the external force decreases, the distance between the two leads gradually decreases, and the electrical gap between the two leads decreases. In the process of production and application, the risk of glass layer cracking and the risk of shorting the leads are prone to occur, resulting in product failure. Quality risk and production difficulty

Method used

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  • Subminiature radial glass packaging thermistor and manufacturing method thereof
  • Subminiature radial glass packaging thermistor and manufacturing method thereof

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Experimental program
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preparation example Construction

[0040] The preparation method of glass paste in S4 is:

[0041] S41. Weigh 200-230g of glass powder, 2-3g of sodium hexametaphosphate, 76-78g of binder, and 60-63g of organic solvent, and mix evenly. The organic solvent is a mixture of n-propyl acetate and isobutanol;

[0042] S42. Put the mixed material in S41 in a container and add zirconium balls of 1 / 3-1 / 2 volume of the container, then seal it and use a ball mill to stir and mix evenly, and then use a 200-mesh gauze to sieve to separate the zirconium balls and glass slurry.

[0043] Glass powder is used as the main raw material in the glass paste raw material, and a small amount of binder is added to ensure that the glass paste can be better adsorbed on the surface after spraying on the surface of the ultra-small glass-encapsulated NTC thermistor. At the same time, adding sodium hexametaphosphate can The glass powder is fully and uniformly dispersed in the solvent, which not only ensures the flatness of the glass layer on ...

Embodiment 1

[0052] S1. Thread two Dumagnesian wires into the cylindrical alumina ceramic column. The heads of the two Dumagnesian wires are flush and expose the outer length of the ceramic column by 1mm;

[0053] S2. Expose two Du magnesium wires to the end of the porcelain column and dip it in silver paste;

[0054] S3. Fill the thermosensitive chip between the two Du magnesium wires, connect the two electrode terminals of the thermistor with the silver-coated ends of the two Du magnesium wires, and form a semi-finished product after sintering at a high temperature of 100°C;

[0055] S4, preparing glass paste, and coating the glass paste on the surface of the semi-finished product in S3;

[0056] Wherein the glass slurry preparation process:

[0057] S41, 200g glass powder is mixed with 2g sodium hexametaphosphate and 76g binding agent with 60g solvent (n-propyl acetate and isobutanol mixture);

[0058] S42. Put the mixed material in S41 in a container and add zirconium balls of 1 / 3-1 / ...

Embodiment 2

[0063] S1. Thread two Dumagnesian wires into the cylindrical alumina ceramic column. The heads of the two Dumagnesian wires are flush and expose the outer length of the ceramic column by 1mm;

[0064] S2. Expose two Du magnesium wires to the end of the porcelain column and dip it in silver paste;

[0065] S3. Fill the thermosensitive chip between the two Du magnesium wires, connect the two electrode terminals of the thermistor with the silver-coated ends of the two Du magnesium wires, and form a semi-finished product after sintering at a high temperature of 100°C;

[0066] S4, preparing glass paste, and coating the glass paste on the surface of the semi-finished product in S3;

[0067] Wherein the glass slurry preparation process:

[0068] S41, 210g glass powder is mixed with 2.3g sodium hexametaphosphate and 77g binder with 61g solvent (n-propyl acetate and isobutanol mixture);

[0069] S42. Put the mixed material in S41 in a container and add zirconium balls of 1 / 3-1 / 2 con...

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Abstract

The invention provides a manufacturing method of a subminiature radial glass packaged thermistor. The method comprises the following steps: S1, arranging two lead wires on a porcelain column in a penetrating manner, and enabling the two lead wires to be flush and exposed out of the porcelain column; S2, exposing one end of each of the two lead wires out of the porcelain column to be stained with silver paste; S3, filling a thermosensitive chip between the two lead wires, connecting two electrode ends of the thermosensitive chip with the silver paste adhering ends of the leads respectively, andsintering to form a semi-finished product; S4, preparing glass slurry, and coating the surface of the semi-finished product in S3 with the glass slurry; S5, heating and drying, so that the glass slurry on the surface is preliminarily cured; S6, performing low-temperature sintering on the preliminary cured product obtained in S5 at 450 DEG C to form a thermistor semi-finished product with a glasslayer; and S7, selecting two PI tubes soaked in a PI liquid, respectively installing the PI tubes on the lead wires of the semi-finished thermistor in S5, enabling one end of each PI tube to enter thethrough hole of the porcelain column, and then heating to cure the PI liquid to obtain a finished thermistor. The manufactured product can adapt to smaller sizes, and is low in cost, good in sealingperformance and high in external force resistance strength.

Description

technical field [0001] The invention relates to a glass-encapsulated thermistor, in particular to an ultra-small radial glass-encapsulated thermistor and a manufacturing method thereof. Background technique [0002] With the continuous expansion of the application field of thermistors, the continuous development of miniaturization trends and the diverse needs of people for thermistor processing methods, NTC thermistors with traditional radial glass package structures will face extremely severe challenges. The radial glass encapsulation method has entered a new technical bottleneck. The thermistor of the traditional radial glass package structure is packaged in a glass bulb (such as figure 1 As shown, 10-1, 10-2 leads, 10-1, 10-2 silver paste, 30 thermal chip, 40 glass paste), the size of the thermistor after packaging is affected by the size of the glass bulb of each manufacturer on the one hand, The package size is relatively fixed (usually φ2.0mm, φ1.5mm, φ1.3mm, etc.), ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C7/04
CPCH01C7/04
Inventor 阳星易敏赵大春
Owner XIAOGAN HUAGONG GAOLI ELECTRONICS
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